Patents by Inventor Jeffrey C. Munro

Jeffrey C. Munro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9593237
    Abstract: Disclosed are oil-extended olefin block copolymer compositions with low, or no, tack. A unique comonomer content in the soft segment of the OBC in conjunction with the presence of a polyolefin provides the present oil-extended OBC composition with softness, low (or no) tack, and low (or no) oil-bleed.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: March 14, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Ashish Batra, Dana R. Breed, Pradeep Jain, Jose M. Rego, Robert T. Johnston, Alec Y. Wang, Jeffrey C. Munro
  • Publication number: 20170029588
    Abstract: The present disclosure is directed to a composition and articles containing the composition. The composition comprises a foam and a plurality of gel particles dispersed in the foam. The gel particles comprise an olefin block copolymer and an oil.
    Type: Application
    Filed: October 10, 2016
    Publication date: February 2, 2017
    Inventors: Jeffrey C. Munro, Kaoru Aou, Raymond L. Laakso, JR., Gary R. Marchand, Rogelio R. Gamboa
  • Publication number: 20160333140
    Abstract: A process to produce an ionomer comprising reacting alkyl-cis-cyclooctene and cis-cyclooctene in a mole ratio from 1:0 to 0:1, in the presence of a difunctional chain transfer agent under ring opening metathesis polymerization conditions to form an unsaturated polyolefin reactive telechelic pre-polymer; hydrogenating the unsaturated polyolefin reactive telechelic pre-polymer to produce a hydrogenated polyolefin reactive telechelic pre-polymer; reacting the hydrogenated polyolefin reactive telechelic pre-polymer with at least one compound according to the formula aMx·b(R)y, wherein M is a metal, x is a charge of M, R is an alkyl, aryl, oxide, or fatty acid, y is a charge of R, a and b are integers of at least 1, and ax+by=0, to form an ionomer is provided. Further provided are ionomers produced thereby.
    Type: Application
    Filed: December 15, 2014
    Publication date: November 17, 2016
    Inventors: Henry Martinez, Marc A. Hillmyer, Jeffrey C. Munro, Kim L. Walton, Morgan M. Hughes
  • Patent number: 9464177
    Abstract: The present disclosure is directed to a composition and articles containing the composition. The composition comprises a foam and a plurality of gel particles dispersed in the foam. The gel particles comprise an olefin block copolymer and an oil.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: October 11, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffrey C. Munro, Kaoru Aou, Raymond L. Laakso, Jr., Gary R. Marchand, Rogelio R. Gamboa
  • Publication number: 20160237203
    Abstract: A process to produce a polyolefin reactive telechelic pre-polymer comprising reacting alkyl-cis-cyclooctene and optionally cis-cyclooctene, in the presence of a difunctional chain transfer agent under ring opening metathesis polymerization conditions to form an unsaturated polyolefin reactive telechelic pre-polymer is provided. Further provided are unsaturated and hydrogenated reactive pre-polymers, crosslinked elastomers and high molecular weight elastomers.
    Type: Application
    Filed: September 18, 2014
    Publication date: August 18, 2016
    Inventors: Henry Martinez, Marc A. Hillmyer, Jeffrey C. Munro, Kim L. Walton, Morgan M. Hughes
  • Publication number: 20160225490
    Abstract: A power cable comprising: (A) a conductor, (B) an insulation layer, and (C) a semiconductor layer comprising in weight percent based on the weight of the semiconductor layer: (1) 49-98% of a crosslinked olefin block copolymer (OBC) having a density less than (<) 0.9 grams per cubic centimeter (g/cm3), a melt index greater than (>) 1, and comprising in weight percent based on the weight of the OBC: (a) 35-80% soft segment that comprises 5-50 mole percent (mol %) of units derived from a monomer comprising 3 to 30 carbon atoms; and (b) 20-65% hard segment that comprises 0.2-3.5 mol % of units derived from a monomer comprising 3 to 30 carbon atoms; (2) 2-51% conductive filler, the insulation layer and semiconductor layer in contact with one another, is degassed by a process comprising the step of exposing the cable to a temperature of at least 80° C. for a period of time of at least 24 hours.
    Type: Application
    Filed: September 9, 2014
    Publication date: August 4, 2016
    Inventors: Paul J. Brigandi, Bharat I. Chaudhary, Jeffrey C. Munro, Gary R. Marchand
  • Publication number: 20150353718
    Abstract: The instant invention provides a blend composition suitable for injection molded articles. The blend composition suitable for injection molded article according to the present invention comprises: (a) from 50 to 80 percent by weight of a propylene/?-olefin interpolymer composition; (b) from 5 to 25 percent by weight of a homopolymer polypropylene, a random copolymer polypropylene, clarified random copolymer polypropylene, and combination thereof; and (c) from 5 to 39 percent by weight of a plasticizing agent; wherein said blend composition has a total haze of less than 25 percent.
    Type: Application
    Filed: February 28, 2014
    Publication date: December 10, 2015
    Inventors: Laura B. Weaver, Jeffrey C. Munro, Kim L. Walton, Juan C. Tuberquia, Santosh S. Bawiskar
  • Patent number: 9156195
    Abstract: The instant invention provides a polymer composition suitable for clear graphic cling film applications, method of producing the same, articles made therefrom, and methods for making such articles. The polymer composition suitable for clear graphic cling film applications, according to the present invention, comprises: (a) a polyolefin composition selected from the group consisting of a propylene-based composition as described herein, and an ethylene-based composition as described herein, and (b) one or more alkyl phosphate-based release agent; wherein when said polyolefin composition is formed into a clear graphic cling film having a 7 (±2) mils, said clear graphic cling film has a haze of less than 4 percent, for example from 0.3 to 4 percent, measured according to ASTM-D 1003.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: October 13, 2015
    Assignee: Dow Global Techologies LLC
    Inventors: Laura Bauerle Weaver, Jeffrey C. Munro, Sherrika D. Daniel
  • Publication number: 20150259524
    Abstract: Disclosed are oil-extended olefin block copolymer compositions with low, or no, tack. A unique comonomer content in the soft segment of the OBC in conjunction with the presence of a polyolefin provides the present oil-extended OBC composition with softness, low (or no) tack, and low (or no) oil-bleed.
    Type: Application
    Filed: June 1, 2015
    Publication date: September 17, 2015
    Inventors: Ashish Batra, Dana R. Breed, Pradeep Jain, Jose M. Rego, Robert T. Johnston, Alec Y. Wang, Jeffrey C. Munro
  • Patent number: 9133327
    Abstract: The invention provides a composition comprising at least the following: A) an ethylene/?-olefin interpolymer; B) an olefin-based polymer; and C) a crosslinking agent; and wherein the ethylene/?-olefin interpolymer of component A) has the following properties: i) has a density greater than, or equal to, 0.850 g/cc; ii) a molar ratio of “vinyl to total unsaturation” greater than, or equal to, 1/10; iii) an 1 10/12 ratio from 6.2 to 40.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: September 15, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Xiaosong Wu, Kim L. Walton, Jeffrey C. Munro
  • Publication number: 20150010765
    Abstract: Disclosed are olefin block copolymer formulations comprising polyethylene and polypropylene that provide improved adhesion properties to polypropylene while maintaining desired flexural modulus characteristics and are particularly suited for overmolded goods.
    Type: Application
    Filed: February 25, 2013
    Publication date: January 8, 2015
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Jeffrey C. Munro, Raymond L. Laakso, JR., Lisa S. Madenjian
  • Publication number: 20140378566
    Abstract: The present disclosure is directed to a composition and articles containing the composition. The composition comprises a foam and a plurality of gel particles dispersed in the foam. The gel particles comprise an olefin block copolymer and an oil.
    Type: Application
    Filed: December 4, 2012
    Publication date: December 25, 2014
    Inventors: Jeffrey C. Munro, Kaoru Aou, Raymond L. Laakso, JR., Gary R. Marchand, Rogelio R. Gamboa
  • Publication number: 20140357799
    Abstract: The invention provides a composition comprising at least the following: A) an ethylene/?-olefin interpolymer; B) an olefin-based polymer; and C) a crosslinking agent; and wherein the ethylene/?-olefin interpolymer of component A) has the following properties: i) has a density greater than, or equal to, 0.850 g/cc; ii) a molar ratio of “vinyl to total unsaturation” greater than, or equal to, 1/10; iii) an 110/12 ratio from 6.2 to 40.
    Type: Application
    Filed: September 11, 2012
    Publication date: December 4, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Xiaosong Wu, Kim L. Walton, Jeffrey C. Munro
  • Publication number: 20140220329
    Abstract: The instant invention provides a polymer composition suitable for clear graphic cling film applications, method of producing the same, articles made therefrom, and methods for making such articles. The polymer composition suitable for clear graphic cling film applications, according to the present invention, comprises: (a) a polyolefin composition selected from the group consisting of a propylene-based composition, and an ethylene-based composition, wherein the propylene-based composition has an melt flow rate in the range of from 2 to 8 g/10 minutes, a dynamic mechanical spectroscopy (DMS) value in the range of from 3700 to 10100 Pascal-seconds at 0.1 radian per second, and from 650 to 1200 Pascal-seconds at 100 radian per second measured at 190° C., and having a crystallinity in the range of from at least 4 percent by weight to 11 percent by weight, and a heat of fusion of in the range of from 6 to 19 Joules/gram, and a DSC melting point of less than 110° C.
    Type: Application
    Filed: June 6, 2012
    Publication date: August 7, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Laura Bauerle Weaver, Jeffrey C. Munro, Sherrika D. Daniel
  • Patent number: 8343257
    Abstract: The instant invention generally provides polymer pi-bond-philic filler composite comprising a molecularly self-assembling material and a pi-bond-philic filler, and a process of making and an article comprising the polymer pi-bond-philic filler composite. The instant invention also generally provides a process of separating a pi-bond-philic gas from a separable gas mixture comprising the pi-bond-philic gas.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: January 1, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Scott T. Matteucci, Shawn D. Feist, Peter N. Nickias, Leonardo C. Lopez, Michael S. Paquette, Jeffrey C. Munro
  • Publication number: 20110306715
    Abstract: Disclosed are oil-extended olefin block copolymer compositions with low, or no, tack. A unique comonomer content in the soft segment of the OBC in conjunction with the presence of a polyolefin provides the present oil-extended OBC composition with softness, low (or no) tack, and low (or no) oil-bleed.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 15, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Ashish Batra, Jeffrey C. Munro, Jose M. Rego, Dana Breed, Pradeep Jain, Robert T. Johnston, Alec Y. Wang
  • Patent number: 7989366
    Abstract: Methods are disclosed for activating dopants in a doped semiconductor substrate. A carbon precursor is flowed into a substrate processing chamber within which the doped semiconductor substrate is disposed. A plasma is formed from the carbon precursor in the substrate processing chamber. A carbon film is deposited over the substrate with the plasma. A temperature of the substrate is maintained while depositing the carbon film less than 500° C. The deposited carbon film is exposed to electromagnetic radiation for a period less than 10 ms, and has an extinction coefficient greater than 0.3 at a wavelength comprised by the electromagnetic radiation.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: August 2, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey C. Munro, Srinivas D. Nemani, Young S. Lee, Marlon Menezes, Christopher Dennis Bencher, Vijay Parihar
  • Patent number: 7790634
    Abstract: Methods of making a silicon oxide layer on a substrate are described. The methods may include forming the silicon oxide layer on the substrate in a reaction chamber by reacting an atomic oxygen precursor and a silicon precursor and depositing reaction products on the substrate. The atomic oxygen precursor is generated outside the reaction chamber. The methods also include heating the silicon oxide layer at a temperature of about 600° C. or less, and exposing the silicon oxide layer to an induced coupled plasma. Additional methods are described where the deposited silicon oxide layer is cured by exposing the layer to ultra-violet light, and also exposing the layer to an induced coupled plasma.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: September 7, 2010
    Assignee: Applied Materials, Inc
    Inventors: Jeffrey C. Munro, Srinivas D. Nemani
  • Patent number: 7745351
    Abstract: Methods of forming a dielectric layer where the tensile stress of the layer is increased by a plasma treatment at an elevated position are described. In one embodiment, oxide and nitride layers are deposited on a substrate and patterned to form an opening. A trench is etched into the substrate. The substrate is transferred into a chamber suitable for dielectric deposition. A dielectric layer is deposited over the substrate, filling the trench and covering mesa regions adjacent to the trench. The substrate is raised to an elevated position above the substrate support and exposed to a plasma which increases the tensile stress of the substrate. The substrate is removed from the dielectric deposition chamber, and portions of the dielectric layer are removed so that the dielectric layer is even with the topmost portion of the nitride layer. The nitride and pad oxide layers are removed to form the STI structure.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: June 29, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Xiaolin Chen, Srinivas D. Nemani, DongQing Li, Jeffrey C. Munro, Marlon E. Menezes
  • Publication number: 20100126341
    Abstract: The instant invention generally provides polymer pi-bond-philic filler composite comprising a molecularly self-assembling material and a pi-bond-philic filler, and a process of making and an article comprising the polymer pi-bond-philic filler composite. The instant invention also generally provides a process of separating a pi-bond-philic gas from a separable gas mixture comprising the pi-bond-philic gas.
    Type: Application
    Filed: November 20, 2009
    Publication date: May 27, 2010
    Inventors: Scott T. Matteucci, Shawn D. Feist, Peter N. Nickias, Leonardo C. Lopez, Michael S. Paquette, Jeffrey C. Munro