Patents by Inventor Janpen Phimphuang

Janpen Phimphuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10763130
    Abstract: Systems and methods are provided for producing an integrated circuit package, e.g., an SOIC package, having reduced or eliminated lead delamination caused by epoxy outgassing resulting from the die attach process in which an integrated circuit die is attached to a lead frame by an epoxy. The epoxy outgassing may be reduced by heating the epoxy during or otherwise in association with the die attach process, e.g. using a heating device provided at the die attach unit. Heating the epoxy may achieve additional cross-linking in the epoxy reaction, which may thereby reduce outgassing from the epoxy, which may in turn reduce or eliminate subsequent lead delamination. A heating device located at or near the die attach site may be used to heat the epoxy to a temperature of 55° C.±5° C. during or otherwise in association with the die attach process.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: September 1, 2020
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Taweesak Laevohan, Philbert Reyes, Jaggrit Vilairat, Sutee Thanaisawn, Janpen Phimphuang, Somsak Chunpangam
  • Publication number: 20180308713
    Abstract: Systems and methods are provided for producing an integrated circuit package, e.g., an SOIC package, having reduced or eliminated lead delamination caused by epoxy outgassing resulting from the die attach process in which an integrated circuit die is attached to a lead frame by an epoxy. The epoxy outgassing may be reduced by heating the epoxy during or otherwise in association with the die attach process, e.g. using a heating device provided at the die attach unit. Heating the epoxy may achieve additional cross-linking in the epoxy reaction, which may thereby reduce outgassing from the epoxy, which may in turn reduce or eliminate subsequent lead delamination. A heating device located at or near the die attach site may be used to heat the epoxy to a temperature of 55° C.±5° C. during or otherwise in association with the die attach process.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 25, 2018
    Applicant: Microchip Technology Incorporated
    Inventors: Taweesak Laevohan, Philbert Reyes, Jaggrit Vilairat, Sutee Thanaisawn, Janpen Phimphuang, Somsak Chunpangam