Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: The present invention provides a method for fabricating a high sag lens array a high sag lens array fabricated by a semiconductor process. The method comprises: individually jetting an optical glue material into a plurality of lens mold cavities of a mold to form a plurality of lens parts independently; exposing the lens parts to harden the optical glue material in the lens mold cavities; jetting an optical glue layer on the lens parts; forming a transparent substrate on the optical glue layer; exposing the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts; and removing the mold to form the high sag lens array.

Abstract: A lens sheet including a first transparent substrate, a first lens film, a second lens film, a second transparent substrate, a plurality of bonding material patterns and a plurality of buffer cavities is provided. The first lens film is disposed on the first transparent substrate, and having a plurality of first lens portions and a plurality of first carrying portions. The second lens film is disposed between the second transparent substrate and the first lens film. The bonding material patterns are disposed between the second lens film and the first carrying portions. The buffer cavities are located between the first carrying portions and the first lens portions.

Abstract: A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.

Abstract: A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.