Patents by Inventor James Manley Pollard, III

James Manley Pollard, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film metal barrier for electrical interconnections
    Patent number: 6437440
    Abstract: An interconnect structure and barrier layer for electrical interconnections is described incorporating a layer of TaN in the hexagonal phase between a first material such as Cu and a second material such as Al, W, and PbSn. A multilayer of TaN in the hexagonal phase and Ta in the alpha phase is also described as a barrier layer. The invention overcomes the problem of Cu diffusion into materials desired to be isolated during temperature anneal at 500° C.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Patrick William Dehaven, Daniel Charles Edelstein, David Peter Klaus, James Manley Pollard, III, Carol L. Stanis, Cyprian Emeka Uzoh
  • Thin metal barrier for electrical interconnections
    Patent number: 6291885
    Abstract: An interconnect structure and barrier layer for electrical interconnections is described incorporating a layer of TaN in the hexagonal phase between a first material such as Cu and a second material such as Al, W, and PbSn. A multilayer of TaN in the hexagonal phase and Ta in the alpha phase is also described as a barrier layer. The invention overcomes the problem of Cu diffusion into materials desired to be isolated during temperature anneal at 500° C.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: September 18, 2001
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Patrick William DeHaven, Daniel Charles Edelstein, David Peter Klaus, James Manley Pollard, III, Carol L. Stanis, Cyprian Emeka Uzoh