Patents by Inventor Jeffery H. Burkhart

Jeffery H. Burkhart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level shim processing
    Patent number: 11393869
    Abstract: An integrated circuit assembly including a first wafer bonded to a second wafer with an oxide layer, wherein a first surface of the first wafer is bonded to a first surface of the second wafer. The assembly can include a bonding oxide on a second surface of the second wafer, wherein a surface of the bonding oxide is polished. The assembly can further include a shim secured to the bonding oxide on the second surface of the second wafer to reduce bow of the circuit assembly.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: July 19, 2022
    Assignee: Raytheon Company
    Inventors: Jeffery H. Burkhart, Sean P. Kilcoyne, Eric Miller
  • WAFER LEVEL SHIM PROCESSING
    Publication number: 20210043665
    Abstract: An integrated circuit assembly including a first wafer bonded to a second wafer with an oxide layer, wherein a first surface of the first wafer is bonded to a first surface of the second wafer. The assembly can include a bonding oxide on a second surface of the second wafer, wherein a surface of the bonding oxide is polished. The assembly can further include a shim secured to the bonding oxide on the second surface of the second wafer to reduce bow of the circuit assembly.
    Type: Application
    Filed: October 20, 2020
    Publication date: February 11, 2021
    Applicant: Raytheon Company
    Inventors: Jeffery H. Burkhart, Sean P. Kilcoyne, Eric Miller
  • Wafer level shim processing
    Patent number: 10847569
    Abstract: Methods and apparatus for proving a sensor assembly. Embodiments can include employing a circuit assembly having a first layer bonded to a second layer with an oxide layer, depositing bonding oxide on the second layer of the circuit assembly, and thinning the first layer of the circuit assembly after depositing the bonding oxide. A coating can be applied over at least a portion of the first layer of the circuit assembly after annealing the circuit assembly. After polishing the bonding oxide on the second surface of the second layer of the circuit assembly, a shim can be secured to the bonding oxide on the second surface of the second layer of the circuit assembly to reduce bow of the assembly. Embodiments can provide a sensor useful in focal plane arrays.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: November 24, 2020
    Assignee: Raytheon Company
    Inventors: Jeffery H. Burkhart, Sean P. Kilcoyne, Eric Miller
  • WAFER LEVEL SHIM PROCESSING
    Publication number: 20200273893
    Abstract: Methods and apparatus for proving a sensor assembly. Embodiments can include employing a circuit assembly having a first layer bonded to a second layer with an oxide layer, depositing bonding oxide on the second layer of the circuit assembly, and thinning the first layer of the circuit assembly after depositing the bonding oxide. A coating can be applied over at least a portion of the first layer of the circuit assembly after annealing the circuit assembly. After polishing the bonding oxide on the second surface of the second layer of the circuit assembly, a shim can be secured to the bonding oxide on the second surface of the second layer of the circuit assembly to reduce bow of the assembly. Embodiments can provide a sensor useful in focal plane arrays.
    Type: Application
    Filed: February 26, 2019
    Publication date: August 27, 2020
    Applicant: Raytheon Company
    Inventors: Jeffery H. Burkhart, Sean P. Kilcoyne, Eric Miller