Patents by Inventor James L. Speidell
James L. Speidell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11651973Abstract: A method and apparatus for bonding a processor wafer with a microchannel wafer/glass manifold to form a bonded wafer structure are provided. A glass fixture is also provided for protecting C4 solder bumps on chips disposed on the processor wafer. When the glass fixture is positioned on the processor wafer, posts extending from the glass fixture contact corresponding regions on the processor wafer devoid of C4 solder bumps, so that the glass fixture protects the C4 solder bumps during wafer bonding. The method involves positioning the processor wafer/glass fixture and the microchannel wafer/glass manifold in a metal fixture having one or more alignment structures adapted to engage corresponding alignment elements formed in the processor wafer, glass fixture and/or glass manifold. The metal fixture secures the wafer components in place and, after melting solder pellets disposed between the processor wafer/glass fixture and microchannel wafer/glass manifold, a bonded wafer structure is formed.Type: GrantFiled: May 8, 2020Date of Patent: May 16, 2023Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, Evan Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb
-
Publication number: 20210351043Abstract: A method and apparatus for bonding a processor wafer with a microchannel wafer/glass manifold to form a bonded wafer structure are provided. A glass fixture is also provided for protecting C4 solder bumps on chips disposed on the processor wafer. When the glass fixture is positioned on the processor wafer, posts extending from the glass fixture contact corresponding regions on the processor wafer devoid of C4 solder bumps, so that the glass fixture protects the C4 solder bumps during wafer bonding. The method involves positioning the processor wafer/glass fixture and the microchannel wafer/glass manifold in a metal fixture having one or more alignment structures adapted to engage corresponding alignment elements formed in the processor wafer, glass fixture and/or glass manifold. The metal fixture secures the wafer components in place and, after melting solder pellets disposed between the processor wafer/glass fixture and microchannel wafer/glass manifold, a bonded wafer structure is formed.Type: ApplicationFiled: May 8, 2020Publication date: November 11, 2021Inventors: Jae-Woong Nah, Evan Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb
-
Patent number: 8551816Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: GrantFiled: April 4, 2012Date of Patent: October 8, 2013Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 8237271Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: GrantFiled: June 19, 2007Date of Patent: August 7, 2012Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Publication number: 20120187577Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: ApplicationFiled: April 4, 2012Publication date: July 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7784664Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: August 12, 2008Date of Patent: August 31, 2010Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7784673Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: August 11, 2008Date of Patent: August 31, 2010Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7694869Abstract: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.Type: GrantFiled: April 21, 2006Date of Patent: April 13, 2010Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7669748Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.Type: GrantFiled: July 15, 2008Date of Patent: March 2, 2010Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7497366Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.Type: GrantFiled: June 6, 2007Date of Patent: March 3, 2009Assignee: International Business Machines CorporationInventors: S. Jay Chey, Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Publication number: 20090008057Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: ApplicationFiled: August 11, 2008Publication date: January 8, 2009Applicant: International Business Machines Corp.Inventors: Steven A. CORDES, Peter A. GRUBER, John U. Knickerbocker, James L. SPEIDELL
-
Publication number: 20080315409Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.Type: ApplicationFiled: June 19, 2007Publication date: December 25, 2008Inventors: Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Publication number: 20080302502Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: ApplicationFiled: August 12, 2008Publication date: December 11, 2008Applicant: International Business Machines Corp.Inventors: STEVEN A. CORDES, Peter A. Gruber, John U. Knickerbrocker, James L. Speidell
-
Publication number: 20080272177Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.Type: ApplicationFiled: July 15, 2008Publication date: November 6, 2008Inventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7416104Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: April 21, 2006Date of Patent: August 26, 2008Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7410090Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: April 21, 2006Date of Patent: August 12, 2008Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 7410092Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.Type: GrantFiled: April 21, 2006Date of Patent: August 12, 2008Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell
-
Patent number: 6798953Abstract: A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.Type: GrantFiled: January 7, 2000Date of Patent: September 28, 2004Assignee: International Business Machines CorporationInventors: Mitchell S. Cohen, Michael J. Cordes, Steven A. Cordes, William K. Hogan, Glen W. Johnson, Daniel M. Kuchta, Dianne L. Lacey, James L. Speidell, Jeannine M. Trewhella, Joseph P. Zinter
-
Patent number: 6657723Abstract: A planar spectrograph for demultiplexing optical wavelength signals includes a monolithic substrate. The substrate has a diffraction grating etched therein. The diffraction grating is integrally formed in the substrate to be in operative relationship with input light to diffract and reflect the input light to a detector. A recess is formed in the substrate to accommodate a separate slab waveguide. A slab waveguide is dimensioned and configured to fit within the recess, and the waveguide guides input light to and from the diffraction grating. A silicon-on-insulator spectrographs is also described, as well as, fabrication processes for manufacturing these spectrographs.Type: GrantFiled: December 13, 2000Date of Patent: December 2, 2003Assignee: International Business Machines CorporationInventors: Mitchell S. Cohen, George A. Sefler, James L. Speidell
-
Patent number: 6654089Abstract: A self-alignment process for the precise alignment in a deposited diamond-like carbon (DLC), which results in a wider viewing angle for the display being manufactured. The process involves ion bombardment, which is swept across the liquid crystal panel in a two-pass process. In one embodiment, both ion sweeps are aligned at a 45-degree angle with respect to the bottom edge of the panel. The first pass is accomplished without any electrical bias on the panel. During the first pass the impinging ions may be at an angle with respect to a point on a plane defined by the surface of the panel that is less than 90 degrees. The second ion sweep is accomplished with the impinging ions at a second angle, greater than 90 degrees up to 180 degrees with respect to the point on the plane defined by the surface.Type: GrantFiled: May 3, 2001Date of Patent: November 25, 2003Assignee: International Business Machines CorporationInventors: Praveen Chaudhari, James P. Doyle, Shui-Chih Lien, Minhua Lu, James L. Speidell, Robert J. Von Gutfeld