Abstract: Optoelectronic devices with enhanced internal outcoupling include a substrate, an anode, a cathode, an electroluminescent layer, and an electron transporting layer comprising inorganic nanoparticles dispersed in an organic matrix.

Abstract: Optoelectronic devices that have enhanced internal outcoupling are disclosed. The devices include a substrate, an anode, a cathode, an electroluminescent layer, and a hole injecting layer. The hole injecting layer includes inorganic nanoparticles that have a bimodal particle size distribution and which are dispersed in an organic matrix.

Abstract: The disclosure relates generally to sealed electronic devices. More particularly, the invention relates to electronic devices employing organic devices having a seal. Packages having organic electronic devices are presented, and a number of sealing mechanisms are provided for hermetically sealing the package to protect the organic electronic device from environmental elements.

Abstract: The disclosure relates generally to sealed electronic devices. More particularly, the invention relates to electronic devices employing organic devices having a seal. Packages having organic electronic devices are presented, and a number of sealing mechanisms are provided for hermetically sealing the package to protect the organic electronic device from environmental elements.

Abstract: The disclosure relates generally to carrier assemblies for handling and processing thin flexible glass. More particularly, the invention relates to an adhesive-free carrier assembly for handling thin flexible glass substrates that are used in organic opto-electronic devices such as OLEDs and organic photodetectors (OPDs).

Abstract: Optoelectronic devices with enhanced internal outcoupling include a substrate, an anode, a cathode, an electroluminescent layer, and an electron transporting layer comprising inorganic nanoparticles dispersed in an organic matrix.

Abstract: Optoelectronic devices that have enhanced internal outcoupling are disclosed. The devices include a substrate, an anode, a cathode, an electroluminescent layer, and a hole injecting layer. The hole injecting layer includes inorganic nanoparticles that have a bimodal particle size distribution and which are dispersed in an organic matrix.

Abstract: A packaged optoelectronic device and a method for manufacturing is provided. The packaged optoelectronic device includes at least one optoelectronic device with two electrodes sandwiched between a first barrier layer and a second barrier layer. At least one of the barrier layers comprises at least one aperture. Further, the packaged device includes a plurality of thin electrically conductive connectors. Each of the thin connectors extends out through the at least one aperture and is coupled to the anode or the cathode. Further, the thin connectors are connected to an external power source to provide power to the anode and the cathode.

Abstract: An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer.

Abstract: Provided are organic device packages configured to limit current flow through shorted sub-elements in the organic device. In some embodiments, the organic device package may include multiple elements, each having multiple sub-elements connected in parallel. Each element may have a first electrode patterned into thin electrode strips connected in parallel, and each of the electrode strips may be an electrode of one of the multiple sub-elements. The electrode strips may have a resistance which may be higher than the overall resistance of other sub-elements in the element, such that a current flowing to the element may be substantially limited from flowing through a shorted sub-element in the element. Each element may also be connected in series to another element in the organic device package, and one or more series-connected elements may also be connected in parallel within the package.

Abstract: An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer.