Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: A first product as disclosed herein includes multiple devices, such as OLEDs, which are moveably connected to one another. The devices may be moveable from a first position in which they are stacked, closed, rolled, or the like, to a second expanded position in which they may be usable together as a single device. Active areas of the devices may be disposed within 3 mm from each adjacent or included active area when the device is in the first position, the second position, or both. Each active device may include a barrier film that covers at least a portion of the substrate and/or the active area of one or more of the devices.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: A first product as disclosed herein includes multiple devices, such as OLEDs, which are moveably connected to one another. The devices may be moveable from a first position in which they are stacked, closed, rolled, or the like, to a second expanded position in which they may be usable together as a single device. Active areas of the devices may be disposed within 3 mm from each adjacent or included active area when the device is in the first position, the second position, or both. Each active device may include a barrier film that covers at least a portion of the substrate and/or the active area of one or more of the devices.

Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: A first product as disclosed herein includes multiple devices, such as OLEDs, which are moveably connected to one another. The devices may be moveable from a first position in which they are stacked, closed, rolled, or the like, to a second expanded position in which they may be usable together as a single device. Active areas of the devices may be disposed within 3 mm from each adjacent or included active area when the device is in the first position, the second position, or both. Each active device may include a barrier film that covers at least a portion of the substrate and/or the active area of one or more of the devices.

Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Abstract: Devices suitable for close illumination of an object are provided. Such a device includes a highly transparent electrode and a highly reflective, weakly transmissive electrode, with other OLED layers disposed between them. During operation in close proximity to an object, the object is illuminated by the device, while still allowing a user to see through the device.

Abstract: A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

Abstract: A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.

Abstract: Techniques to fabricate and assemble a lighting system including multiple patterned OLED lighting panels to form a high-resolution macro image are provided. An image to be displayed is determined and divided into multiple portions. Patterned static OLED lighting panels that display each portion of the image are fabricated and assembled into a fixture to form a macro-image lighting system. The fixture may removably receive and hold individual panels, such that each panel may be replaced if any malfunction occurs. Each of the patterned OLED panels may be individually driven through an electrical connection within the fixture so as to be operated at substantially the same brightness and/or same chromaticity.

Abstract: A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.

Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.

Abstract: A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

Abstract: Devices including multiple flexible substrates bearing organic light-emitting diodes (OLEDs) are provided. The flexible substrates are interconnected, and the properties of the substrates and the interconnections provide the shape of the device.