Abstract: An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body.

Abstract: A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.

Abstract: An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.

Abstract: The present disclosure relates to a light-emitting device comprising: a light source mounted on a substrate; a wire for providing a supply voltage or activation signal to the light source, a cap covering the light source and having a diffuser adapted to diffuse light generated by the light source; and either: a volume of glue fixing an intermediate section of the wire to the cap; or an arm fixed to the cap and extending between the intermediate section of the wire and the substrate.

Abstract: An electronic chip includes an integrated optical-wave guide having an end section that extends parallel to a face of the electronic chip. A local groove provided in the electronic chip extends adjacent to the end section of the integrated optical-wave guide. An elongate optical cable includes an optical-wave guide and has an end portion that is at least partially engaged in the local groove. The end portion of the elongate optical cable is configured to support an optical coupling of the optical-wave guide to the integrated optical-wave guide via lateral coupling in a zone of the local groove. An exterior package is provided to house the electronic chip.

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body, each pin abutting one of said surfaces.

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a barrel comprising a mounting for a diffuser; and a diffuser positioned in the mounting, wherein the barrel comprises first and second conducting columns and a fuse or conductive wire electrically coupling the first and second conducting columns. A portion of the fuse is mechanically fixed to the diffuser and/or the fuse being arranged to trap the diffuser in said mounting.

Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having one or more conductive paths arranged to electrically connect the first and second conducting columns when the diffuser is mounted on the barrel.

Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.

Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.

Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.

Abstract: A main carrier wafer includes a first integrated network of electronic connections between front and back faces. A first electronic chip is mounted to the front face of the main carrier wafer and connected to the network of electronic connections of the main carrier wafer. A secondary carrier wafer includes a platform that extends over the first chip and a base the protrudes backwards with respect to the platform to a back end face facing the main wafer. A second integrated network of electronic connections is provided within the secondary carrier wafer. A second electronic chip is mounted on top of the platform and connected to the second integrated network. The second integrated network is further connected to the main carrier wafer at the back end face.

Abstract: Individual electronic units are formed by cutting a collective assembly. A collective support plate is provided which includes electronic chips. A collective cover plate is provided which includes ribs defining recesses. The collective assembly is formed by mounting the collective cover plate to the collective support plate in a manner where the electronic chips are located in the recesses and the ribs are located between electronic chips. A bead of glue is interposed between ends of the ribs and the surface of the collective support plate. After the glue is hardened, a cutting operation is performed on the collective assembly by cutting through the ribs and the collective support plate to produce the individual electronic units.

Abstract: A cover for an electronic circuit package, including an element having peripheral portions housed in an inner groove of a through opening.

Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.

Abstract: An electronic circuit including a cover crossed by an element and having a planar main inner surface.

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.