Patents by Inventor James Kelly

James Kelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11069564
    Abstract: A technique relates to a semiconductor device. Mandrels are formed on a substrate, the mandrels including a first metal layer. A second metal layer is formed on the substrate adjacent to the first metal layer, the first and second metal layers being separated by spacer material.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: July 20, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hsueh-Chung Chen, Yongan Xu, Yann Mignot, James Kelly, Lawrence A. Clevenger
  • Patent number: 11049844
    Abstract: A semiconductor wafer includes a first substrate and a first etch stop layer formed on the first substrate. The etch stop layer has an opening. The semiconductor wafer further includes a second substrate and a second etch stop layer formed on the second substrate. The first substrate is bonded on top of the second substrate such that the first etch stop layer is positioned between the first substrate and the second substrate. A trench is formed in the opening.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: June 29, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ravi K. Bonam, Mukta Ghate Farooq, Dinesh Gupta, James Kelly, Kamal K. Sikka, Joshua M. Rubin
  • Publication number: 20210167508
    Abstract: A wireless data transmission apparatus is disclosed, comprising one or more antennas for transmitting data as polarised electromagnetic radiation, and polarisation control means for controlling an axial ratio and a tilt angle of the polarised electromagnetic radiation such that the axial ratio and tilt angle conveys information about the data being transmitted. A corresponding wireless data receiving apparatus is also disclosed. In some embodiments, the one or more antennas comprises a patch antenna, and the polarisation means may comprise a mechanism for varying an electrical length of the angled slot. By utilising the tilt angle and axial ratio of polarised electromagnetic radiation to convey information to the receiver, the spectral efficiency of the system can be increased. A further increase in spectral efficiency may be obtained by using the polarisation control means to modulate first and second carrier waves, and transmitting different data on the first and second carrier waves.
    Type: Application
    Filed: July 25, 2019
    Publication date: June 3, 2021
    Applicant: University of Surrey
    Inventors: Pei XIAO, Timothy BROWN, James KELLY, Yasin KABIRI ISFAHANI, Rahim TAFAZOLLI
  • Patent number: 11016368
    Abstract: The Tripod Cover is made of fabric with the purpose of covering a tripod. Tripods are often a hot spot in video production causing a dilemma for producers. When the tripod is covered distractions to the video production like tripods and cords are no longer seen, and the whole camera unit blends in with its environment.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: May 25, 2021
    Inventor: Aaron James Kelly
  • Publication number: 20210143022
    Abstract: A method of forming a planarized integration structure is provided. The method includes forming at least two conductive pillars on a packaging substrate, wherein the packaging substrate has a positive or convex meniscus shape. The method further includes placing a bridging die on the packaging substrate between an adjacent pair of the at least two conductive pillars, wherein the bridging die includes one or more conductive interconnects. The method further includes forming a cover layer on the substrate over the at least two conductive pillars and the bridging die, and planarizing the conductive pillars and the one or more conductive interconnects.
    Type: Application
    Filed: November 8, 2019
    Publication date: May 13, 2021
    Inventors: Mukta Ghate Farooq, James Kelly
  • Publication number: 20210129844
    Abstract: Techniques for operating an autonomous follower vehicle that is following a leader vehicle. A desired path to be traversed by the follower may be determined from a Leader Follower Relative Pose (LFRP) derived from sensor data. A pursuit pose is derived along the desired path from the present leader pose, such as either interpolating backward or forward. As a result, the pursuit distance no longer needs to be the same as the distance derived solely from the LFRP.
    Type: Application
    Filed: October 15, 2020
    Publication date: May 6, 2021
    Inventors: Michael David George, Tekin Alp Meriçli, Cetin Alp Meriçli, Venkataramanan David Rajagopalan, Alonzo James Kelly
  • Publication number: 20210129843
    Abstract: Methods and apparatus that reduce demands on behavior of autonomous vehicles operating in a convoy, such as lane following or leader swap.
    Type: Application
    Filed: October 15, 2020
    Publication date: May 6, 2021
    Inventors: Michael David George, Tekin Alp Meriçli, Cetin Alp Meriçli, Venkataramanan David Rajagopalan, Alonzo James Kelly
  • Patent number: 10973645
    Abstract: Embodiments of the present invention include a convertible prosthesis that is capable of conversion from a humeral head replacement to a reverse reconstruction without any removal of parts integrated into the patient's bony anatomy (e.g. implant stems). A desired overall implant inclination angle may be achieved by matching various implant stems with various reverse inserts, thus permitting a resection surface to be matched with an implant stem selection while also permitting a desired overall implant inclination angle to be achieved through the selection of an appropriate insert.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: April 13, 2021
    Assignee: Tornier Orthopedics Ireland, Ltd.
    Inventors: Pierric Deransart, Vincent Gaborit, Brian Maroney, Brian C. Hodorek, Shawn M. Gargac, Pascal Boileau, Gilles Walch, Luc Favard, Philippe Clavert, François Sirveaux, James Kelly, Sumant Krishnan, Daniel Mole, Cédric Comte, Eric Rundstadler, François Mondi, Christopher R. Chuinard, Thomas Bradley Edwards
  • Patent number: 10978342
    Abstract: The present invention provides interconnects with self-forming wrap-all-around graphene barrier layer. In one aspect, a method of forming an interconnect structure is provided. The method includes: patterning at least one trench in a dielectric; forming an interconnect in the at least one trench embedded in the dielectric; and forming a wrap-all-around graphene barrier surrounding the interconnect. An interconnect structure having a wrap-all-around graphene barrier is also provided.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 13, 2021
    Assignee: International Business Machines Corporation
    Inventors: Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas A. Lanzillo, Christian Lavoie, Devika Sil, Prasad Bhosale, James Kelly
  • Publication number: 20210005573
    Abstract: A semiconductor wafer includes a first substrate and a first etch stop layer formed on the first substrate. The etch stop layer has an opening. The semiconductor wafer further includes a second substrate and a second etch stop layer formed on the second substrate. The first substrate is bonded on top of the second substrate such that the first etch stop layer is positioned between the first substrate and the second substrate. A trench is formed in the opening.
    Type: Application
    Filed: July 1, 2019
    Publication date: January 7, 2021
    Inventors: Ravi K. Bonam, Mukta Ghate Farooq, Dinesh Gupta, James Kelly, Kamal K. Sikka, JOSHUA M. RUBIN
  • Publication number: 20200405087
    Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 31, 2020
    Inventors: James Kelly Pool, III, Peter Jerome Ashcraft
  • Patent number: 10832973
    Abstract: Compressive and tensile stress is induced, respectively, on semiconductor fins in the pFET and nFET regions of a monolithic semiconductor structure including FinFETs. A tensile stressor is formed from dielectric material and a second, compressive stressor is formed from metal. The stressors may be formed in fin cut regions of the monolithic semiconductor structure and are configured to provide stress in the direction of FinFET current flow. The dielectric material may be deposited on the monolithic semiconductor structure and later removed from the fin cut regions of the pFET region. Metal exhibiting compressive residual stress is then deposited in the fin cut regions from which the dielectric material was removed. Gate cut regions may also be filled with the dielectric stressor material to impart substantially uniaxial tensile stress perpendicular to the semiconductor fins and perpendicular to electrical current flow.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Huimei Zhou, Kangguo Cheng, Michael P. Belyansky, Oleg Gluschenkov, Richard A. Conti, James Kelly, Balasubramanian Pranatharthiharan
  • Patent number: 10811310
    Abstract: A method and structure of forming air gaps with a sidewall image transfer process such as self-aligned double patterning to reduce capacitance and resistance. In these methods and structures, the spacer is a metal.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hsueh-Chung Chen, James Kelly, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger
  • Publication number: 20200328111
    Abstract: A technique relates to a semiconductor device. Mandrels are formed on a substrate, the mandrels including a first metal layer. A second metal layer is formed on the substrate adjacent to the first metal layer, the first and second metal layers being separated by spacer material.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 15, 2020
    Inventors: HSUEH-CHUNG CHEN, YONGAN Xu, Yann MIGNOT, James Kelly, Lawrence A. Clevenger
  • Patent number: 10786510
    Abstract: Methods for treating eye diseases associated with inflammation and/or vascular proliferation in subjects are disclosed. The methods include administering therapeutically effective amounts of a tranilast compound, in particular (E)-2-[[3-(3-Methoxy-4-propargyloxy)phenyl)-1-oxo-2-propenyl]amino]benzoic acid or (E)-2-[[3,4-Bis(difluoromethoxy)phenyl)-1-oxo-2-propenyl]amino]benzoic acid or pharmaceutically acceptable salts or solvates thereof.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: September 29, 2020
    Assignee: OccuRX Pty Ltd
    Inventors: Darren James Kelly, David Stapleton
  • Publication number: 20200289624
    Abstract: Disclosed herein are methods and compositions related to coagulation factor complexes comprising a coagulation factor; a fusion protein; and a modifying molecule, wherein the modifying molecule is coupled to the coagulation factor in such a way as to allow binding by the fusion protein, thereby creating a modified coagulation factor; wherein the modilied coagulation factor and the fusion protein interact in at least two independent sites.
    Type: Application
    Filed: February 26, 2020
    Publication date: September 17, 2020
    Inventor: James Kelly
  • Publication number: 20200282435
    Abstract: This disclosure relates to systems and methods for ultrasonic lens cleaning. In an example, an ultrasonic lens cleaning system can be configured to apply sequences that include at least one driver signal adapted to drive a transducer adaptively coupled to a top cover. The transducer can be excited based on the sequences to vibrate the top cover to remove a contaminant from a surface of the top cover. The applying of the sequences can include applying a first sequence to the transducer based on a first set of sequence parameters, applying a second sequence to the transducer based on a second set of sequence parameters, and applying a third sequence to the transducer based on a third set of sequence parameters.
    Type: Application
    Filed: November 25, 2019
    Publication date: September 10, 2020
    Inventors: DAVID PATRICK MAGEE, JAMES KELLY GRIFFIN
  • Patent number: 10766770
    Abstract: Disclosed herein are methods and systems for the production of hydrogen-containing compounds, such as ammonia and urea from a product stream of a fuel cell unit. The production of ammonia and optionally urea can also include a net power production. Alternatively, the hydrogen stream from the fuel cell unit can be directed to the production of synthetic hydrocarbons liquids.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 8, 2020
    Assignee: GRANNUS, LLC
    Inventors: James Kelly Merritt, Matthew Cox
  • Publication number: 20200266111
    Abstract: Compressive and tensile stress is induced, respectively, on semiconductor fins in the pFET and nFET regions of a monolithic semiconductor structure including FinFETs. A tensile stressor is formed from dielectric material and a second, compressive stressor is formed from metal. The stressors may be formed in fin cut regions of the monolithic semiconductor structure and are configured to provide stress in the direction of FinFET current flow. The dielectric material may be deposited on the monolithic semiconductor structure and later removed from the fin cut regions of the pFET region. Metal exhibiting compressive residual stress is then deposited in the fin cut regions from which the dielectric material was removed. Gate cut regions may also be filled with the dielectric stressor material to impart substantially uniaxial tensile stress perpendicular to the semiconductor fins and perpendicular to electrical current flow.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 20, 2020
    Inventors: Huimei Zhou, Kangguo Cheng, Michael P. Belyansky, Oleg Gluschenkov, Richard A. Conti, James Kelly, Balasubramanian Pranatharthiharan
  • Patent number: 10730492
    Abstract: A speed control system operable to control a motor vehicle to operate in accordance with a set-speed value, the control means being operable to allow a user to adjust the set-speed value by user actuation of a vehicle brake control or a vehicle accelerator control.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 4, 2020
    Assignee: JAGUAR LAND ROVER LIMITED
    Inventors: Andrew Fairgrieve, Daniel Woolliscroft, James Kelly, Adam Southgate