Patents by Inventor Jeffrey Klemovage

Jeffrey Klemovage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR ELECTRICAL INTERCONNECTION BETWEEN PRINTED WIRING BOARD LAYERS USING THROUGH HOLES WITH SOLID CORE CONDUCTIVE MATERIAL
    Publication number: 20060175081
    Abstract: The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
    Type: Application
    Filed: April 19, 2006
    Publication date: August 10, 2006
    Applicant: Agere Systems Inc.
    Inventors: Charles Cohn, Jeffrey Klemovage
  • Integrated circuit device having flexible leadframe
    Publication number: 20060097367
    Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.
    Type: Application
    Filed: December 14, 2005
    Publication date: May 11, 2006
    Inventors: Timothy Bambridge, Jeffery Gilbert, Juan Herbsommer, Jeffrey Klemovage, George Libricz
  • Integrated circuit device having flexible leadframe
    Publication number: 20050224926
    Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.
    Type: Application
    Filed: April 1, 2004
    Publication date: October 13, 2005
    Inventors: Timothy Bambridge, Jeffery Gilbert, Juan Herbsommer, Jeffrey Klemovage, George Libricz
  • Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
    Publication number: 20050150682
    Abstract: The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
    Type: Application
    Filed: January 12, 2004
    Publication date: July 14, 2005
    Applicant: Agere Systems Inc.
    Inventors: Charles Cohn, Jeffrey Klemovage