Abstract: An electrical signal connector receptacle assembly includes an annular mounting member configured for rigid attachment to a structure. The annular mounting member has a front end having a front opening and a rear portion. A connector ring is rotatably attached to the annular mounting member such that the connector ring rotates with respect to the annular mounting member. The connector ring is configured to be removably and rotatably attached to the electrical signal connector. In an exemplary embodiment, the connector ring is configured for threaded engagement with the electrical signal connector. The connector ring includes an interior region within which the annular mounting member is located and a front end having a front opening and a rear end having a rear opening. The rear portion of the annular mounting member extends through the rear opening of the connector ring and is configured to be attached to the structure.

Abstract: A dual portion blanket comprising: a first portion, where said first portion includes a double layer of blanketing; and a second portion, where said second portion includes a single layer of blanketing. In one particular embodiment, the first portion includes a side opening on each thereof.

Abstract: A track fitting used to secure a covering to a track extending along an item includes a body and a plunger. The body of the track fitting has at least one foot, adapted to be received in one of a series of openings defined by the track, and the body is also adapted to receive and secure a portion of the covering. The plunger of the track fitting is placed adjacent to and is vertically moveable with respect to the body. The plunger generally moves between a first position that allows movement of the track fitting along the track and a second position in which the plunger engages one of the openings defined by the track, preventing further movement of the track fitting along the track.

Abstract: A crack stop for low K dielectric materials of an integrated circuit (IC) formed on an IC chip using metal interconnects which do not form a self-passivating oxide layer, such as copper or silver interconnects, in a low-K dielectric material to prevent damage to the active area of the IC chip caused by chipping and cracking formed along peripheral edges of the IC chip during a dicing operation. A moisture barrier or edge seal is formed as a metal stack positioned along the outer peripheral edges of the active area of the IC chip. The crack stop is formed by at least one trench or groove positioned outside of the moisture barrier/edge seal on the outer periphery of the IC chip.

Abstract: A track fitting used to secure a covering to a track extending along an item includes a body and a plunger. The body of the track fitting has at least one foot, adapted to be received in one of a series of openings defined by the track, and the body is also adapted to receive and secure a portion of the covering. The plunger of the track fitting is placed adjacent to and is vertically moveable with respect to the body. The plunger generally moves between a first position that allows movement of the track fitting along the track and a second position in which the plunger engages one of the openings defined by the track, preventing further movement of the track fitting along the track.

Abstract: A crack stop for low K dielectric materials of an integrated circuit (IC) formed on an IC chip using metal interconnects which do not form a self-passivating oxide layer, such as copper or silver interconnects, in a low-K dielectric material to prevent damage to the active area of the IC chip caused by chipping and cracking formed along peripheral edges of the IC chip during a dicing operation. A moisture barrier or edge seal is formed as a metal stack positioned along the outer peripheral edges of the active area of the IC chip. The crack stop is formed by at least one trench or groove positioned outside of the moisture barrier/edge seal on the outer periphery of the IC chip.

Abstract: A crack stop for low K dielectric materials of an integrated circuit (IC) formed on an IC chip using metal interconnects which do not form a self-passivating oxide layer, such as copper or silver interconnects, in a low-K dielectric material to prevent damage to the active area of the IC chip caused by chipping and cracking formed along peripheral edges of the IC chip during a dicing operation. A moisture barrier or edge seal is formed as a metal stack positioned along the outer peripheral edges of the active area of the IC chip. The crack stop is formed by at least one trench or groove positioned outside of the moisture barrier/edge seal on the outer periphery of the IC chip.