Abstract: A method of manufacturing a multi-layer wafer is provided. At least one stress compensating polymer layer is applied to at least one of two heterogeneous wafers. The stress compensating polymer layer is low temperature bonded to the other of the two heterogeneous wafers to form a multi-layer wafer pair. Channels are created between die on at least one of the two heterogeneous wafers. The channels are back filled with one of oxide or polymer to create a channel oxide deposition.

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method includes applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

Abstract: A method of manufacturing a multi-layer wafer is provided. The method comprises applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: A method of forming a flexible microbattery and battery is provided. The method including: forming a film with a cavity therein; applying a first outer flexible substrate to a first side of the film; applying a second outer flexible substrate to a second opposite side of the film, wherein a cathode, an anode, a separator and an electrolyte are located within the cavity and the film provides a first seal about the cathode, the anode, the separator and the electrolyte and wherein the first seal extends between the first outer flexible substrate and the second outer flexible substrate; cutting a trench through the first outer flexible substrate, the film and the second outer flexible substrate after the first seal is formed; disposing a curable material in the trench; curing the curable material to provide a second seal, wherein the first seal is located between the cavity and the second seal.

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: The disclosure generally relates to methods for manufacturing a filled gap region or cavity between two surfaces forming a device microchip. In one embodiment, the cavity results from two surfaces, for example, a PCB and a chip or two chips. More specifically, the disclosure relates to a method of manufacture and the resulting apparatus having porous underfill to enable rework of the electrical interconnects of a microchip on a multi-chip module. In one embodiment, the disclosure builds on the thermal underfill concept and achieves high thermal conductivity by the use of alumina fillers. Alternatively, other material such as silica filler particles may be selected to render the underfill a poor thermal conductive. In one embodiment, the disclose is concerned with reworkability of the material.

Abstract: A method of forming a flexible microbattery and battery is provided. The method including: forming a film with a cavity therein; applying a first outer flexible substrate to a first side of the film; applying a second outer flexible substrate to a second opposite side of the film, wherein a cathode, an anode, a separator and an electrolyte are located within the cavity and the film provides a first seal about the cathode, the anode, the separator and the electrolyte and wherein the first seal extends between the first outer flexible substrate and the second outer flexible substrate; cutting a trench through the first outer flexible substrate, the film and the second outer flexible substrate after the first seal is formed; disposing a curable material in the trench; curing the curable material to provide a second seal, wherein the first seal is located between the cavity and the second seal.

Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

Abstract: Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

Abstract: Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

Abstract: An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).

Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Abstract: The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.

Abstract: The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

Abstract: One embodiment of the present method and apparatus for detecting leaks in a fluid cooling system enables a user to rapidly detect fluid leaks in the vicinity of a microprocessor chip or other delicate item. In one embodiment, the invention comprises a detector and a border coupled to the detector and disposed peripherally about a protected item (e.g., the microprocessor chip or other delicate item). In one embodiment, the border is a layered structure that is adapted to complete an electrical circuit with the detector when the border comes into contact with fluid.

Abstract: Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.