Patents by Inventor Jay S. Salmon
Jay S. Salmon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9961452Abstract: In one embodiment a micro-electro-mechanical system (MEMS) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a MEMS die located above the ring trench, a copper pillar ring extending between the metal ring and the MEMS die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.Type: GrantFiled: April 17, 2015Date of Patent: May 1, 2018Assignees: Akustica, Inc., Robert Bosch GmbHInventor: Jay S. Salmon
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Publication number: 20170113926Abstract: A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing.Type: ApplicationFiled: November 1, 2016Publication date: April 27, 2017Inventors: Eric Ochs, Jay S. Salmon, Ricardo Ehrenpfordt
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Publication number: 20170048625Abstract: In one embodiment a micro-electro-mechanical system (MEMS) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a MEMS die located above the ring trench, a copper pillar ring extending between the metal ring and the MEMS die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.Type: ApplicationFiled: April 17, 2015Publication date: February 16, 2017Inventor: Jay S. Salmon
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Publication number: 20160137490Abstract: A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.Type: ApplicationFiled: January 18, 2016Publication date: May 19, 2016Inventors: Eric Ochs, Jay S. Salmon
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Patent number: 9238579Abstract: A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.Type: GrantFiled: March 14, 2013Date of Patent: January 19, 2016Assignee: Robert Bosch GmbHInventors: Eric Ochs, Jay S. Salmon
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Patent number: 9002038Abstract: A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.Type: GrantFiled: September 10, 2013Date of Patent: April 7, 2015Assignee: Robert Bosch GmbHInventors: Eric Ochs, Jay S. Salmon
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Publication number: 20140072151Abstract: A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.Type: ApplicationFiled: September 10, 2013Publication date: March 13, 2014Applicant: Robert Bosch GmbHInventors: Eric Ochs, Jay S. Salmon
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Publication number: 20130256815Abstract: A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.Type: ApplicationFiled: March 14, 2013Publication date: October 3, 2013Applicant: ROBERT BOSCH GMBHInventors: Eric Ochs, Jay S. Salmon
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Publication number: 20130147040Abstract: A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing.Type: ApplicationFiled: December 9, 2011Publication date: June 13, 2013Applicant: Robert Bosch GmbHInventors: Eric Ochs, Jay S. Salmon, Ricardo Ehrenpfordt