Patents by Inventor Jeffrey Ewanchuk

Jeffrey Ewanchuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935807
    Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 19, 2024
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Karthik Debbadi, Sebastian Rosado, Jeffrey Ewanchuk
  • Publication number: 20230378724
    Abstract: A power converter includes a field graded substrate, a plurality of power device dies attached to the field graded substrate, a polymer layer on the field graded substrate, one or more conductors over the polymer layer, and a plurality of power conditioning components mounted on the field graded substrate to form a power converter circuit. The field graded substrate includes a first conductor layer, a graded layer that blends conductor and insulator material, and a second conductor layer, the graded layer having an insulator core.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Chi Zhang, Jeffrey Ewanchuk
  • Patent number: 11630154
    Abstract: The invention: determines if the duration of the conducting state of the semiconductors in a first cycle of the pulse width modulation is upper than a predetermined duration, measures, during the conducting state of the semiconductors at a second cycle, the voltage provided to the load, sequentially disables the conduction of each semiconductor during a part of the duration of the conducting state of the semiconductors in a third cycle and measures the voltage provided to the load, determines the differences between the voltage measured during the second cycle and each voltage measured during the third cycle, orders the differences according to their value, checks if the determined order is identical to an order stored in a memory of the device and determines that one connection of one semiconductor is deteriorated if the order is changed.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: April 18, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey Ewanchuk, Julio Brandelero, Stefan Mollov
  • Publication number: 20230077598
    Abstract: A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 16, 2023
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Jeffrey Ewanchuk, Kimberly Rae Saviers, Ram Ranjan, Ross Wilcoxon, Haley Steffen
  • Patent number: 11532993
    Abstract: An apparatus for modular AC to AC frequency conversion is disclosed. An input AC source is configured to generate an input AC voltage at a first frequency. At least one primary low frequency (LF) conversion stage is configured to generate a DC voltage, and comprises a first pair of metal-oxide-semiconductor field effect transistors (MOSFETs). At least one primary high frequency (HF) conversion stage is configured to generate the DC voltage, and comprises a first pair of high electron mobility transistors (HEMTs). At least one secondary LF conversion stage is configured to receive the DC voltage and generate an output AC voltage at a second frequency, and comprises a second pair of MOSFETs. At least one secondary HF conversion stage is configured to receive the DC voltage and generate the output AC voltage at the second frequency, and comprises a second pair of HEMTs.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: December 20, 2022
    Assignee: B/E Aerospace, Inc
    Inventors: Suman Dwari, Parag M. Kshirsagar, Jeffrey Ewanchuk, Baljit Singh Riar, Brian St. Rock
  • Publication number: 20220393590
    Abstract: A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.
    Type: Application
    Filed: June 4, 2021
    Publication date: December 8, 2022
    Inventors: Suman Dwari, Brian St. Rock, Jeffrey Ewanchuk
  • Patent number: 11448557
    Abstract: A method for determining the junction temperature of at least one die of a semiconductor power module, the semiconductor power module being composed of plural dies connected in parallel and switching between conducting and non conductor states according to pattern cycles, the method comprises the steps of: disabling the conducting of the at least one die during at least a fraction of one switching cycle, applying a current limited voltage to the gate of the at least one die during a period of time of the cycle wherein the at least one die is not conducting, the resulting voltage excursion having a value that does not enable the die to be conducting, measuring the voltage at the gate of the die, deriving from the measured voltage a temperature variation of the junction of the at least one die or the temperature of the junction of the die.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: September 20, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jeffrey Ewanchuk, Stefan Mollov, Jonathan Robinson, Julio Brandelero
  • Patent number: 11424692
    Abstract: System and methods for power conversion are provided. Aspects include a first switching module comprising a first set of switches, wherein the first set of switches comprise wide-bandgap devices having a first bandgap, a second switching module comprising a second set of switches, wherein the second set of switches comprise semiconductor devices having a second bandgap, and wherein the first bandgap is larger than the second bandgap, an alternating current (AC) power source connected to the first switching module and the second switching module, a first capacitor bank, a second capacitor bank, and a controller configured to operate the first switching module and the second switching module to create a first direct current (DC) voltage across the first capacitor bank and a second direct current (DC) voltage across the second capacitor bank.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: August 23, 2022
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Suman Dwari, Brian St. Rock, Jeffrey Ewanchuk
  • Patent number: 11415625
    Abstract: A method and device for monitoring a multi-die power module in a half-bridge switch configuration are provided. The method and device are designed to set dies in a non conductive state, select one die which is blocking a voltage, inject a current in a gate of the selected die in order to charge an input parasitic capacitance of the selected die, monitor a voltage that is representative of a voltage on the gate of the selected die, and memorize the value of the monitored voltage when the value of the monitored voltage is stabilized.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 16, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Jeffrey Ewanchuk
  • Patent number: 11388845
    Abstract: The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: July 12, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey Ewanchuk, Julio Brandelero
  • Patent number: 11378612
    Abstract: A device having at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 5, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Nicolas Degrenne, Stefan Mollov, Jeffrey Ewanchuk
  • Publication number: 20220208997
    Abstract: A device comprising a gate pad, a source pad and a passive actuator arranged to form a reversible mechanical and electrical connection between the gate pad and the source pad only if the temperature in the passive actuator exceeds a threshold value.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 30, 2022
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julio Cezar BRANDELERO, Jeffrey EWANCHUK, Stefan MOLLOV
  • Publication number: 20220200473
    Abstract: System and methods for power conversion are provided. Aspects include a first switching module comprising a first set of switches, wherein the first set of switches comprise wide-bandgap devices having a first bandgap, a second switching module comprising a second set of switches, wherein the second set of switches comprise semiconductor devices having a second bandgap, and wherein the first bandgap is larger than the second bandgap, an alternating current (AC) power source connected to the first switching module and the second switching module, a first capacitor bank, a second capacitor bank, and a controller configured to operate the first switching module and the second switching module to create a first direct current (DC) voltage across the first capacitor bank and a second direct current (DC) voltage across the second capacitor bank.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Suman Dwari, Brian St. Rock, Jeffrey Ewanchuk
  • Publication number: 20220199483
    Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 23, 2022
    Inventors: Karthik DEBBADI, Sebastian ROSADO, Jeffrey EWANCHUK
  • Publication number: 20220107363
    Abstract: The invention: determines if the duration of the conducting state of the semiconductors in a first cycle of the pulse width modulation is upper than a predetermined duration, measures, during the conducting state of the semiconductors at a second cycle, the voltage provided to the load, sequentially disables the conduction of each semiconductor during a part of the duration of the conducting state of the semiconductors in a third cycle and measures the voltage provided to the load, determines the differences between the voltage measured during the second cycle and each voltage measured during the third cycle, orders the differences according to their value, checks if the determined order is identical to an order stored in a memory of the device and determines that one connection of one semiconductor is deteriorated if the order is changed.
    Type: Application
    Filed: January 20, 2020
    Publication date: April 7, 2022
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey EWANCHUK, Julio BRANDELERO, Stefan MOLLOV
  • Patent number: 11251151
    Abstract: The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:—at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,—means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: February 15, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey Ewanchuk, Julio Brandelero, Stefan Mollov
  • Patent number: 11217571
    Abstract: A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: January 4, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien Morand, Remi Perrin, Roberto Mrad, Jeffrey Ewanchuk, Stefan Mollov
  • Patent number: 11152340
    Abstract: The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: October 19, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Roberto Mrad, Stefan Mollov, Jeffrey Ewanchuk
  • Patent number: 11114349
    Abstract: The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 7, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jeffrey Ewanchuk, Julio Brandelero, Stefan Mollov
  • Publication number: 20210172994
    Abstract: A device comprising at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.
    Type: Application
    Filed: February 26, 2018
    Publication date: June 10, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Nicolas DEGRENNE, Stefan MOLLOV, Jeffrey EWANCHUK