Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract: This invention describes a low-cost, lightweight, high-performance composite bipolar plate for fuel cell applications. The composite bipolar plate can be produced using stamped or pressed into the final form including flow channels and other structures prior to curing.

Abstract: The present invention includes an injection moldable/extrudable composite that preserves at least 80% or enhances the primary physical properties of compression molded polymer, the composite comprising, e.g., an Ultra High Molecular Weight Polyethylene (UHMWPE) and graphene/graphite oxide or graphene oxide, with or without polypropylene.

Abstract: The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm2, and a device made by the method.

Abstract: The present invention includes a method of making a thermal management and signal control structure comprising forming in a substrate heat conductive vias and control vias, power vias, and ground vias, wherein the heat conductive vias and the control vias, power vias, and vias are aligned to a first metal plate on a first side of the substrate, wherein the control vias, power vias, and ground vias are surrounded by a glass layer; forming a second metal plate on a second side of the substrate, wherein the second metal plate is connected to the heat conductive vias; and forming a pad on each of the control vias, power vias, and ground vias, wherein each pad is configured to electrically connect the thermal management and signal control structure to at least one of: a printed circuit board, an integrated circuit, or a power management unit.

Abstract: The present method includes graphene, preferably in the form of flat graphene oxide flakes with, by mass, preferably between 0.5% and 35% PAN. The graphene oxide and conductive-polymer PAN is in a co-suspension in water and is co-deposited on a surface. The deposited PAN with a high-percentage graphene-oxide layer is dried. Our tests have produced electrical conductivities 1000 times more conductive than the PAN by itself. Our testing indicates that using flakes that are flat is essential to getting very high conductivity, and that controlled oxidation is very important in suspending graphene oxide in water.

Abstract: Graphene has been used in nanocomposites as constituents/doping in plastics or epoxy providing dramatic enhancement of the mechanical properties but have not progressed past the laboratory level novelty. This invention can provide a graphene based composite structure with a density less that 1.9 g/cm3 for a fiber, yarn, rope or cable and a density less that 1.5 g/cm3 for a sheet both structure have tensile and shear strength greater than either Aluminum or Steel; thus providing a graphene material that is both much lighter and stronger.

Abstract: The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

Abstract: A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

Abstract: This is generally a method of producing graphene-containing suspensions of flakes of high quality graphene/graphite oxides and method of producing graphene/graphite oxides. Both the exfoliating graphite into flakes and oxidizing the graphite flakes and the preparation and suspension of the flakes can be done with high volume production and at a low cost.

Abstract: The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

Abstract: The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

Abstract: A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

Abstract: The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

Abstract: Existing methods of extrusion and other techniques to compound host and additives material uniformly disperse the additive in the host. This innovation uses ball milling to a coat a host particle with an additive dramatically reducing the additive required to achieve a percolative network in the host.

Abstract: The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.

Abstract: A method of making capacitive device in or on a photodefinable glass substrate comprising: a first electrode comprising: one or more copper columns each with patterned or textured surfaces; and one or more rows of a Resistor Inductor Diode (RLD) in contact with the one or more copper columns, wherein the one or more rows of the RLD are tied together in parallel; a dielectric material in contact with the one or more copper columns and in contact with the one or more rows of the RLD; and a second electrode comprising: one or more copper columns each with patterned or textured surfaces; and one or more rows or columns of the RLD in contact with the one or more copper columns, wherein the one or more rows or columns of the RLD are tied together in parallel.

Abstract: The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.

Abstract: The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.

Abstract: The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.