Abstract: Disclosed are a Mach-Zehnder interferometric optical modulator and a method for manufacturing the same. The modulator includes first and second lower clad layers, a core layer, an upper clad layer, a waveguide, and electrodes. The waveguide may include an input waveguide, a waveguide divider, branch waveguides, and a waveguide combiner. Each of the branch waveguides includes first and second connection regions connected to the waveguide combiner and the waveguide divider, respectively, and a phase shift region having a cross-section of a reverse mesa structure that has an upper width that is the same as widths of the first and second connection regions and a lower width that is smaller than the widths of the first and second connection regions.

Abstract: Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.

Abstract: Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.

Abstract: Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.

Abstract: Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.

Abstract: Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.

Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.

Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.

Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Abstract: Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.

Abstract: Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.

Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Abstract: Provided is a tunable wavelength laser module including: an external cavity type light source generating broadband light; an optical waveguide; a Bragg grating formed in the optical waveguide; a heater provided above the optical waveguide in which the Bragg grating is formed and adjusting a reflection band of the Bragg grating by a thermo-optic effect; a direction change waveguide region changing direction of optical signals obtained by the adjusted reflection band of the Bragg grating, by a predetermined angle; a 45-degree reflection part transmitting some of the optical signals direction-changed by the direction change waveguide region and escaping from the optical waveguide therethrough and reflecting the others of the optical signals in a vertical upward direction thereby; and a lens making the optical signals reflected in the vertical upward direction by the 45-degree reflection part collimated light or convergent light.

Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards

Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards

Abstract: A method of operating a wavelength swept source apparatus includes generating a single mode light, and generating a basic optical comb including light rays having identical frequency differences with adjacent light rays by modulating the generated single mode light. The method further includes generating other optical combs that include the same number of light rays as that of light rays of the optical comb that has a frequency band different from that of the basic optical comb, and is distributed in a frequency band wider than that in which the basic optical comb is distributed, by modulating the light rays of the basic optical comb. The light rays of the basic optical comb and the light rays included in the other optical combs are sequentially emitted according to frequencies of the light rays of the basic optical comb and the light rays included in the other optical combs.

Abstract: Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.