Patents by Inventor Jang Uk Shin

Jang Uk Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200241226
    Abstract: Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.
    Type: Application
    Filed: September 16, 2019
    Publication date: July 30, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Young-Tak HAN, Seok-Tae KIM, Jong-Hoi KIM, Sang-Ho PARK, Yongsoon BAEK, Jang-Uk SHIN, Seo-Young LEE
  • Patent number: 10268004
    Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: April 23, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak Han, Sang Ho Park, Yong Soon Baek, Jang Uk Shin, Yong Hwan Kwon, Jong Hoi Kim
  • Patent number: 10146071
    Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: December 4, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak Han, Sang Ho Park, Yongsoon Baek, Jang Uk Shin, Dong Hyo Lee, Dong-Hun Lee
  • Publication number: 20180143463
    Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.
    Type: Application
    Filed: May 16, 2017
    Publication date: May 24, 2018
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Young-Tak HAN, Sang Ho PARK, Yongsoon BAEK, Jang Uk SHIN, Dong Hyo LEE, Dong-Hun LEE
  • Publication number: 20180136419
    Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
    Type: Application
    Filed: January 12, 2018
    Publication date: May 17, 2018
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak HAN, Sang Ho PARK, Yong Soon BAEK, Jang Uk SHIN, Yong Hwan KWON, Jong Hoi KIM
  • Patent number: 9904023
    Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 27, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak Han, Sang Ho Park, Yong Soon Baek, Jang Uk Shin, Yong Hwan Kwon, Jong Hoi Kim
  • Patent number: 9711939
    Abstract: Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 18, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Hun Lee, Sang Ho Park, Yong Soon Baek, Jang Uk Shin, Young Tak Han
  • Publication number: 20170179679
    Abstract: Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.
    Type: Application
    Filed: August 19, 2016
    Publication date: June 22, 2017
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Hun LEE, Sang Ho PARK, Yong Soon BAEK, Jang Uk SHIN, Young Tak HAN
  • Publication number: 20170139162
    Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
    Type: Application
    Filed: July 6, 2016
    Publication date: May 18, 2017
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak HAN, Sang Ho PARK, Yong Soon BAEK, Jang Uk SHIN, Yong Hwan KWON, Jong Hoi KIM
  • Publication number: 20170093118
    Abstract: Provided is a tunable wavelength laser module including: an external cavity type light source generating broadband light; an optical waveguide; a Bragg grating formed in the optical waveguide; a heater provided above the optical waveguide in which the Bragg grating is formed and adjusting a reflection band of the Bragg grating by a thermo-optic effect; a direction change waveguide region changing direction of optical signals obtained by the adjusted reflection band of the Bragg grating, by a predetermined angle; a 45-degree reflection part transmitting some of the optical signals direction-changed by the direction change waveguide region and escaping from the optical waveguide therethrough and reflecting the others of the optical signals in a vertical upward direction thereby; and a lens making the optical signals reflected in the vertical upward direction by the 45-degree reflection part collimated light or convergent light.
    Type: Application
    Filed: May 20, 2015
    Publication date: March 30, 2017
    Inventors: Hak Kyu LEE, Joon Oh PARK, Jun Kyu SEO, Jang Uk SHIN
  • Patent number: 9507109
    Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: November 29, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak Han, Jang Uk Shin, Sang-Pil Han, Sang Ho Park, Yongsoon Baek
  • Patent number: 9411097
    Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 9, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak Han, Sang Ho Park, Yong Soon Baek, Jang Uk Shin
  • Publication number: 20160154177
    Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards
    Type: Application
    Filed: June 1, 2015
    Publication date: June 2, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young Tak HAN, Sang Ho PARK, Yong Soon BAEK, Jang Uk SHIN
  • Patent number: 9348195
    Abstract: A method of operating a wavelength swept source apparatus includes generating a single mode light, and generating a basic optical comb including light rays having identical frequency differences with adjacent light rays by modulating the generated single mode light. The method further includes generating other optical combs that include the same number of light rays as that of light rays of the optical comb that has a frequency band different from that of the basic optical comb, and is distributed in a frequency band wider than that in which the basic optical comb is distributed, by modulating the light rays of the basic optical comb. The light rays of the basic optical comb and the light rays included in the other optical combs are sequentially emitted according to frequencies of the light rays of the basic optical comb and the light rays included in the other optical combs.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: May 24, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Oh Kee Kwon, Kwang Ryong Oh, minhyup Song, Chul-Wook Lee, Jang Uk Shin, Young-Tak Han
  • Patent number: 9335474
    Abstract: Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 10, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak Han, Sang Ho Park, Dong-Hun Lee, Jang Uk Shin, Sang-Pil Han, Yongsoon Baek
  • Publication number: 20160116694
    Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
    Type: Application
    Filed: January 5, 2016
    Publication date: April 28, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak HAN, Jang Uk SHIN, Sang-Pil HAN, Sang Ho PARK, Yongsoon BAEK
  • Publication number: 20160077404
    Abstract: A method of operating a wavelength swept source apparatus includes generating a single mode light, and generating a basic optical comb including light rays having identical frequency differences with adjacent light rays by modulating the generated single mode light. The method further includes generating other optical combs that include the same number of light rays as that of light rays of the optical comb that has a frequency band different from that of the basic optical comb, and is distributed in a frequency band wider than that in which the basic optical comb is distributed, by modulating the light rays of the basic optical comb. The light rays of the basic optical comb and the light rays included in the other optical combs are sequentially emitted according to frequencies of the light rays of the basic optical comb and the light rays included in the other optical combs.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Oh Kee KWON, Kwang Ryong OH, minhyup SONG, Chul-Wook LEE, Jang Uk SHIN, Young-Tak HAN
  • Patent number: 9265140
    Abstract: Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: February 16, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak Han, Jang Uk Shin, Sang Ho Park, Yongsoon Baek
  • Patent number: 9256038
    Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: February 9, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Tak Han, Jang Uk Shin, Sang-Pil Han, Sang Ho Park, Yongsoon Baek
  • Patent number: 9207403
    Abstract: The present invention relates to a total reflection type optical switch using polymer insertion type silica optical waveguides and a manufacturing method thereof. The total reflection type optical switch forms a trench in an intersecting point of the silica optical waveguides having two optic routes, and inserts a polymer into the trench. A total reflection type optical switch has a heater which heats the polymer. The polymer is made of thermo-optic material, and totally reflects an optical signal as a refraction index falls when heated by the heater. In addition, when not heated by the heater, the polymer transilluminates the optical signal. When the polymer is made of electric-optic material, the total reflection type optical switch may have upper and lower electrodes for applying an electric field in the polymer instead of the heater.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: December 8, 2015
    Assignee: Photonics Planar Integration Technology, Inc.
    Inventors: Young Sic Kim, Jang-Uk Shin, Hyung-Myung Moon, Jin-Bong Kim