Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: A display device includes a substrate including an emission area and a non-emission area, alignment electrodes arranged to be spaced from each other in a first direction on the substrate and extending in a second direction crossing the first direction, and pixels arranged along the second direction. Pixels adjacent to each other in the second direction from among the pixels may be configured to emit light of different colors. Each of the pixels may include first light emitting elements on the alignment electrodes and arranged along the second direction, second light emitting elements on the alignment electrodes, spaced from the first light emitting elements in the first direction, and arranged along the second direction, a first pixel electrode electrically connected to a first driving power and first ends of the first light emitting elements, a second pixel electrode spaced from the first pixel electrode in the first direction.

Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.

Abstract: A display device may include pixels on a substrate. Each of the pixels may include: a first alignment electrode and a second alignment electrode located on the substrate and spaced from each other; a first insulating layer on the first alignment electrode and the second alignment electrode; a light emitting element located on the first insulating layer between the first and second alignment electrodes; a dummy pattern located between the first insulating layer and the light emitting element; a second insulating layer located on the light emitting element and exposing first and second ends of the light emitting element; a first electrode electrically connected to the first end of the light emitting element; and a second electrode spaced from the first electrode, and electrically connected to the second end of the light emitting element. The dummy pattern may include a same material as the second insulating layer.

Abstract: A display device includes: light emitting elements, each of the light emitting elements including a first end having a first polarity and a second end having a second polarity different from the first polarity; and a first type connection electrode contacting the first ends and/or the second ends of the light emitting elements, wherein a first type connection electrode includes: a middle portion extending in a first direction; a first electrode portion extending from the middle portion toward a first side in a second direction intersecting the first direction; a second electrode portion extending from the middle portion toward the first side in the second direction and spaced from the first electrode portion by a first width in the first direction; a third electrode portion extending from the middle portion toward a second side in the second direction; and a fourth electrode portion.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: Provided is a UV lamp socket assembly for quickly, easily and safely drawing out a UV lamp without stopping operation of a UV reactor. The UV lamp socket assembly includes a lamp socket part allowing a UV lamp to be fitted thereto, and having a latch formed in a side surface to pivot around; a lamp socket nut part allowing the UV lamp to be inserted therethrough, having an annular latching groove formed in a side surface and provided for attaching and detaching the latch, and allowing a portion of the lamp socket part to be inserted while the latch is latched into the latching groove; and a lamp socket holder part to be fixed to a frame of the UV reactor using a fastening part and to be fastened with the lamp socket nut part to support the lamp socket part.

Abstract: Provided is a UV lamp socket assembly for quickly, easily and safely drawing out a UV lamp without stopping operation of a UV reactor. The UV lamp socket assembly includes a lamp socket part allowing a UV lamp to be fitted thereto, and having a latch formed in a side surface to pivot around; a lamp socket nut part allowing the UV lamp to be inserted therethrough, having an annular latching groove formed in a side surface and provided for attaching and detaching the latch, and allowing a portion of the lamp socket part to be inserted while the latch is latched into the latching groove; and a lamp socket holder part to be fixed to a frame of the UV reactor using a fastening part and to be fastened with the lamp socket nut part to support the lamp socket part.

Abstract: The present invention relates to a display device, and to a method for controlling the same. To this end, the display device of the present invention may comprise a communication unit and at least one processor. The communication unit may receive a first code for a first key input from a remote control device. The at least one processor transmits a command for the received first code to an infrared blaster through the communication unit, and based on receiving a control signal for the first key from a peripheral device connected to be operable with the display device, the processor may be configured to operate the display device.

Abstract: A stack package includes a package substrate; a lower stack including lower dies stacked on the package substrate to form a zigzag shape in a vertical direction; an upper stack including upper dies that are sequentially offset stacked in an offset direction while providing a first upper side of a down staircase shape, a first end of an uppermost upper die among the upper dies protruding, in a horizontal direction, further than a first lower side of the lower stack; and a first passive device disposed on the package substrate and spaced apart from the first lower side, and disposed between a first portion of the package substrate and the first upper side.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber provided with a reaction space and having at least one insulation member exposed to the reaction space; a substrate support member for supporting a substate at the reaction space; a gas supply member for selectively supplying a passivation gas or a process gas to the reaction space; a plasma source for exciting the passivation gas or the process gas to a plasma; and a controller for controlling the gas supply member and the plasma source, and wherein the controller controls the gas supply member and the plasma source so the passivation gas is supplied to the reaction space and a supplied passivation gas is excited to the plasma, in a state at which the substrate is not taken into the reaction space.

Abstract: A semiconductor manufacturing apparatus includes a process chamber. An insulating plate divides an interior space of the process chamber into a first space and a second space and thermally isolates the first space from the second space. A gas supplier is configured to supply a process gas to the first space. A radiator is configured to heat the first space. A stage is disposed within the second space and the stage is configured to support a substrate.

Abstract: A substrate treating apparatus includes a process chamber having a reaction space with one or more insulation members exposed to the reaction space; a substrate support member supporting a substrate at the reaction space; a gas supply member selectively supplying a passivation gas and a process gas to the reaction space; a plasma source exciting a gas into a plasma; and a controller which controls the gas supply member and the plasma source, and after a substrate to be treated is taken into the reaction space and supported by the support member, the controller controls the gas supply member and the plasma source to supply the passivation gas and the process gas to the reaction space simultaneously or sequentially, and generate a plasma in the reaction space under the condition of stopping a supply of the passivation gas but supplying the process gas.

Abstract: A stack package includes a package substrate; a lower stack including lower dies stacked on the package substrate to form a zigzag shape in a vertical direction; an upper stack including upper dies that are sequentially offset stacked in an offset direction while providing a first upper side of a down staircase shape, a first end of an uppermost upper die among the upper dies protruding, in a horizontal direction, further than a first lower side of the lower stack; and a first passive device disposed on the package substrate and spaced apart from the first lower side, and disposed between a first portion of the package substrate and the first upper side.

Abstract: In a plasma deposition method, a substrate is loaded onto a substrate stage within a chamber. A first plasma is generated at a region separated from the substrate by a first distance. A first process gas is supplied to the first plasma region to perform a pre-treatment process on the substrate. A second plasma is generated at a region separated from the substrate by a second distance different from the first distance. A second process gas is supplied to the second plasma region to perform a deposition process on the substrate.

Abstract: Disclosed is a method by which a transmission device transmits data on the basis of a sound signal in a wireless communication system, the method including transmitting a sound packet corresponding to transmission data, with the sound packet including at least one sound symbol, the sound symbol including at least one sound sub-symbol, a plurality of sound symbol types are supported in the wireless communication system, and each of the plurality of sound symbol types is mapped to a preset data value.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.

Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.