Abstract: The present disclosure according to at least one embodiment provides a method of providing a multi-transmission path service on a cloud virtual network, the method being performed by a computing system.

Abstract: A display device includes an emission area and a non-emission area, first to third alignment electrodes sequentially arranged in a first direction, a plurality of first light-emitting elements disposed between the first alignment electrode and the second alignment electrode and a plurality of second light-emitting elements disposed between the second alignment electrode and the third alignment electrode, a first electrode electrically connected to a first end portion of each of the first and second plurality of light-emitting elements, and a second electrode electrically connected to a second end portion of each of the first and second plurality of light-emitting elements. The emission area may include a first area, a second area, and a third area divided in a second direction. The first electrode may be positioned in the first area and the second area and may be electrically disconnected in the third area.

Abstract: The present invention relates to an electrode plate manufacturing apparatus including a first laser radiation unit that radiates a first laser beam in a first direction perpendicular to an electrode film located between rollers of a transfer device to notch at least a portion of the electrode film and a second laser radiation unit that radiates a second laser beam to a notched area of the electrode film, which is notched by the first laser radiation unit, to remove a material of a surface of the electrode film melted by the first laser beam.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: The present disclosure relates to an image encoding/decoding method for a machine and a device therefor. An image encoding method according to the present disclosure includes extracting an encoding method feature from an encoding input signal; determining an encoding method that is optimal for the encoding input signal based on the encoding method feature; transforming the encoding input signal based on the encoding method; and encoding an encoding target signal generated by transforming encoding method information and the encoding input signal.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: Provided is a UV lamp socket assembly for quickly, easily and safely drawing out a UV lamp without stopping operation of a UV reactor. The UV lamp socket assembly includes a lamp socket part allowing a UV lamp to be fitted thereto, and having a latch formed in a side surface to pivot around; a lamp socket nut part allowing the UV lamp to be inserted therethrough, having an annular latching groove formed in a side surface and provided for attaching and detaching the latch, and allowing a portion of the lamp socket part to be inserted while the latch is latched into the latching groove; and a lamp socket holder part to be fixed to a frame of the UV reactor using a fastening part and to be fastened with the lamp socket nut part to support the lamp socket part.

Abstract: Provided is a UV lamp socket assembly for quickly, easily and safely drawing out a UV lamp without stopping operation of a UV reactor. The UV lamp socket assembly includes a lamp socket part allowing a UV lamp to be fitted thereto, and having a latch formed in a side surface to pivot around; a lamp socket nut part allowing the UV lamp to be inserted therethrough, having an annular latching groove formed in a side surface and provided for attaching and detaching the latch, and allowing a portion of the lamp socket part to be inserted while the latch is latched into the latching groove; and a lamp socket holder part to be fixed to a frame of the UV reactor using a fastening part and to be fastened with the lamp socket nut part to support the lamp socket part.

Abstract: The present invention relates to a display device, and to a method for controlling the same. To this end, the display device of the present invention may comprise a communication unit and at least one processor. The communication unit may receive a first code for a first key input from a remote control device. The at least one processor transmits a command for the received first code to an infrared blaster through the communication unit, and based on receiving a control signal for the first key from a peripheral device connected to be operable with the display device, the processor may be configured to operate the display device.

Abstract: A stack package includes a package substrate; a lower stack including lower dies stacked on the package substrate to form a zigzag shape in a vertical direction; an upper stack including upper dies that are sequentially offset stacked in an offset direction while providing a first upper side of a down staircase shape, a first end of an uppermost upper die among the upper dies protruding, in a horizontal direction, further than a first lower side of the lower stack; and a first passive device disposed on the package substrate and spaced apart from the first lower side, and disposed between a first portion of the package substrate and the first upper side.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber provided with a reaction space and having at least one insulation member exposed to the reaction space; a substrate support member for supporting a substate at the reaction space; a gas supply member for selectively supplying a passivation gas or a process gas to the reaction space; a plasma source for exciting the passivation gas or the process gas to a plasma; and a controller for controlling the gas supply member and the plasma source, and wherein the controller controls the gas supply member and the plasma source so the passivation gas is supplied to the reaction space and a supplied passivation gas is excited to the plasma, in a state at which the substrate is not taken into the reaction space.

Abstract: A semiconductor manufacturing apparatus includes a process chamber. An insulating plate divides an interior space of the process chamber into a first space and a second space and thermally isolates the first space from the second space. A gas supplier is configured to supply a process gas to the first space. A radiator is configured to heat the first space. A stage is disposed within the second space and the stage is configured to support a substrate.

Abstract: A substrate treating apparatus includes a process chamber having a reaction space with one or more insulation members exposed to the reaction space; a substrate support member supporting a substrate at the reaction space; a gas supply member selectively supplying a passivation gas and a process gas to the reaction space; a plasma source exciting a gas into a plasma; and a controller which controls the gas supply member and the plasma source, and after a substrate to be treated is taken into the reaction space and supported by the support member, the controller controls the gas supply member and the plasma source to supply the passivation gas and the process gas to the reaction space simultaneously or sequentially, and generate a plasma in the reaction space under the condition of stopping a supply of the passivation gas but supplying the process gas.

Abstract: A stack package includes a package substrate; a lower stack including lower dies stacked on the package substrate to form a zigzag shape in a vertical direction; an upper stack including upper dies that are sequentially offset stacked in an offset direction while providing a first upper side of a down staircase shape, a first end of an uppermost upper die among the upper dies protruding, in a horizontal direction, further than a first lower side of the lower stack; and a first passive device disposed on the package substrate and spaced apart from the first lower side, and disposed between a first portion of the package substrate and the first upper side.

Abstract: In a plasma deposition method, a substrate is loaded onto a substrate stage within a chamber. A first plasma is generated at a region separated from the substrate by a first distance. A first process gas is supplied to the first plasma region to perform a pre-treatment process on the substrate. A second plasma is generated at a region separated from the substrate by a second distance different from the first distance. A second process gas is supplied to the second plasma region to perform a deposition process on the substrate.

Abstract: Disclosed is a method by which a transmission device transmits data on the basis of a sound signal in a wireless communication system, the method including transmitting a sound packet corresponding to transmission data, with the sound packet including at least one sound symbol, the sound symbol including at least one sound sub-symbol, a plurality of sound symbol types are supported in the wireless communication system, and each of the plurality of sound symbol types is mapped to a preset data value.