Patents by Inventor Jaspreet Singh SIDHU

Jaspreet Singh SIDHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220140176
    Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Applicant: STMicroelectronics Asia Pacific Pte Ltd
    Inventors: Jaspreet Singh SIDHU, Tat Ming TEO