Abstract: A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.

Abstract: A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.

Abstract: A device including: a first layer of material; a second layer of material disposed as a sealing layer; walls disposed to interconnect the first layer and second layer, wherein cavities are formed by the first layer, the second layer, and the walls; a fluid at least partially filling the cavities; and blocks integrally connected to the first layer of material, and defining housings filled at least partially with the material of the second layer and not including any of the fluid.

Abstract: The invention relates to an electronic device, having a front face 8 and a rear face 8?, fitted with at least one discrete integrated component, comprising: a) the active face 10 of the component appearing to the side of the front face 8; b) coating material 3, present at least laterally relative to the component, ensuring the so-called component is held in the device; and c) an insulating buffer layer 6, absent from the active face 10 of the component, separating the coating material 3 from this component 4.

Abstract: A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls (38) of the cavities (40) are formed by plasma etching of a layer of transparent or light absorbent material (30, 34) transferred onto a microtechnological substrate, the walls (38) having a structured profile in order to limit the parasitic phenomena of light diffusion and diffraction.

Abstract: The invention relates to a method of maintaining the optimal properties of a thin film getter (10) in a cavity (8) of a microelectronic device (1), consisting in coating the getter film (10) with a protective film (12) and installing a reaction element (14). According to the invention, an increase in temperature, while the cavity (8) may be placed under vacuum, causes the protective film (12) to react with the reaction element (14), such that the protective material (12) moves towards the reaction element (14) and releases the getter film of getter material (10).

Abstract: The invention relates to a device (22) comprising a first layer of material (10), a second layer of material (20) and walls (14) defining tight cavities (16) between the first and second layers of material, at least partially filled with a fluid (18), blocks (50, 60) rigidly connected to the first layer of material (10), and defining a housing (500) filled at least partially (V) of the material of the second layer (20). According to the invention, the housings (500) of the blocks each form an adhesion point of a sealing material (20) of the cavities (16).

Abstract: Optical arrangement comprising two parallel plates each with a through-hole forming an optical input/output with a given optical axis and one at least partly optical component placed between the plates, the component and the first plate comprising first fastening studs placed transversely in opposite relationship of the plate and connected by first bumps made of a meltable material that when molten is able to selectively wet these first fastening studs in order to optically align the component and the input/output on the first plate, and the two plates comprising second fastening studs placed transversely in opposite relationship of the plate and connected by second bumps made of a meltable material that when molten is able to selectively wet the second fastening studs in order to optically align the inputs/outputs of the two plates.

Abstract: Given a component comprising at least one active area formed on a substrate and designed to be coupled to a light guide, a support is used, at least one hole is formed in the support starting from one face of this support, this hole being designed to receive one end of the guide, the substrate is fixed to the other face of the support by forming the hole facing the active area if the active area has already been formed, and otherwise it is formed on the substrate facing the hole and the end of the guide is placed in the hole. The optical system is obtained by optically coupling two devices thus obtained.

Abstract: A method of manufacturing an anisotropic conductive polymer film on a semiconductor wafer including on one surface a layer of passivation in which at least one opening is made to allow access to a contact pad. The method can be applied to creating components (chips, integrated circuits) with high-density interconnections.

Abstract: The invention relates to a method of manufacturing anisotropic conductive polymer film (23 and 24) on a semiconductor wafer (T) comprising, on one surface, a layer of passivation (12) in which at least one opening is made to allow access to a contact pad (11).

Abstract: Optical arrangement comprising two parallel plates 3, 5 each with a through-hole 3A, 5A forming an optical input/output with a given optical axis and one at least partly optical component 4 placed between the plates, the component and the first plate comprising first fastening studs 8 placed transversely in opposite relationship of the plate and connected by first bumps 7 made of a meltable material that when molten is able to selectively wet these first fastening studs in order to optically align the component and the input/output on the first plate, and the two plates comprising second fastening studs 11 placed transversely in opposite relationship of the plate and connected by second bumps 10 made of a meltable material that when molten is able to selectively wet the second fastening studs in order to optically align the inputs/outputs of the two plates.

Abstract: Given a component (2) comprising at least one active area (8) formed on a substrate (4) and designed to be coupled to a light guide (18), a support (12) is used, at least one hole (14) is formed in the support starting from one face of this support, this hole being designed to receive one end of the guide, the substrate is fixed to the other face of the support by forming the hole facing the active area if the active area has already been formed, and otherwise it is formed on the substrate facing the hole and the end of the guide is placed in the hole. The optical system is obtained by optically coupling two devices thus obtained.

Abstract: A vacuum field emitter device is manufactured by assembling elements of the device, including at least one getter, under a vacuum or a controlled atmosphere. The assembly step includes a step in which elements are positioned, an oven drying step and a device sealing step. Each getter is hydrogenated after the oven drying. The manufacturing process has applications in the manufacture of television screens.