Patents by Inventor James W. Clark

James W. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4886579
    Abstract: A creping adhesive formulation comprising 10-100% by weight of a polymer or copolymer having a Tg greater than 50.degree. C.
    Type: Grant
    Filed: April 29, 1988
    Date of Patent: December 12, 1989
    Assignee: Scott Paper Company
    Inventors: James W. Clark, Chauncey C. De Pugh
  • Patent number: 4804810
    Abstract: A bonding apparatus for eutectically bonding tape leads to semiconductors and other substrates includes four separate bonding rails for applying heat. The bonding rails have a preselected distribution of mass along their length in order to compensate for uneven heating characteristics which are normally observed in linear heating elements. Usually, four such heat elements are orthogonally arranged at the bottom ends of four electric power buses. By attaching the heating elements to adjacent power buses, and coupling diagonally opposed pairs of the power buses to the positive and negative polarity of a current source, substantially uniform heating of all four elements may be achieved. The ability to provide uniform heating is critical for properly forming eutectic bonds.
    Type: Grant
    Filed: March 14, 1988
    Date of Patent: February 14, 1989
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Fred Drummond, James W. Clark
  • Patent number: 4653175
    Abstract: An applique of a prepatterned film of alpha particle resistant material, such as polyimide, is applied to a semiconductor wafer. The prepatterned film covers only the critical areas e.g. those affected by alpha particle impingement. Bond pads and scribe streets are not covered by the applique.
    Type: Grant
    Filed: March 4, 1986
    Date of Patent: March 31, 1987
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Michael Brueggeman, James W. Clark, William S. Phy
  • Patent number: 4600611
    Abstract: An improved film carrier for affixing both two and three layer films used in tape automated bonding processes for the manufacture of semiconductor devices is disclosed. The carrier uses pegs to substantially match the sprocket holes in the film, thereby eliminating distortion in the film or the leads wires affixed in the film caused by prior art structures which force the film strips between holes to be bent in placing the film in the carrier.
    Type: Grant
    Filed: May 2, 1985
    Date of Patent: July 15, 1986
    Assignee: Fairchild Semiconductor Corporation
    Inventor: James W. Clark
  • Patent number: 4447072
    Abstract: A suspension for a rigid front axle assembly (28) of an articulated mining truck (10) includes a bolster plate (30) upon which the axle assembly is fixedly cradled, a spherical or swivel bearing assembly (36) connecting the front end of the bolster plate to the chassis of the vehicle, and a hollow unitary elastomeric block (70) that is mounted to resiliently couple the rear end of the bolster plate to the chassis. The elastomeric block is preferably elongate and longitudinally oriented, and the block has a cavity that extends longitudinally through its center that is aligned with a longitudinal axis (A-A) through the spherical bearing. The elongate walls thus provided at the sides of the elastomeric block are sufficiently flexible to bulge outwardly when the axle assembly oscillates about the longitudinal axis A-A.
    Type: Grant
    Filed: December 14, 1981
    Date of Patent: May 8, 1984
    Assignee: Envirotech Corporation
    Inventors: Kirk D. Bradley, Robert R. Koski, James W. Clark
  • Patent number: 4265587
    Abstract: A quick-coupling locking mechanism is provided comprising a C-shaped attachment means (2) which is secured to a service module (C) of any type and a toggle linkage assembly which is secured to a service vehicle (B). The C-shaped attachment means (2) is formed to define a lifting hook (3) at its top and a holding hook (4) at its bottom. The linkage assembly includes a horizontal lifting bar (5) for engagement with the lifting hook (3) and a horizontal holding bar (6) for engagement with the holding hook (4). The linkage assembly is selectively operable to move the lifting bar (5) into secure engagement with the lifting hook (3) to raise the service module (C) such that the holding hook (4) is brought into engagement with the holding bar (6). The linkage assembly further includes separating means (21) responsive to the movement of the assembly to force the lifting bar (5) away from the holding bar (6) to lock the lifting bar (5) and the holding bar (6) into secure engagement with the attachment means (2).
    Type: Grant
    Filed: July 25, 1979
    Date of Patent: May 5, 1981
    Assignee: Envirotech Corporation
    Inventor: James W. Clark