Patents by Inventor Jeffrey Donald Gelorme

Jeffrey Donald Gelorme has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11424152
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: August 23, 2022
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
  • Patent number: 11121005
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 14, 2021
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Patent number: 11094407
    Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 17, 2021
    Assignee: International Business Machines Corporation
    Inventors: John Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey Donald Gelorme, Rajeev Narayanan, Qianwen Chen
  • Publication number: 20200395115
    Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.
    Type: Application
    Filed: June 13, 2019
    Publication date: December 17, 2020
    Inventors: John Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey Donald Gelorme, Rajeev Narayanan, Qianwen Chen
  • Patent number: 10679887
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20200176297
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: February 3, 2020
    Publication date: June 4, 2020
    Applicant: International Business Machines Corporation
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Publication number: 20200168475
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: January 31, 2020
    Publication date: May 28, 2020
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Patent number: 10607963
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 31, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Patent number: 10586726
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Patent number: 10573538
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: February 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20190189469
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Applicant: International Business Machines Corporation
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Patent number: 10325785
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 18, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Patent number: 10224219
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20180218934
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: March 26, 2018
    Publication date: August 2, 2018
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Publication number: 20180138072
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: December 27, 2017
    Publication date: May 17, 2018
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Publication number: 20180138073
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: December 27, 2017
    Publication date: May 17, 2018
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Patent number: 9947570
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: April 17, 2018
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20180076113
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Application
    Filed: September 15, 2016
    Publication date: March 15, 2018
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Publication number: 20170194186
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: March 29, 2016
    Publication date: July 6, 2017
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Publication number: 20170194185
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: December 30, 2015
    Publication date: July 6, 2017
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG