Abstract: A battery includes, stacked successively above a first face of a support, in a stacking direction, at least a cathode including a lower face, an upper face and a side wall directed in the stacking direction from the lower face to the upper face, a solid electrolyte, an anode, the battery including a coating portion surrounding, and in contact with, all of the side wall of the cathode, without covering the upper face of the cathode.

Abstract: The method for fabricating a device includes the following successive steps: providing a first substrate made from silicon of (100), (110) or (111) orientation, from a material of III-IV type or from a material of II-VI type, provided with at least one salient metal pad, and providing a second substrate; fixing the first substrate with the second substrate, the at least one metal pad forming a blocking means preventing movement beyond a threshold position; and performing an anneal of the metal pad so as to melt the metal pad and eliminate the blocking means.

Abstract: A reusable assembly mould, to manufacture a three-dimensional device comprising several microelectronic components vertically stacked, comprising a main cavity, formed by a bottom and a side wall, and configured to receive at least two stacked elementary structures, each elementary structure comprising a brittle substrate covered with a microelectronic component and with electrical contacts, disposed on the edge of the substrate, the assembly mould being of a deformable material able to undergo a non-permanent deformation from 10 to 1000% relative to its initial shape, preferentially from 50 to 200% relative to its initial shape, the assembly mould further comprising a clearance positioned along the side wall of the main cavity to facilitate handling of the first elementary structure and/or of the second elementary structure and/or to inject an element along the main cavity.

Abstract: Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Abstract: The assembly has a central block that includes a first main face, a second main face and side faces. The second main face is opposite to the first main face, and the side faces connect the first main face to the second main face. The assembly also includes a first cover arranged on the first main face. The first main face and a first external surface of the first cover form a first groove for housing a first wire element, and the first groove extends along an entire length of the first main face. The assembly further includes a second cover arranged on the second main face. The second main face and a second external surface of the second cover form a second groove for housing a second wire element, and the second groove extends along an entire length of the second main face.

Abstract: A fabrication method of a sheathed yarn includes the following steps: making a core run axially through a sheathing area; winding a sheathing fibre around the core in the sheathing area; and presenting a microelectronic chip fixed onto the core in the sheathing area. A polymer material is present between the microelectronic chip and the core when the sheathing step is performed. The polymer material creeps during the sheathing step to form a protective coating.

Abstract: Encapsulated microbattery comprising a microbattery supported by a substrate, an encapsulation cover which comprises a first face in contact with the microbattery and the substrate, said first face comprising a central zone and a peripheral zone surrounding the central zone, the central zone being in contact with the microbattery and the peripheral zone being in contact with at least the substrate. The encapsulation cover comprises cavities in fluid communication with the central zone of the first face, the cavities being configured to collect at least one gaseous element generated by the microbattery during its operation.

Abstract: A fabrication method of the device includes provision of a first stack including: a first substrate including at least one main surface provided with at least a first electric contact area, a second substrate provided with a salient spacer. The first substrate is assembled with the second substrate so as to define at least a first lateral groove including the first electric contact area, the first lateral groove being bounded by the first substrate, the second substrate and the spacer includes at least a first protuberance arranged to form a stop and to limit movement of the spacer relatively to the first substrate in at least a first direction passing via the first lateral groove and the spacer and a second direction parallel the longitudinal axis of the first groove and perpendicular to the first direction.

Abstract: The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).

Abstract: A fabrication method of a sheathed yarn includes the following steps: making a core run axially through a sheathing area; winding a sheathing fibre around the core in the sheathing area; and presenting a microelectronic chip fixed onto the core in the sheathing area. A polymer material is present between the microelectronic chip and the core when the sheathing step is performed. The polymer material creeps during the sheathing step to form a protective coating.

Abstract: Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Abstract: Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5?) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

Abstract: This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim.

Abstract: The assembly has a central block that includes a first main face, a second main face and side faces. The second main face is opposite to the first main face, and the side faces connect the first main face to the second main face. The assembly also includes a first cover arranged on the first main face. The first main face and a first external surface of the first cover form a first groove for housing a first wire element, and the first groove extends along an entire length of the first main face. The assembly further includes a second cover arranged on the second main face. The second main face and a second external surface of the second cover form a second groove for housing a second wire element, and the second groove extends along an entire length of the second main face.

Abstract: A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.

Abstract: The photovoltaic cell has a block that includes at least one semiconductor substrate in which is formed at least one photovoltaic junction that is connected to a first electrical contact element of a first pole and to a second electrical contact element of a second pole. The cell includes a first transparent cover that is placed on a first surface of the block and defines with the block of the cell a first recess groove of a first electrically conductive wire element.

Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5?) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

Abstract: A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.

Abstract: This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim.