Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: A temperature control system for controlling a temperature of an electronic device during testing of the electronic device includes a thermal head having a device contact face configured to contact the electronic device during testing; a fluidic thermal interface material (TIM) dispenser configured to dispense a fluidic TIM to a location between a face of the electronic device and the device contact face of the thermal head; and a fluidic TIM dispenser controller configured to control the TIM dispenser such that the TIM dispenser dispenses the fluidic TIM during a test cycle of the electronic device.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.

Abstract: A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A mechanical assembly, for regulating the temperature of an electronic device, includes a gimbal and a heat-exchanger which is attached to the gimbal. The gimbal includes a base member, a carrier member, and a spring which has—1) a first end with a rigid coupling to one of the base and carrier members, and 2) a second end with a slideable coupling to the remaining member. The slideable coupling prevents any gap from occurring between the heat-exchanger and the electronic device when they are pressed together.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A dual feedback control system maintains the temperature of an IC-chip near a set-point while the IC-chip dissipates a varying amount of electrical power. The first feedback circuit sends electrical power to an electric heater with a variable magnitude that compensates for changes in the IC-chip power. The second feedback circuit passes a liquid refrigerant to an evaporator, which is connected to the heater, with a variable flow rate that reduces electrical power usage in the heater over that which occurs if the flow rate is fixed.

Abstract: A heat-exchanger in a chip tester includes an electric heater and a heatsink which are joined together with a layer of an attach material. The operational period of this heat-exchanger is extended by a method which includes the steps of: 1) testing chips in the chip tester in a manner that puts the heat-exchanger through multiple temperature changes which keep the layer in a solid state and which induce stress-cracks in the layer; 2) subjecting the layer to a crack-healing temperature cycle in which the layer is melted at least partially and re-solidified; and thereafter, 3) repeating the testing step.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Further, at least one window is provided in the container such that it passes energy by electromagnetic radiation from a radiation source to the IC-module, but blocks the liquid coolant.