Patents by Inventor Jen-Chun Chen

Jen-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190279735
    Abstract: A failure mode detection method is provided. A first default read voltage is changed to a first read retry voltage by a first increment, and a second default read voltage is changed to a second read retry voltage by a second increment. A memory cell array of a solid state storage device is successfully read according to the first and second read retry voltages. If an absolute value of the first increment minus an absolute value of the second increment is larger than a predetermined voltage value, the memory cell array is in a data retention failure mode. If the absolute value of the first increment minus the absolute value of the second increment is smaller than the predetermined voltage value, the memory cell array is in a low temperature write high temperature read failure mode.
    Type: Application
    Filed: April 18, 2018
    Publication date: September 12, 2019
    Inventors: Shih-Jia ZENG, Jen-Chien Fu, Tsu-Han Lu, Kuan-Chun Chen
  • Publication number: 20190265522
    Abstract: A viewing angle switchable display module includes an organic light-emitting display (OLED) panel, a viewing angle switchable device disposed on the OLED panel, and a quarter wave plate disposed between the OLED panel and the viewing angle switchable device. The viewing angle switchable device includes an absorptive polarizer, a reflective polarizer, and an electrically controlled viewing angle switching element. A transmission axis of the reflective polarizer is parallel to a transmission axis of the absorptive polarizer. The electrically controlled viewing angle switching element is disposed between the absorptive polarizer and the reflective polarizer and includes two conductive layers and a liquid crystal layer including liquid crystal molecules.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Applicant: Coretronic Corporation
    Inventors: Ping-Yen Chen, Wen-Chun Wang, Chung-Yang Fang, Yang-Ching Lin, Jen-Wei Yu
  • Publication number: 20190254130
    Abstract: A system for driving a light source includes a power converter and control circuitry coupled to the power converter. The power converter converts input power to an output voltage to power the light source. The control circuitry senses the output voltage and senses current of the light source. The control circuitry generates a control signal based on a voltage feedback signal indicative of a combination of said output voltage and said current of said light source, and controls the power converter by the control signal to adjust the output voltage.
    Type: Application
    Filed: January 24, 2017
    Publication date: August 15, 2019
    Inventors: Jen-Chun Chen, Sheng-Tai LEE, Yung-Lin LIN
  • Publication number: 20190233524
    Abstract: A therapeutic combination for treating cancer in a subject having a tumor in provided. The therapeutic combination includes an immunotherapeutics for treating the cancer, and a peptide having one of SEQ ID NOs. 1-3 and being capable of selectively binding to CXC chemokine receptor 4 (CXCR4). When the peptide of the therapeutic combination binds to CXCR4, an immune microenvironment of the tumor is modulated and/or accessibility of immune cells to the tumor is regulated. A method for treating cancer using the therapeutic combination is also provided.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 1, 2019
    Inventors: YA-CHUN WANG, JEN-YAU CHEN
  • Patent number: 10341635
    Abstract: A stereoscopic imaging method includes: acquiring a convergence disparity value, which corresponds to a screen position at which a viewer is looking, from an original disparity map corresponding to first and second images that correspond to different viewing angles; generating a disparity transformation model based on the convergence disparity value and viewer-related information; transforming the original disparity map into a transformed disparity map based on the disparity transformation model; and synthesizing the first and second images into a stereoscopic image based on the transformed disparity map.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: July 2, 2019
    Assignee: National Chiao Tung University
    Inventors: Tian-Sheuan Chang, Yi-Chun Chen, Jen-Hui Chuang
  • Publication number: 20190185614
    Abstract: An elastomer is provided, which is a product of reacting C4-12 lactam, poly(C2-4 alkylene glycol), C4-12 diacid, and multi-ester aliphatic monomer. The C4-12 lactam and the poly(C2-4 alkylene glycol) have a weight ratio of 20:80 to 80:20. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the C4-12 diacid have a ratio of 100:0.5 to 100:10. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the multi-ester aliphatic monomer have a ratio of 100:0.01 to 100:5.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 20, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Lung CHANG, Jen-Chun CHIU, Yung-Chan LIN, Chih-Hsiang LIN, Chien-Ming CHEN
  • Publication number: 20190181422
    Abstract: A method of forming slurry for a positive electrode plate is provided, which includes reacting maleimide compound and barbituric acid to form a hyper branched polymer. 0.1 to 1 part by weight of the hyper branched polymer is mixed with 0.01 to 1 part by weight of coupling agent and 0.1 to 6 parts by weight of carbon nanotube to form a mixture. 80 to 97.79 parts by weight of active material is added to the mixture, wherein the hyper branched polymer, the carbon nanotube, and the active material are bonded by the coupling agent.
    Type: Application
    Filed: December 4, 2018
    Publication date: June 13, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Chung CHEN, Jing-Pin PAN, Chang-Rung YANG, Li-Chun CHEN, Jen-Chih LO, Guan-Lin LAI, Jung-Mu HSU
  • Publication number: 20190177612
    Abstract: A luminescent material includes a particle of an irregular shape. The particle of an irregular shape includes a core of an irregular shape and quantum dots. The quantum dots distribute on the core.
    Type: Application
    Filed: November 8, 2018
    Publication date: June 13, 2019
    Inventors: Yuan-Ren JUANG, Szu-Chun YU, Keng-Chu LIN, Wei-Ta CHEN, Yao-Tsung CHUANG, Jen-Shrong UEN
  • Publication number: 20190181306
    Abstract: A luminescent material, a light emitting device, and a display device are disclosed. The luminescent material includes particles and a phosphor. The particles include quantum dots and have an average diameter of 0.06 ?m to 30 ?m.
    Type: Application
    Filed: November 21, 2018
    Publication date: June 13, 2019
    Inventors: Yuan-Ren JUANG, Szu-Chun YU, Keng-Chu LIN, Wei-Ta CHEN, Yao-Tsung CHUANG, Jen-Shrong UEN
  • Patent number: 10319428
    Abstract: A control method of a solid state storage device includes the following steps. Firstly, a block of a memory cell array is checked. Then, a judging step is performed to judge whether a data storage time period of the block exceeds a threshold period. If the data storage time period of the block exceeds the threshold period, the block is tagged or a data of the block is refreshed.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 11, 2019
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Shih-Jia Zeng, Jen-Chien Fu, Tsu-Han Lu, Kuan-Chun Chen
  • Publication number: 20190165009
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within a substrate and respectively comprising a photodiode. A boundary deep trench isolation (BDTI) structure is disposed between adjacent pixel regions, extending from a back-side of the substrate to a first depth within the substrate, and surrounding the photodiode. A multiple deep trench isolation (MDTI) structure is disposed within the individual pixel region, extending from the back-side of the substrate to a second depth within the substrate, and overlying the photodiode. A dielectric layer fills in a BDTI trench of the BDTI structure and a MDTI trench of the MDTI structure.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Patent number: 9881875
    Abstract: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: January 30, 2018
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Tsung Jung Cheng, Chia Cheng Liu
  • Patent number: 9814166
    Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: November 7, 2017
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Tsung-Jung Cheng, Chia-Cheng Liu
  • Patent number: 9674991
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: June 6, 2017
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih
  • Patent number: 9332646
    Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
    Type: Grant
    Filed: January 19, 2013
    Date of Patent: May 3, 2016
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventors: Jen-Chun Chen, Hsin-Chin Chang
  • Publication number: 20160081235
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 17, 2016
    Inventors: JEN-CHUN CHEN, PAI-SHENG SHIH
  • Patent number: 9271436
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: February 23, 2016
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih
  • Patent number: 9171770
    Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.
    Type: Grant
    Filed: January 20, 2013
    Date of Patent: October 27, 2015
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventor: Jen-Chun Chen
  • Patent number: 9144183
    Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: September 22, 2015
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Jen-Chun Chen, Xiao-Wen Cao, He- Yi Chang
  • Publication number: 20150214075
    Abstract: A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component.
    Type: Application
    Filed: April 6, 2014
    Publication date: July 30, 2015
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JEN-CHUN CHEN, SHIH-CHIEN CHEN, PAI-SHENG CHENG