Abstract: Proposed are a freight replacement apparatus and a freight replacement method. According to an embodiment of the present disclosure, the freight replacement apparatus includes an automated loading part configured to load thereon a first freight and to move to a designated position, a transporting part configured to load thereon a second freight different from the first freight and to transfer the second freight, a buffer part disposed between the automated loading part and the transporting part, and a replacement part configured to replace the first freight and the second freight together with the buffer part. Therefore, damage to freight may be prevented, and a replacement speed between different freights may be increased.

Abstract: A camera module includes a housing having an internal space; a carrier disposed in the internal space; a lens module disposed in the carrier; a guide frame disposed between the carrier and the lens module; a first ball member and a second ball member disposed between the housing and the carrier, spaced apart from each other in a diagonal direction of the housing and the carrier, and configured to guide a movement of the carrier in a direction of an optical axis; and a third ball member disposed between the carrier and the guide frame, and a fourth ball member disposed between the guide frame and the lens module, and configured to guide a movement of the lens module in a direction perpendicular to the optical axis direction, wherein the third ball member and the fourth ball member do not overlap each other in the optical axis direction.

Abstract: A camera module includes a housing having an internal space; a carrier disposed in the internal space; a lens module provided in the carrier; and a first ball member and a second ball member, disposed between the carrier and the housing and spaced apart in a direction, perpendicular to an optical axis, wherein a virtual line connecting a center of a ball included in the first ball member and a center of a ball included in the second ball member passes through the lens module, wherein the lens module includes a first avoidance portion securing space in which at least one of the first ball member or the second ball member is disposed.

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

Abstract: A camera module includes a lens unit including at least one lens, a first carrier configured to accommodate a portion of the lens unit and move in an optical axis direction, a second carrier configured to accommodate the first carrier and move in a direction perpendicular to the optical axis, and a connection substrate disposed to surround a side surface of the second carrier, wherein a first ball group and a second ball group spaced apart from each other in a direction perpendicular to the optical axis, are included between the first carrier and the second carrier, the number of balls of the first ball group is greater than the number of balls of the second ball group, and the connection substrate is disposed to surround the second carrier toward the second ball member.

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

Abstract: The inventive concept relates to an apparatus and a method for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: The inventive concept relates to an apparatus and a method for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber configured to form a treatment space, a gas supply unit configured to supply a process gas into an interior of the process chamber, a plasma generating unit configured to generate plasma from the process gas introduced into the interior of the process chamber, and a substrate support unit provided in the treatment space and configured to support a substrate, the substrate support unit may include a first plate, and a second plate that is adjacent to the first plate, and a gap may be formed between the first plate and the second plate, and a supply pipe is configured to supply a gas into the space defined by the gap.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: The inventive concept relates to an apparatus for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

Abstract: According to the present invention, a reaction-type turbine includes: a housing including a housing passage between an inlet and an outlet; a turbine shaft rotatably coupled to the housing to transmit torque; and at least one nozzle assembly coupled to the turbine shaft and rotatably provided in the housing passage. The nozzle assembly includes circumferential injection holes therein for injecting a high-pressure fluid in a circumferential direction and generating torque. Accordingly, when turbines having different capacities are manufactured, common parts can be compatibly used and assembling efficiency is improved. In addition, the eccentric rotation of the turbine shaft is prevented to significantly improve the durability of the reaction-type turbine. Furthermore, since the injection holes are long, the reaction-type turbine can be miniaturized and the efficiency thereof is improved.