Patents by Inventor Je Sang Park

Je Sang Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11075156
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
  • Publication number: 20210193580
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.
    Type: Application
    Filed: March 13, 2020
    Publication date: June 24, 2021
    Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Ki Ho NA, Je Sang PARK, Yong Duk LEE, Jin Won LEE
  • Publication number: 20210193563
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 24, 2021
    Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
  • Publication number: 20210193609
    Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
    Type: Application
    Filed: February 28, 2020
    Publication date: June 24, 2021
    Inventors: Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na, Je Sang Park, Yong Duk Lee, Yoo Rim Cha, Yeo Il Park
  • Publication number: 20210183783
    Abstract: A substrate with an electronic component embedded therein includes a core substrate including an insulating body having a first surface and a second surface, opposite to the first surface, a first wiring layer embedded in the insulating body such that one surface thereof is exposed from the first surface, and a second wiring layer disposed on the insulating body to protrude on the second surface, the core substrate having a cavity penetrating a portion of the insulating body from the first surface toward the second surface and having a stopper layer as a bottom surface thereof; an electronic component disposed on the stopper layer in the cavity; a first insulating material covering at least a portion of each of the core substrate and the electronic component; and a third wiring layer disposed on the first insulating material.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 17, 2021
    Inventors: Je Sang Park, Chang Yul Oh, Sang Ho Jeong, Yong Duk Lee
  • Publication number: 20210183784
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 17, 2021
    Inventors: Mi Sun HWANG, Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Jun Hyeong JANG, Ki Ho NA, Je Sang PARK, Yong Duk LEE, Yoo Rim CHA, Yeo Il PARK
  • Publication number: 20210183774
    Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.
    Type: Application
    Filed: March 10, 2020
    Publication date: June 17, 2021
    Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Je Sang PARK, Mi Sun HWANG, Yong Duk LEE, Jin Won LEE, Yeo Il PARK
  • Publication number: 20210175159
    Abstract: A substrate having an electronic component embedded therein includes a core substrate including first and second wiring layers disposed on different levels and one or more insulating layers disposed between the first and second wiring layers, having a cavity in which a stopper layer is disposed on a bottom surface of the cavity, and including a groove disposed around the stopper layer on the bottom surface; an electronic component disposed on the stopper layer in the cavity; an insulating material covering at least a portion of each of the core substrate and the electronic component and disposed in at least a portion of each of the cavity and the groove; and a third wiring layer disposed on the insulating material. The stopper layer protrudes on the bottom surface.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 10, 2021
    Inventors: Je Sang PARK, Chang Yul OH, Sang Ho JEONG, Yong Duk LEE
  • Patent number: 10925163
    Abstract: A printed circuit board includes an insulating layer including a cavity including a groove structure formed on one surface of the insulating layer, a circuit pattern including a first pad formed on a bottom surface of the cavity and a second pad formed inside the insulating layer, a first metal layer embedded in a side surface of the cavity, the first metal layer being in contact with the bottom surface of the cavity and being formed along the boundary of the cavity, and a second metal layer formed on the second pad and having a stepped structure formed with the second pad.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: February 16, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Sang Park, Sang Ho Jeong
  • Publication number: 20200396839
    Abstract: A printed circuit board includes an insulating layer including a cavity including a groove structure formed on one surface of the insulating layer, a circuit pattern including a first pad formed on a bottom surface of the cavity and a second pad formed inside the insulating layer, a first metal layer embedded in a side surface of the cavity, the first metal layer being in contact with the bottom surface of the cavity and being formed along the boundary of the cavity, and a second metal layer formed on the second pad and having a stepped structure formed with the second pad.
    Type: Application
    Filed: January 10, 2020
    Publication date: December 17, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Sang PARK, Sang Ho JEONG
  • Patent number: 10863627
    Abstract: An electronic component-embedded substrate of the present disclosure includes a core structure including an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer and a through-portion passing through the insulating layer; a first electronic component disposed in the through-portion and including a connection electrode; an insulator disposed in a portion of the through-portion between the core structure and a portion of the first electronic component; and a first metal layer disposed on an upper surface of the insulator. At least a portion of the first metal layer is included on the first wiring layer and physically in contact with at least a portion of the connection electrode.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Sang Park, Sang Ho Jeong, Chang Yul Oh