Patents by Inventor Jeffrey B. Driscoll

Jeffrey B. Driscoll has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790910
    Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Hyoung-Jun Kim, Hwee Chin Ong, Sang Yup Kim, Raghuram Narayan, Jeffrey B. Driscoll, Woosung Kim
  • Patent number: 10564353
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: February 18, 2020
    Assignee: Intel Corporation
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Patent number: 10444551
    Abstract: Embodiments may relate to a transmission line to be coupled with an electromagnetic waveguide. The transmission line may include a signal node with a first contact, a second contact, and a via between first contact and the second contact. The transmission line may further include a ground node with a third contact, a fourth contact, and a via between the third contact and the fourth contact. Other embodiments may be described or claimed.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 15, 2019
    Assignee: Intel Corporation
    Inventors: Jeffrey B. Driscoll, Ling Liao, David Patel
  • Publication number: 20190149241
    Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.
    Type: Application
    Filed: December 22, 2018
    Publication date: May 16, 2019
    Applicant: Intel Corporation
    Inventors: Hyoung-Jun Kim, Hwee Chin Ong, Sang Yup Kim, Raghuram Narayan, Jeffrey B. Driscoll, Woosung Kim
  • Publication number: 20190146247
    Abstract: Embodiments may relate to a transmission line to be coupled with an electromagnetic waveguide. The transmission line may include a signal node with a first contact, a second contact, and a via between first contact and the second contact. The transmission line may further include a ground node with a third contact, a fourth contact, and a via between the third contact and the fourth contact. Other embodiments may be described or claimed.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 16, 2019
    Applicant: Intel Corporation
    Inventors: Jeffrey B. Driscoll, Ling Liao, David Patel
  • Publication number: 20190129095
    Abstract: Embodiments may relate to a silicon photonic chip, and particularly a back absorber within the silicon photonic chip. The back absorber may include a substrate material with a slab portion that includes a doped portion of the substrate material. The back absorber may be positioned at the backside of a laser that is configured to project light along a waveguide of the silicon photonic chip. Other embodiments may be described or claimed.
    Type: Application
    Filed: December 11, 2018
    Publication date: May 2, 2019
    Applicant: Intel Corporation
    Inventors: Kimchau Nhu Nguyen, George A. Ghiurcan, Yoel Chetrit, Jeffrey B. Driscoll, Richard Jones, Harel Frish, Reece A. Defrees, Wenhua Lin, Jung S. Park
  • Publication number: 20190025512
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 24, 2019
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Patent number: 10054740
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 21, 2018
    Assignee: INTEL CORPORATION
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Publication number: 20180188453
    Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
  • Publication number: 20180059446
    Abstract: Apparatuses, methods and storage medium associated with an optical iso-modulator are disclosed herein. In embodiments, an apparatus may include an optical waveguide formed on one or more layers, such as an isolation layer and a handling layer. A modulator driver may be coupled to a first side of the one or more layers. A magneto-optical (MO) die may be coupled to a second side of the one or more layers that is opposite the first side. Other embodiments may be disclosed and/or claimed.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Inventors: Woosung Kim, John Heck, Haisheng Rong, Jeffrey B. Driscoll, Kimchau N. Nguyen