Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive first particles dispersed in the adhesive material and having a first shape; and a plurality of electrically conductive second particles dispersed in the adhesive material and having a second shape different from the first shape. A ratio of a total weight of the first particles to a total weight of the second particles is in a range from about 2 to about 10. The adhesive layer has an average thickness in a range from about 5 micrometers to about 35 micrometers. An electrical conductance of the adhesive layer in a thickness, but not in an in-plane, direction is at least 5% greater than a comparative adhesive layer having the same construction except that it does not include the second particles.

Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.

Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

Abstract: A magnetic film includes a plurality of magnetically permeable particles dispersed between opposing first and second major surfaces of the magnetic film. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the magnetic film and a width W along the second direction extending from the first to the second major surface. L/D?100.

Abstract: An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ? 100. At least some of the particles are electrically conductive.

Abstract: Electrically conductive masking tapes include an electrically conductive backing and an electrically conductive pressure sensitive adhesive layer. The pressure sensitive adhesive contains an acrylate-based copolymeric matrix, a crosslinker, an electrically conductive filler, and at least one antioxidant. The acrylate-based copolymeric matrix is the reaction product of a polymerizable mixture including at least one first alkyl(meth)acrylate monomer with a homopolymer Tg of less than ?50° C., and at least one hydroxyl-functional alkyl(meth)acrylate with a homopolymer Tg of less than ?10° C. The electrically conductive tape is capable of being laminated to and cleanly removed from a substrate surface, after being subjected to harsh conditions such as plasma vapor deposition conditions.

Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.

Abstract: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

Abstract: Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

Abstract: Electrically conductive articles are provided, including a composite including (a) a resin, and (b) electrically conductive shaped particles distributed in the resin, the particles having a monosized distribution. Each particle has a shape including at least a first surface and a second surface intersecting the first surface at an angle a between about 5 degrees and about 150 degrees. The composite has a thickness and often each of the electrically conductive shaped particles distributed in the resin is oriented within the resin such that the particle does not extend beyond the thickness of the composite. A method for making an electrically conductive article is also provided, including (a) providing electrically conductive shaped particles having a monosized distribution, and (b) distributing the particles into a resin to form a composite.

Abstract: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

Abstract: Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

Abstract: An electrically conductive adhesive layer including an adhesive material and a plurality of substantially plate-like nickel-coated graphite particles dispersed uniformly in the adhesive material is described. The adhesive layer has an average thickness in a range from 10 microns to 100 microns, and an electrical resistance in a thickness direction of less than 200 milli ohms. A ratio of a total weight of the graphite particles to a total weight of the adhesive layer is from 20% to 50%.

Abstract: A stretchable conductive adhesive tape comprises an electrically-conductive pressure-sensitive adhesive layer having first and second opposed major surfaces. The electrically-conductive pressure-sensitive adhesive layer comprises electrically-conductive particles and an electrically-conductive stretchable fabric disposed within a polymer matrix. The electrically-conductive pressure-sensitive adhesive layer is electrically-conductive in all directions. An elastic backing is disposed on the first major surface of the electrically-conductive pressure-sensitive adhesive layer.

Abstract: Flexible films including an electrically conductive layer being sandwiched by two electrically insulating layers in a layered structure are provided. The layered structure extends continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the three layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.

Abstract: The present disclosure provides a compressible gasket, an electronic product comprising the compressible gasket and a method for preparing the compressible gasket. The compressible gasket of the present disclosure comprises an open-cell foam matrix and a filling medium which fills and is cured in the open cells of the open-cell foam, the filling medium comprising a curable adhesive and one or more types of micrometer particles dispersed therein. The one or more types of micrometer particles comprise at least one of thermally conductive micrometer particles and thermally and electrically conductive micrometer particles, and optionally comprise at least one of flame retardant micrometer particles, electrically conductive micrometer particles and electromagnetic wave absorption micrometer particles.

Abstract: Flexible films including an electrically conductive layer being sandwiched by two electrically insulating layers in a layered structure are provided. The layered structure extends continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the three layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.

Abstract: Flexible films including an electrically insulating first layer and an electrically conductive second layer arranged in a layered structure are provided. The first and second layers extend continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the first and second layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.

Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer, which includes a first conductive porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways; and a second conductive porous substrate positioned adjacent the conductive adhesive layer. Optionally, the electrically conductive, single-sided tape may include an opaque coating adjacent to a major surface of the second conductive porous substrate. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.