Patents by Inventor Jean-Charles Souriau

Jean-Charles Souriau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210378101
    Abstract: A flexible electronic structure includes a first film, made of a first polymer or glass, and a second film, made of a second polymer, in which at least one electronic component is arranged. The second film covers the first film. The flexible electronic structure also includes at least one electrically conductive track arranged between the first film and the second film, and each electrically connected to one of the electronic components, by a respective interconnection element. Optionally, the flexible electronic structure includes a third film, made of a third polymer or glass, covering the second film. The interconnection element is arranged near the neutral plane of the structure, and the structure includes at least one compensation layer, so as to position the neutral plane at a desired location.
    Type: Application
    Filed: July 29, 2019
    Publication date: December 2, 2021
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Charles SOURIAU, Xavier BAILLIN
  • Patent number: 11179727
    Abstract: The invention relates to a method for integrating structures in a support, which comprises the steps: a) supplying a support comprising a front face and a rear face, and through cavities each delimited by a wall designated through wall; b) inserting into each of the through cavities a structure, provided with a first face and a second face connected by a contour, the first face and the front face being coplanar, the through cavities and/or the structures being laid out to leave a peripheral space; c) filling the peripheral space with a sealing material so as to maintain the structures to the support; The peripheral space has a radial extension length which decreases from the rear face to the front face.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: November 23, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Charles Souriau, Olivier Constantin
  • Publication number: 20200023368
    Abstract: The invention relates to a method for integrating structures in a support, which comprises the steps: a) supplying a support comprising a front face and a rear face, and through cavities each delimited by a wall designated through wall; b) inserting into each of the through cavities a structure, provided with a first face and a second face connected by a contour, the first face and the front face being coplanar, the through cavities and/or the structures being laid out to leave a peripheral space; c) filling the peripheral space with a sealing material so as to maintain the structures to the support; The peripheral space has a radial extension length which decreases from the rear face to the front face.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 23, 2020
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Jean-Charles SOURIAU, Olivier Constantin
  • Patent number: 10173890
    Abstract: A box for a microelectronic device includes a first portion and a second portion able to be assembled in order to define, in an assembled position, a housing space for the microelectronic device. A face of the first portion is facing a face of the second portion in the assembled position. The first zones facing the faces form an interface for attaching the first portion and second portion. The second zones face faces forming a cavity for receiving the microelectronic device. At least one among the first portion and the second portion includes at least one element for electrical connection. The first portion and the second portion can apply at least one connection pad of the microelectronic device on the element for connection in the assembled position.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: January 8, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Jean-Charles Souriau
  • Publication number: 20180037454
    Abstract: A box for a microelectronic device includes a first portion and a second portion able to be assembled in order to define, in an assembled position, a housing space for the microelectronic device. A face of the first portion is facing a face of the second portion in the assembled position. The first zones facing the faces form an interface for attaching the first portion and second portion. The second zones face faces forming a cavity for receiving the microelectronic device. At least one among the first portion and the second portion includes at least one element for electrical connection. The first portion and the second portion can apply at least one connection pad of the microelectronic device on the element for connection in the assembled position.
    Type: Application
    Filed: June 21, 2017
    Publication date: February 8, 2018
    Applicant: Commissariat A L'energie Atomique Et Aux Energies Alternatives
    Inventor: Jean-Charles SOURIAU
  • Patent number: 9768518
    Abstract: A microelectronic wireless transmission device including: a substrate able to be traversed by radio waves intended to be emitted by the device, an antenna, an electrical power supply, an integrated circuit, electrically connected to the antenna and to the electrical power supply, and able to transmit to the antenna electrical signals intended to be emitted by the antenna in the form of the said radio waves, a cap rigidly connected to the substrate and forming, with the substrate, at least one cavity in which the antenna and the integrated circuit are positioned, where the cap comprises an electrically conductive material connected electrically to an electrical potential of the electrical power supply and/or of the integrated circuit, and able to form a reflector with regard to the radio waves intended to be emitted by the antenna.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: September 19, 2017
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Jean-Charles Souriau, Leaticia Castagne, Guy-Michel Parat
  • Patent number: 8928141
    Abstract: A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: January 6, 2015
    Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
    Inventor: Jean-Charles Souriau
  • Patent number: 8853845
    Abstract: A component including at least one active element hermetically encapsulated in a cavity formed between a support and a cover, in which the support and the cover are made from an electrically conductive material, and are insulated electrically from one another, and include a first electrical connection between the active element and the support, and a second electrical connection, separate from the first connection, between the active element and the cover, and in which: the active element is securely attached to the support through a dielectric layer positioned between the support and the active element, and between the support and the cover; the second electrical connection includes a second portion of electrically conductive material electrically connected to the cover, positioned on the dielectric layer and electrically in contact with an electrically conductive sealing bead providing hermetic secure attachment of the cover to the support.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: October 7, 2014
    Assignees: Commissariat a l'energie atomique et aux energies alternatives, Sorin CRM S.A.S.
    Inventors: Jean-Charles Souriau, Guy-Michel Parat, Renzo Dal Molin
  • Publication number: 20130313704
    Abstract: A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area.
    Type: Application
    Filed: January 31, 2012
    Publication date: November 28, 2013
    Inventor: Jean-Charles Souriau
  • Publication number: 20130296658
    Abstract: A component including at least one active element hermetically encapsulated in a cavity formed between a support and a cover, in which the support and the cover are made from an electrically conductive material, and are insulated electrically from one another, and include a first electrical connection between the active element and the support, and a second electrical connection, separate from the first connection, between the active element and the cover, and in which: the active element is securely attached to the support through a dielectric layer positioned between the support and the active element, and between the support and the cover; the second electrical connection includes a second portion of electrically conductive material electrically connected to the cover, positioned on the dielectric layer and electrically in contact with an electrically conductive sealing bead providing hermetic secure attachment of the cover to the support.
    Type: Application
    Filed: March 18, 2013
    Publication date: November 7, 2013
    Applicant: Commissariat a l'energie atomique et aux ene alt
    Inventors: Jean-Charles Souriau, Guy-Michel Parat, Renzo Dal Molin
  • Patent number: 8466568
    Abstract: The invention relates to an electronic device, having a front face 8 and a rear face 8?, fitted with at least one discrete integrated component, comprising: a) the active face 10 of the component appearing to the side of the front face 8; b) coating material 3, present at least laterally relative to the component, ensuring the so-called component is held in the device; and c) an insulating buffer layer 6, absent from the active face 10 of the component, separating the coating material 3 from this component 4.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: June 18, 2013
    Assignee: Commissariat a l'Energie Atomique
    Inventor: Jean-Charles Souriau
  • Patent number: 8409971
    Abstract: An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: April 2, 2013
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean-Charles Souriau, Francois Baleras
  • Patent number: 8288841
    Abstract: A handle wafer for microelectronic functional wafers, including at least one cavity through the thickness of the wafer, this cavity including a viewing window in solid or solidified material.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: October 16, 2012
    Assignee: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventors: Jean-Charles Souriau, Stéphane Caplet
  • Patent number: 8246184
    Abstract: A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls (38) of the cavities (40) are formed by plasma etching of a layer of transparent or light absorbent material (30, 34) transferred onto a microtechnological substrate, the walls (38) having a structured profile in order to limit the parasitic phenomena of light diffusion and diffraction.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: August 21, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean-Charles Souriau, Nicolas Sillon, Jean-Pierre Joly
  • Patent number: 8159076
    Abstract: A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: April 17, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Francois Baleras, Jean-Charles Souriau, David Henry
  • Patent number: 8039285
    Abstract: A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least one part; raising a temperature up to at least one removal temperature; and moving the protective material towards the reaction material by reaction between the protective material and the reaction material so that at least one portion of the part of the getter material is no longer covered with the protective material.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: October 18, 2011
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Jean-Charles Souriau, Elisabeth Delevoye, Francois Baleras, David Henry
  • Patent number: 8039306
    Abstract: A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: October 18, 2011
    Assignee: Commissariat A l'Energie Atomique
    Inventors: François Baleras, Jean-Charles Souriau, Gilles Poupon, Sophie Verrun
  • Publication number: 20110006400
    Abstract: The invention relates to a method for making a handle wafer (20?) for microelectronic functional wafers, including at least one transparent window (22, 24) for viewing through the thickness of the handle wafer, this method including: a) the making of at least one cavity (21, 23) in said handle wafer, b) the formation of at least one viewing window in said cavity on an alignment or receiving surface.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 13, 2011
    Applicant: Comm. á I'éner. atom. et aux énergies alter.
    Inventors: Jean-Charles SOURIAU, Stéphane Caplet
  • Publication number: 20100195299
    Abstract: An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities. The invention relates to an electronic device with integrated discrete components (4), including: a wafer (2), a so-called receiving wafer, said wafer having cavities (5, 5?) containing said components, the active face (10) of which is in a same plane as a face (8) of the receiving wafer, a material (6) for laterally coating the components in the cavities.
    Type: Application
    Filed: June 5, 2008
    Publication date: August 5, 2010
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE
    Inventors: Jean-Charles Souriau, Francois Baleras
  • Publication number: 20100181679
    Abstract: A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
    Type: Application
    Filed: June 5, 2008
    Publication date: July 22, 2010
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE
    Inventors: Francois Baleras, Jean-Charles Souriau, Gilles Poupon, Sophie Verrun