Abstract: In an apparatus for storing articles, bins have a sensor for detecting the presence of an article in a bin and an optical code reader for reading a bar code on the article. The presence detector and the optical code reader are coupled to a circuit which provides an indication of the identity and location of a coded article. The apparatus is particularly well suited for use in the manufacture of semiconductor devices, when wafer cassette boxes are provided with a suitable bar code. Alternatively, the bins may be disposed upon a remotely guided vehicle, thereby making the apparatus useful in an automated manufacturing process.

Abstract: Magnetic bubble chips are packaged along with X, Y and Z magnetic field generating means. The package is comprised of a metal lead frame upon which a magnetic bubble chip such as a memory chip device is mounted. Connectors are utilized to connect terminal pads on the bubble memory device to selected lead frame conductors. The lead frame includes selectively positioned terminal conductors which provide exterior terminals for X and Y magnetic field generating coils. The lead frame is plastic encapsulated with the plastic being formed to completely seal the magnetic bubble chip and connectors while providing mechanical support channels for X and Y magnetic field coils. Openings are provided in the plastic within the channels parallel to the plane of the lead frame on opposite sides thereof exposing the selectively positioned conductors so that the coils are electrically connected to the lead frame terminal conductors.

Abstract: An electronic watch module is fabricated by mounting a semiconductor integrated circuit chip on a metal lead frame. Connectors are utilized to connect the circuit to selected lead frame conductors. The semiconductor chip incorporates all of the electronic circuitry necessary to drive a display with decoded timekeeping signals. The lead frame includes selectively positioned conductors for connection of a display, a variable capacitor, oscillator crystal and battery contacts. The lead frame is plastic encapsulated with the plastic being formed to completely seal the integrated circuit and connectors while providing mechanical support cavities for the display, capacitor, crystal and batteries. Openings are also provided in the plastic within the cavities and opposite the cavity formations exposing the selectively positioned conductors so that the display, capacitor and crystal may be electrically connected to the lead frame.

Abstract: A self-encased electronic watch is fabricated by mounting a semiconductor integrated circuit chip on a metal lead frame. Connectors are utilized to connect the circuit to selected lead frame conductors. The semiconductor chip incorporates all of the electronic circuitry necessary to drive a display with decoded timekeeping signals. The lead frame includes selectively positioned conductors for connection of a display, a variable capacitor, oscillator crystal and battery contacts. The lead frame is plastic encapsulated with the plastic being formed to completely seal the integrated circuit and connectors while providing a ridged mechanical support cavity on the front surface for the display annd filter lens and mechanical support cavities on the back surface for the capacitor, crystal and batteries.