Abstract: An electrical connector system includes a receptacle connector assembly and a header connector assembly mated with the receptacle connector assembly. The receptacle connector assembly includes a receptacle connector housing holding receptacle contacts in a plurality of rows. The header connector includes a header connector housing holding header contacts in a plurality of rows. The contacts are laterally offset and longitudinally staggered in the rows to provide spacing between the contacts.

Abstract: Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.

Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.

Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

Abstract: Electronic articles, antennae, and processes of producing electronic articles are disclosed. The electronic article includes a rigid substrate having a non-planar region and a sintered conductive ink positioned on the non-planar region. The antenna is a specific type of electronic article covered by the disclosure. Additionally or alternatively, the antenna has a light transmission of at least 85%. The process includes positioning a substrate having a non-planar region, applying a conductive ink to the non-planar region, and sintering the conductive ink on the non-planar region thereby producing the sintered conductive ink on the electronic article and/or producing an antenna having a light transmission of at least 80%.

Abstract: An electrical contact for a connector includes a contact body that defines a contact plane and a longitudinal contact axis. The contact body includes a contact mounting end for attaching the contact to a circuit board, a mating end to mate with a mating contact, and a backbone section including first and second opposite edges that longitudinally extends between the mating and mounting ends. The mating end includes first and second contact beams laterally extending from the first edge and longitudinally displaced from one another the longitudinal axis.

Abstract: The invention is directed to a dielectric member interposed between two electrical components which have different coefficients of thermal expansion (CTEs). The dielectric member has conductive traces for electrically connecting the electrical components. The traces may be joined by solder balls to a printed circuit board. The dielectric member may include reservoirs for locating the solder balls and receiving solder after reflow of the solder balls. Adhesive layers may be used for bonding the traces to the dielectric member. The dielectric member is made of a material having a selected CTE value which minimizes the CTE mismatch at the electrical interface and effectuates absorption of the thermal expansion and contraction of the system. Stresses induced by thermal expansion and contraction at the electrical interface are thereby reduced, preventing problems such as fractured solder joints.

Abstract: A contact to electrically connect at least one pin of a pin grid array to a printed circuit board is described. The contact comprises a receiving portion having a pair of contact arms, with each contact arm having a curved portion and a straight portion. The contact arms are positioned so that the curved portions form a curved receiving area while the straight portions are substantially parallel to each other to form a contact area. The contact also includes a tail portion having a solder ball receiving portion. The contact further includes a center portion connecting the pin receiving portion to the tail portion.

Abstract: A connector (10) for interconnecting circuits of adjacent circuit-bearing substrates (50, 60) includes a housing (12) having at least one contact-receiving cavity (20), and a contact (30) disposed in a respective contact-receiving cavity (20) and including a plate-like body section (32) secured in cavity (20). The contact (30) further includes a pair of elongate spring arm contact sections (40) initially co-extending from a common edge (34) of the body section (32) and outwardly from the cavity (20) and from a mounting face (14) of the housing (12). The elongate spring arm contact sections (40) have end portions (42) arcuately diverging from each other to free ends (44) to orient respective continuous arcuate edges (46) thereof to face away from the mounting face (14) to be engaged by associated circuit termini (52, 62) of respective ones of the circuit-bearing substrates (50, 60). The elongate spring arm contact sections (40) are independently deflectable toward the mounting face (14) under spring bias.