Patents by Inventor Jan Olaf Schulenburg

Jan Olaf Schulenburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10214611
    Abstract: An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 26, 2019
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Tina Voci, David Hofstetter, Christian Krüger, Jan Olaf Schulenburg
  • Publication number: 20190002626
    Abstract: Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas KRAMER, Jürgen FINTER, Karsten FRICK, Urs RHEINEGGER, Jan Olaf SCHULENBURG
  • Patent number: 9567424
    Abstract: A method is described for producing liquid rubber containing an impact-resistance modifier terminated by epoxy groups, the method including the reaction of an isocyanate-terminated prepolymer with an epoxy resin, which includes an epoxy compound including a primary or secondary hydroxyl group, in the presence of a compound selected from anhydrides, ketones and aldehydes as glycol scavengers, wherein the isocyanate-terminated prepolymer, the epoxy resin and the glycol scavenger are mixed with one another, or the epoxy resin is reacted with the glycol scavenger, before they are mixed with the isocyanate-terminated prepolymer. Gelling in the reaction mixture is avoided by the method. The resulting products are suitable for improving the impact resistance of epoxy resin compositions, particularly one-component or two-component epoxy resin adhesives.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: February 14, 2017
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Christian Krüger, Jan Olaf Schulenburg, David Hofstetter, Tina Voci
  • Patent number: 9512341
    Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: December 6, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
  • Publication number: 20160272750
    Abstract: An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.
    Type: Application
    Filed: November 12, 2013
    Publication date: September 22, 2016
    Inventors: Tina VOCI, David HOFSTETTER, Christian KRÜGER, Jan Olaf SCHULENBURG
  • Publication number: 20150337181
    Abstract: A method is described for producing liquid rubber containing an impact-resistance modifier terminated by epoxy groups, the method including the reaction of an isocyanate-terminated prepolymer with an epoxy resin, which includes an epoxy compound including a primary or secondary hydroxyl group, in the presence of a compound selected from anhydrides, ketones and aldehydes as glycol scavengers, wherein the isocyanate-terminated prepolymer, the epoxy resin and the glycol scavenger are mixed with one another, or the epoxy resin is reacted with the glycol scavenger, before they are mixed with the isocyanate-terminated prepolymer. Gelling in the reaction mixture is avoided by the method. The resulting products are suitable for improving the impact resistance of epoxy resin compositions, particularly one-component or two-component epoxy resin adhesives.
    Type: Application
    Filed: November 7, 2013
    Publication date: November 26, 2015
    Inventors: Christian KRÜGER, Jan Olaf SCHULENBURG, David HOFSTETTER, Tina VOCI
  • Publication number: 20150284608
    Abstract: The invention relates to a curing agent component for use in a two-component epoxy adhesive made of a component A including an epoxy resin and a curing agent component B, wherein the curing agent component B1) includes at least one aliphatic alicyclic polyether amine with at least 2 amino groups and B2) at least one polyamine selected from a phenalkylamine or an aliphatic polyether amine, containing at least one alicyclic alkoxylate segment and at least one cycloaliphatic segment, and optionally B3) at least one amine compound selected from an amine-terminated rubber, an amine-terminated poly(tetramethylene ether glycol) and an amine-terminated poly(tetramethylene ether glycol)-poly(propylene glycol) copolymer.
    Type: Application
    Filed: November 8, 2013
    Publication date: October 8, 2015
    Inventors: David Hofstetter, Tina Voci, Jan Olaf Schulenburg
  • Patent number: 9139682
    Abstract: A foam is disclosed that can be cured by heat having, for example, 10 to 80 vol. % of at least one gas and a compound that can be cured by heat. The foam can include at least one polyurethane polymer and at least one curing agent that can be activated by increased temperature. Foams that can be cured are suitable as flues, sealing compounds, or for the production of coatings, and can be cured by heat for structural adhesive bonds and for lining in vehicle construction.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: September 22, 2015
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Martin Linnenbrink, Jan Olaf Schulenburg, Michael Gutgsell
  • Patent number: 9034135
    Abstract: The present invention relates to a method of producing an edging-fold bond. For this purpose use is made more particularly of high-viscosity adhesives. The method features reduced bubble formation within the edging fold and also within the sealant (where present) that seals the edging-fold seam. More particularly the adhesive comprises spacers which further reinforce this effect.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: May 19, 2015
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Jan Olaf Schulenburg, Michael Gutgsell, Yolanda Maurer
  • Patent number: 8829122
    Abstract: Novel impact strength modifiers which are obtained by reaction of amphiphilic block copolymers. These impact strength modifiers are suitable in particular for use in heat-curing epoxy resin adhesives. In particular, combinations of different impact strength modifiers are also suitable for use in heat-curing epoxy resin adhesives. Also disclosed are methods of bonding heat-stable substrates.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: September 9, 2014
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Jurgen Finter, Karsten Frick, Jan Olaf Schulenburg
  • Publication number: 20130280526
    Abstract: The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint.
    Type: Application
    Filed: December 19, 2011
    Publication date: October 24, 2013
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
  • Publication number: 20130280536
    Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.
    Type: Application
    Filed: December 19, 2011
    Publication date: October 24, 2013
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
  • Patent number: 8071217
    Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: December 6, 2011
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Juergen Finter, Urs Rheinegger, Jan Olaf Schulenburg
  • Patent number: 8062468
    Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: November 22, 2011
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Andreas Kramer, Jan Olaf Schulenburg, Urs Rheinegger
  • Patent number: 7951879
    Abstract: Embodiments relate to viscosifiers that are terminated polymers that have functional terminal groups. The polymers being pre-extended by polyepoxides and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions and considerably reduce or even exclude the formation of high-molecular addition products so that the products obtained have low viscosity and good storage stability.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: May 31, 2011
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Jan Olaf Schulenburg, Jürgen Finter
  • Patent number: 7932322
    Abstract: The invention relates to viscosifiers, especially terminated polymers that have functional terminal groups, said polymers being pre-extended by polyamines, polymercaptans, (poly)aminoalcohols, (poly)mercaptoalcohols or (poly)aminomercaptans and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. They are also charaterized in that the formation of high-molecular addition products is considerably reduced or even excluded so that products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: April 26, 2011
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Jan Olaf Schulenburg, Jürgen Finter, Norman Blank
  • Patent number: 7915344
    Abstract: Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: March 29, 2011
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Jan Olaf Schulenburg
  • Publication number: 20110030893
    Abstract: Novel impact strength modifiers which are obtained by reaction of amphiphilic block copolymers. These impact strength modifiers are suitable in particular for use in heat-curing epoxy resin adhesives. In particular, combinations of different impact strength modifiers are also suitable for use in heat-curing epoxy resin adhesives. Also disclosed are methods of bonding heat-stable substrates.
    Type: Application
    Filed: April 16, 2009
    Publication date: February 10, 2011
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas Kramer, Jurgen Finter, Karsten Frick, Jan Olaf Schulenburg
  • Publication number: 20100273005
    Abstract: The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
    Type: Application
    Filed: November 14, 2008
    Publication date: October 28, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas Kramer, Jurgen Finter, Karsten Frick, Urs Rheinegger, Jan Olaf Schulenburg
  • Publication number: 20100266809
    Abstract: The present invention relates to a method of producing an edging-fold bond. For this purpose use is made more particularly of high-viscosity adhesives. The method features reduced bubble formation within the edging fold and also within the sealant (where present) that seals the edging-fold seam. More particularly the adhesive comprises spacers which further reinforce this effect.
    Type: Application
    Filed: December 21, 2007
    Publication date: October 21, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Jan Olaf Schulenburg, Michael Gutgsell, Yolanda Maurer