Patents by Inventor Jeff Ou-Yang

Jeff Ou-Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR THE BONDING OF DISK-SHAPED SUBSTRATES AND APPARATUS FOR CARRYING OUT THE METHOD
    Publication number: 20080053620
    Abstract: A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facing second bonding surface (12b) to a cover (3) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin (9) is extended through central openings (14a, 14b) of the substrates (11a, 11b) and then retracted with the second substrate (11b) released from the cover (3) and carried by radially extended balls (10). The support pin (9) is lowered to a position where the balls (10), acting against the first bonding surface (12a), deform the first substrate (11a). The first bonding surface (12a) being therefore slightly concave, the first and second bonding surfaces (12a, 12b) only touch close to their circumferences.
    Type: Application
    Filed: November 2, 2007
    Publication date: March 6, 2008
    Applicant: OC Oerlikon Balzers AG
    Inventors: Thomas Eisenhammer, Jeff Ou-Yang
  • Method for the bonding of disk-shaped substrates and apparatus for carrying out the method
    Patent number: 7311795
    Abstract: A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facing second bonding surface (12b) to a cover (3) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin (9) is extended through central openings (14a, 14b) of the substrates (11a, 11b) and then retracted with the second substrate (11b) released from the cover (3) and carried by radially extended balls (10). The support pin (9) is lowered to a position where the balls (10), acting against the first bonding surface (12a), deform the first substrate (11a). The first bonding surface (12a) being therefore slightly concave, the first and second bonding surfaces (12a, 12b) only touch close to their circumferences.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: December 25, 2007
    Assignee: OC Oerlikon Balzers AG
    Inventors: Thomas Eisenhammer, Jeff Ou-Yang
  • Method for the bonding of disk-shaped substrates and apparatus for carrying out the method
    Publication number: 20050039841
    Abstract: A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facing second bonding surface (12b) to a cover (3) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin (9) is extended through central openings (14a, 14b) of the substrates (11a, 11b) and then retracted with the second substrate (11b) released from the cover (3) and carried by radially extended balls (10). The support pin (9) is lowered to a position where the balls (10), acting against the first bonding surface (12a), deform the first substrate (11a). The first bonding surface (12a) being therefore slightly concave, the first and second bonding surfaces (12a, 12b) only touch close to their circumferences.
    Type: Application
    Filed: March 18, 2004
    Publication date: February 24, 2005
    Applicant: Unaxis Balzers AG
    Inventors: Thomas Eisenhammer, Jeff Ou-Yang