Patents by Inventor James Gill Shook

James Gill Shook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040148959
    Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.
    Type: Application
    Filed: August 18, 2003
    Publication date: August 5, 2004
    Applicant: Cooligy, Inc.
    Inventors: Mark Munch, Kenneth Goodson, David Corbin, Shulin Zeng, Thomas W. Kenny, James Gill Shook
  • Patent number: 6764875
    Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid sealing region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: July 20, 2004
    Assignee: Silicon Light Machines
    Inventor: James Gill Shook
  • Publication number: 20040112571
    Abstract: A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
    Type: Application
    Filed: October 30, 2003
    Publication date: June 17, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, Dave Corbin, Mark McMaster, James Lovette, James Hom
  • Publication number: 20040104022
    Abstract: A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
    Type: Application
    Filed: May 16, 2003
    Publication date: June 3, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, David Corbin
  • Publication number: 20040104010
    Abstract: A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
    Type: Application
    Filed: May 16, 2003
    Publication date: June 3, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, David Corbin
  • Publication number: 20040101421
    Abstract: An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated.
    Type: Application
    Filed: September 23, 2003
    Publication date: May 27, 2004
    Inventors: Thomas W. Kenny, James Gill Shook, Shulin Zeng, Daniel J. Lenehan, Juan Santiago, James Lovette
  • Patent number: 6646778
    Abstract: An optical MEM device is encapsulated with a dampening gas to reduce oscillatory vibrations of movable parts during the operation of the device. Preferably, the dampening gas comprises one or more noble gases, such as neon and/or krypton with a partial pressure in a range of 50 to 100% of the total dampening gas pressure. In further embodiments, the dampening gas comprises a mixture of one or more noble gases and an inert carrier gas, such as nitrogen. Preferably, the optical MEM device is sealed within a die with a dampening gas pressure between 0.5 to 3.0 atmospheres at 20 degree Celsius. The current invention is particularly useful for reducing oscillatory vibrations of optical MEM devices having a plurality of movable ribbon structures configured to modulate light with one or more wavelengths in the near infrared (800 to 4000 nanometers) and which operate at high switching rates (4-40 Volts/nano second) and at high switching frequencies (1 kHz and greater).
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: November 11, 2003
    Assignee: Silicon Light Machines
    Inventors: Chris Gudeman, James Gill Shook
  • Publication number: 20030025984
    Abstract: A grating light valve with a plurality of spaced and movable ribbons attached to a substrate surface is sealed within a die structure containing a dampening gas. The tops of the ribbons and the regions of the substrate between the ribbons are reflective. The ribbons move toward and away from the substrate to constructively and destructively interfere with an incident light source having a wavelength &lgr;. In accordance with the invention, the ribbons and the substrate surfaces are sealed within a die structure that contains a dampening gas. Preferably, the dampening gas is a Neon or a Krypton-based gas with a Neon partial pressure in a range of 50 to 100% of the total dampening gas pressure. The Neon-based damping gas is sealed within the die structure such that the total pressure within the sealed die is between 0.5 to 3.0 atmospheres at 20 degree Celsius.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 6, 2003
    Inventors: Chris Gudeman, James Gill Shook
  • Patent number: 6303986
    Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid scaling region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.
    Type: Grant
    Filed: July 29, 1998
    Date of Patent: October 16, 2001
    Assignee: Silicon Light Machines
    Inventor: James Gill Shook
  • Publication number: 20010022382
    Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid sealing region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.
    Type: Application
    Filed: May 24, 2001
    Publication date: September 20, 2001
    Inventor: James Gill Shook