Patents by Inventor Jen-Chun Chen

Jen-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240239986
    Abstract: A copolyester is formed by copolymerizing a depolymerized polyester and succinic acid. The depolymerized polyester includes depolymerized polyethylene terephthalate (PET), and the depolymerized PET is formed by depolymerizing PET with ethylene glycol. The repeating unit of PET and the succinic acid have a molar ratio of 40:60 to 50:50. The repeating unit of PET and the ethylene glycol have a molar ratio of 100:100 to 100:500. The copolyester has a storage modulus of 1*104 Pa to 1*106 Pa at 80° C. The copolyester can be used in a hot melt adhesive.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Che-Tseng LIN, Meng-Hsin CHEN, Jen-Chun CHIU, Kai-Chuan KUO, Yu-Lin CHU, Po-Hsien HO, Ke-Hsuan LUO, Chih-Hsiang LIN, Hui-Ching HSU
  • Patent number: 10660176
    Abstract: A system for driving a light source includes a power converter and control circuitry coupled to the power converter. The power converter converts input power to an output voltage to power the light source. The control circuitry senses the output voltage and senses current of the light source. The control circuitry generates a control signal based on a voltage feedback signal indicative of a combination of said output voltage and said current of said light source, and controls the power converter by the control signal to adjust the output voltage.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: May 19, 2020
    Assignee: O2Micro Inc.
    Inventors: Jen-Chun Chen, Sheng-Tai Lee, Yung-Lin Lin
  • Publication number: 20190254130
    Abstract: A system for driving a light source includes a power converter and control circuitry coupled to the power converter. The power converter converts input power to an output voltage to power the light source. The control circuitry senses the output voltage and senses current of the light source. The control circuitry generates a control signal based on a voltage feedback signal indicative of a combination of said output voltage and said current of said light source, and controls the power converter by the control signal to adjust the output voltage.
    Type: Application
    Filed: January 24, 2017
    Publication date: August 15, 2019
    Inventors: Jen-Chun Chen, Sheng-Tai LEE, Yung-Lin LIN
  • Patent number: 9881875
    Abstract: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: January 30, 2018
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Tsung Jung Cheng, Chia Cheng Liu
  • Patent number: 9814166
    Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: November 7, 2017
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Tsung-Jung Cheng, Chia-Cheng Liu
  • Patent number: 9674991
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: June 6, 2017
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih
  • Patent number: 9332646
    Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
    Type: Grant
    Filed: January 19, 2013
    Date of Patent: May 3, 2016
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventors: Jen-Chun Chen, Hsin-Chin Chang
  • Publication number: 20160081235
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 17, 2016
    Inventors: JEN-CHUN CHEN, PAI-SHENG SHIH
  • Patent number: 9271436
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: February 23, 2016
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih
  • Patent number: 9171770
    Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.
    Type: Grant
    Filed: January 20, 2013
    Date of Patent: October 27, 2015
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventor: Jen-Chun Chen
  • Patent number: 9144183
    Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: September 22, 2015
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Jen-Chun Chen, Xiao-Wen Cao, He- Yi Chang
  • Publication number: 20150214075
    Abstract: A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component.
    Type: Application
    Filed: April 6, 2014
    Publication date: July 30, 2015
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JEN-CHUN CHEN, SHIH-CHIEN CHEN, PAI-SHENG CHENG
  • Patent number: 9089046
    Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: July 21, 2015
    Assignees: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Jen-Chun Chen, Pai-Sheng Shih, Hsin-Chin Chang
  • Publication number: 20150173258
    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
    Type: Application
    Filed: May 23, 2014
    Publication date: June 18, 2015
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
    Inventors: JEN-CHUN CHEN, PAI-SHENG SHIH
  • Publication number: 20150036297
    Abstract: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.
    Type: Application
    Filed: July 16, 2014
    Publication date: February 5, 2015
    Inventors: JEN-CHUN CHEN, TSUNG JUNG CHENG, CHIA CHENG LIU
  • Publication number: 20150035201
    Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JEN-CHUN CHEN, TSUNG-JUNG CHENG, CHIA-CHENG LIU
  • Publication number: 20150036296
    Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JEN-CHUN CHEN, XIAO-WEN CAO, HE- YI CHANG
  • Publication number: 20140126161
    Abstract: An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
    Type: Application
    Filed: January 19, 2013
    Publication date: May 8, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JEN-CHUN CHEN, HSIN-CHIN CHANG
  • Publication number: 20140070395
    Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.
    Type: Application
    Filed: January 20, 2013
    Publication date: March 13, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventor: JEN-CHUN CHEN
  • Patent number: 8338929
    Abstract: A stacked-type chip package structure in which stacked chips and stacked flexible circuit boards are disposed on a substrate. A plurality of spacer layers is respectively sandwiched between two adjacent chips and stacked on top of each other. In addition, conductive bumps are disposed on the substrate and between the stacked flexible circuit boards, such that the stacked flexible circuit boards are electrically connected to the substrate. Besides, conductive wires are electrically connected between the flexible circuit boards and the chips, so as to form a package structure with multi-layer chips on the substrate. Thereby, electrical performance and reliability of the chips are improved.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: December 25, 2012
    Assignee: Nanya Technology Corporation
    Inventors: Jen-Chun Chen, Wu-der Yang