Patents by Inventor Jeong Bong Lee

Jeong Bong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120120047
    Abstract: A power supply apparatus includes a storage battery, a power part and a solar battery part. The storage battery provides a charged voltage to an electronic device. The power part provides an external voltage to the electronic device and simultaneously charges the storage battery, upon determining that the external voltage is provided to the power supply apparatus. The solar battery part charges the storage battery using a voltage output by a solar battery upon determining that the external voltage is not provided to the power supply apparatus and the electronic device is not in use, and provides the voltage output by the solar battery and the charged voltage output by the storage battery to the electronic device, upon determining that the external voltage is not provided to the power supply apparatus and the electronic device is in use.
    Type: Application
    Filed: May 23, 2011
    Publication date: May 17, 2012
    Inventors: Kyung-Uk CHOI, Byeong-Doo KANG, Yong-Soon LEE, Seung-Hwan MOON, Young-Suk HA, Jeong-Bong LEE
  • Patent number: 7627938
    Abstract: The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: December 8, 2009
    Assignee: Board of Regents, The Univeristy of Texas System
    Inventors: Kabseog Kim, Jeong-Bong Lee
  • Patent number: 7283716
    Abstract: A device is described based on flexible photonic crystal, which is comprised of a periodic array of high index dielectric material embedded in a flexible polymer. Dynamic, real time tunability is achieved by the application of a variable force with a MEMS actuator or other means. The force induces changes in the crystal structure of the photonic crystal, and consequently modifies the photonic band structure. The concept was demonstrated by a theoretical investigation on the effect of mechanical stress on the anomalous refraction behavior of the flexible PC, and a very wide tunability in beam propagation direction was observed. Experimental studies on fabrication and characterizations of the flexible photonic crystal structures were also carried out. High quality flexible PC structures were fabricated by e-beam lithography and anisotropic etching processes.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: October 16, 2007
    Assignees: The Regents of the University of Colorado, The Board of Regents of the University of Texas System
    Inventors: Wounjhang Park, Jeong-Bong Lee, Mark T. Tinker, Ethan F. Schonbrun
  • Patent number: 7096568
    Abstract: A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: August 29, 2006
    Assignee: Zyvex Corporation
    Inventors: Erik Nilsen, Matthew D. Ellis, Charles L. Goldsmith, Jeong Bong Lee, Xiaojun Huang, Arun Kumar Nallani, Kabseog Kim, George D. Skidmore
  • Publication number: 20060084942
    Abstract: The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.
    Type: Application
    Filed: October 15, 2004
    Publication date: April 20, 2006
    Applicant: Board Of Regents, The University of Texas System
    Inventors: Kabseog Kim, Jeong-Bong Lee
  • Publication number: 20050117866
    Abstract: A device is described based on flexible photonic crystal, which is comprised of a periodic array of high index dielectric material embedded in a flexible polymer. Dynamic, real time tunability is achieved by the application of a variable force with a MEMS actuator or other means. The force induces changes in the crystal structure of the photonic crystal, and consequently modifies the photonic band structure. The concept was demonstrated by a theoretical investigation on the effect of mechanical stress on the anomalous refraction behavior of the flexible PC, and a very wide tunability in beam propagation direction was observed. Experimental studies on fabrication and characterizations of the flexible photonic crystal structures were also carried out. High quality flexible PC structures were fabricated by e-beam lithography and anisotropic etching processes.
    Type: Application
    Filed: October 20, 2004
    Publication date: June 2, 2005
    Inventors: Wounjhang Park, Jeong-Bong Lee, Mark Tinker, Ethan Schonbrun
  • Patent number: 6692680
    Abstract: Methods of rapidly prototyping microstructures such as HARMs are disclosed. A high precision process uses polymeric microstructure replication techniques and sacrificial layer etching techniques to mass produce high aspect ratio metallic and polymer micromold inserts. In one embodiment, after fabrication of an initial micromold insert, high aspect ratio replications are created by casting replication material, such as PDMS, directly onto the initial micromold insert. The replicated HARM is coated with a sacrificial layer and then electroplated to replicate another set of micromold inserts. After the electroplating process is completed, the sacrificial layer is etched away to release the replicated micromold inserts.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: February 17, 2004
    Assignee: Board of Supervisors of Louisiana State University and Agricultural and Mechanical College
    Inventors: Jeong-Bong Lee, Harish Manohara, Kabseog Kim, Sang-Won Park
  • Publication number: 20030062652
    Abstract: Methods of rapidly prototyping microstructures such as HARMs are disclosed. A high precision process uses polymeric microstructure replication techniques and sacrificial layer etching techniques to mass produce high aspect ratio metallic and polymer micromold inserts. In one embodiment, after fabrication of an initial micromold insert, high aspect ratio replications are created by casting replication material, such as PDMS, directly onto the initial micromold insert. The replicated HARM is coated with a sacrificial layer and then electroplated to replicate another set of micromold inserts. After the electroplating process is completed, the sacrificial layer is etched away to release the replicated micromold inserts.
    Type: Application
    Filed: October 3, 2001
    Publication date: April 3, 2003
    Inventors: Jeong-Bong Lee, Harish Manohara, Kabseog Kim, Sang-Won Park
  • Patent number: 6458618
    Abstract: The use of robust substrates on the surface micro-machined structures combines (1) the use of micro-machining technology; (2) the use of electronic packaging technologies; and (3) the use of conventional machining techniques to create a new class of micro-machined structures. A particular robust substrate-based micro-machine structure is a capacitive pressure sensor that includes a pressure sensitive diaphragm and an electrode.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: October 1, 2002
    Assignee: Georgia Tech Research Corporation
    Inventors: Mark G. Allen, Sung-Pil Chang, Jeong-Bong Lee