Abstract: The invention relates to an assembly, in particular a play fountain, comprising a floor for carrying people, a plurality of electrical devices, such as electric motors coupled to pumps and nozzles for generating jets of liquid, distributed over the area of the floor, and a control system for operating the electrical devices. The assembly comprises a plurality of rechargeable batteries connected to the electrical devices.

Abstract: The invention relates to an assembly, in particular a play fountain, comprising a floor (1), a plurality of nozzles (2), preferably a reservoir for a liquid, in particular water, or means to connect the assembly to a liquid supply, and a control system (3) for controlling one or more of the nozzles (2) during operation of the assembly. The floor (1) is assembled modularly.

Abstract: The invention relates to an assembly, in particular a play fountain, comprising a floor (1), a plurality of nozzles (2), preferably a reservoir for a liquid, in particular water, or means to connect the assembly to a liquid supply, and a control system (3) for controlling one or more of the nozzles (2) during operation of the assembly. The floor (1) is assembled modularly.

Abstract: The invention relates to an assembly, in particular a play fountain, comprising a floor for carrying people, a plurality of electrical devices, such as electric motors coupled to pumps and nozzles for generating jets of liquid, distributed over the area of the floor, and a control system for operating the electrical devices. The assembly comprises a plurality of rechargeable batteries connected to the electrical devices.

Abstract: Consistent with an example embodiment, a semiconductor device comprises a patterned conductive layer defining contact pads for being connected to terminals of a semiconductor chip. The semiconductor chip comprises the terminals at a first side and an adhesive layer at a second side opposite to the first side; wherein, the semiconductor chip is mounted with an adhesive layer on a patterned conductive layer such that the semiconductor chip part of each respective contact pad leaves part thereof uncovered by the chip for wire bonding. Wire bonds connect respective terminals of the semiconductor chip and respective contact pads at the first side thereof. A molding compound covers the semiconductor chip, the wire bonds and the contact pads; wherein, the molding compound is also located on the second side of the semiconductor device, separating the contact regions that are located directly on a backside of the contact pads.

Abstract: Consistent with an example embodiment, a semiconductor device comprises a patterned conductive layer defining contact pads for being connected to terminals of a semiconductor chip. The semiconductor chip comprises the terminals at a first side and an adhesive layer at a second side opposite to the first side; wherein, the semiconductor chip is mounted with an adhesive layer on a patterned conductive layer such that the semiconductor chip part of each respective contact pad leaves part thereof uncovered by the chip for wire bonding. Wire bonds connect respective terminals of the semiconductor chip and respective contact pads at the first side thereof. A molding compound covers the semiconductor chip, the wire bonds and the contact pads; wherein, the molding compound is also located on the second side of the semiconductor device, separating the contact regions that are located directly on a backside of the contact pads.

Abstract: The invention relates to a method of manufacturing a semiconductor device, the method comprising: i) providing a substrate carrier comprising a substrate layer and a patterned conductive layer, wherein the patterned conductive layer defines contact pads; ii) partially etching the substrate carrier using the patterned conductive layer as a mask defining contact regions in the substrate layer; iii) providing the semiconductor chip; iv) mounting said semiconductor chip with the adhesive layer on the patterned conductive layer such that the semiconductor chip covers at least one of the trenches and part of the contact pads neighboring the respective trench are left uncovered for future wire bonding; v) providing wire bonds between respective terminals of the semiconductor chip and respective contact pads of the substrate carrier; vi) providing a molding compound covering the substrate carrier and the semiconductor chip, and vii) etching the backside (S2) of the substrate carrier to expose the molding compound in

Abstract: The invention relates to an assembly, in particular a play fountain, comprising a floor (1), a plurality of nozzles (2), preferably a reservoir for a liquid, in particular water, or means to connect the assembly to a liquid supply, and a control system (3) for controlling one or more of the nozzles (2) during operation of the assembly. The floor (1) is assembled modularly.

Abstract: The invention relates to a method of manufacturing a semiconductor device (1), the method comprising: i) providing a substrate (10); ii) providing a photoresist layer (15) on the substrate (10), the photoresist layer (15) comprising an opening (16) having pre-shaped sidewalls (18); iii) filling the opening (16) with an electrically conductive material (20) for defining a contact pad (22) having further sidewalls (23, 26) corresponding with the pre-shaped sidewalls (18).

Abstract: The invention relates to a method of manufacturing a semiconductor device, the method comprising: i) providing a substrate carrier comprising a substrate layer and a patterned conductive layer, wherein the patterned conductive layer defines contact pads; ii) partially etching the substrate carrier using the patterned conductive layer as a mask defining contact regions in the substrate layer; iii) providing the semiconductor chip; iv) mounting said semiconductor chip with the adhesive layer on the patterned conductive layer such that the semiconductor chip covers at least one of the trenches and part of the contact pads neighboring the respective trench are left uncovered for future wire bonding; v) providing wire bonds between respective terminals of the semiconductor chip and respective contact pads of the substrate carrier; vi) providing a molding compound covering the substrate carrier and the semiconductor chip, and vii) etching the backside (S2) of the substrate carrier to expose the molding compound in