Abstract: The present invention relates to a system and method for compensating IC parameters. According to an embodiment of the present invention, a die of an IC wafer is coupled with a compensation circuit that classifies the die into various types. Examples of types include fast, typical, and slow. The assigned type may be used in a special oscillator that compensates for variations from a die to a predetermined criteria. According to an embodiment of the present invention, a slow die directs a signal that moves through a relatively short path, a fast die directs a signal that moves through a relatively long path, and a typical die directs a signal that moves through a relatively medium length path in the compensation circuit. Accordingly, each die on a wafer may be coupled with a compensation circuit such that the compensation circuit selects a path of a circuit that adjusts the frequency produced by the dies to produce a batch of ICs that would meet the predetermined criteria for the vast majority of the dies.

Abstract: The present invention relates to a system and method for compensating IC parameters. According to an embodiment of the present invention, a die of an IC wafer is coupled with a compensation circuit that classifies the die into various types. Examples of types include fast, typical, and slow. The assigned type may be used in a special oscillator that compensates for variations from a die to a predetermined criteria. According to an embodiment of the present invention, a slow die directs a signal that moves through a relatively short path, a fast die directs a signal that moves through a relatively long path, and a typical die directs a signal that moves through a relatively medium length path in the compensation circuit. Accordingly, each die on a wafer may be coupled with a compensation circuit such that the compensation circuit selects a path of a circuit that adjusts the frequency produced by the dies to produce a batch of ICs that would meet the predetermined criteria for the vast majority of the dies.

Abstract: The present invention relates to a system and method for compensating IC parameters. According to an embodiment of the present invention, a die of an IC wafer is coupled with a compensation circuit that classifies the die into various types. Examples of types include fast, typical, and slow. The assigned type may be used in a special oscillator that compensates for variations from a die to a predetermined criteria. According to an embodiment of the present invention, a slow die directs a signal that moves through a relatively short path, a fast die directs a signal that moves through a relatively long path, and a typical die directs a signal that moves through a relatively medium length path in the compensation circuit. Accordingly, each die on a wafer may be coupled with a compensation circuit such that the compensation circuit selects a path of a circuit that adjusts the frequency produced by the dies to produce a batch of ICs that would meet the predetermined criteria for the vast majority of the dies.

Abstract: A calculator for determining postage or shipping fees which has a bus-oriented microprocessor structure having several memories, including a read only memory with programmed quadrangles corresponding to geographic areas represented by the three most significant digits of ZIP codes. This memory allows a computation of a distance-related value to be performed for each shipment between a destination ZIP code and an originating ZIP code. The distance-related value is converted to a zone by means of a look-up table. The zone, as well as a carrier selection, define a piece-wise linear curve to be used for fee calculation. Using an equation related to distance and having weight of a parcel defined by a scale, on which the parcel rests, the shipping fee may be calculated. Once the fee is calculated, special services may be added.