Patents by Inventor Jeong Bong PARK

Jeong Bong PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12125643
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, and a capacitance formation portion including first and second internal electrodes alternately disposed in a third direction with the dielectric layer interposed therebetween, the body including first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in the third direction, external electrodes disposed on the body, and a dummy electrode disposed to penetrate through the capacitance formation portion in the third direction.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: October 22, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Bong Park, Da Jeong Han
  • Publication number: 20240265932
    Abstract: One aspect of the present disclosure provides a method for automatically removing a background sound source of audio data of a video, including separating the audio data including at least one sound source component into a first component related to a human voice and a second component related to sounds other than the human voice using a first separation model, separating the first component into a vocal component and a speech component using a second separation model, separating the second component into a music component and a noise component using a third separation model, and generating an audio data with the background sound source for the audio data of the video removed by synthesizing the speech component and the noise component.
    Type: Application
    Filed: April 22, 2024
    Publication date: August 8, 2024
    Inventors: Dong Won KIM, Suk Bong KWON, Yong Hyun PARK, Jong Kil YUN, Jeong Yeon LIM
  • Publication number: 20230290574
    Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein the body includes a capacitance formation portion including the first and second internal electrodes, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction, the dielectric layer includes BaTiO3 and (Ba1-xCax)TiO3(0.01?x?0.15), and the cover portion includes BaTiO3, and in a cross-section of the body in the first and third directions, a ratio of an area occupied by pores in the cover portion is S1, and a ratio of an area occupied by pores in the dielectric layer of the capacitance formation portion is S2, S1<S2.
    Type: Application
    Filed: December 23, 2022
    Publication date: September 14, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Bong PARK, Han Bok LEE
  • Publication number: 20230178301
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, and a capacitance formation portion including first and second internal electrodes alternately disposed in a third direction with the dielectric layer interposed therebetween, the body including first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in the third direction, external electrodes disposed on the body, and a dummy electrode disposed to penetrate through the capacitance formation portion in the third direction.
    Type: Application
    Filed: April 8, 2022
    Publication date: June 8, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Bong Park, Da Jeong Han
  • Publication number: 20230113834
    Abstract: A multilayer electronic component includes: a body including a dielectric layer, first and second internal electrodes, alternately disposed with the dielectric layer disposed therebetween, first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first base electrode layer disposed on the third surface and including a first connection portion connected to the first internal electrode; a second base electrode layer disposed on the fourth surface and including a second connection portion connected to the second internal electrode; a first electrode layer disposed on a region including the third surface, the first surface, and the second surface, and formed to expose at least a portion of the first base electrode layer; and a second electrode layer disposed on a region in
    Type: Application
    Filed: October 4, 2022
    Publication date: April 13, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Bong PARK, Han Bok LEE, Da Jeong HAN, Hye Soo CHUNG
  • Patent number: 10748708
    Abstract: A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Bong Park, Se Hwan Bong, Mi Ok Park, Kyeong Jun Kim, Hang Kyu Cho
  • Patent number: 10580582
    Abstract: A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyeong Jun Kim, Se Hwan Bong, Mi Ok Park, Jeong Bong Park, Hang Kyu Cho
  • Publication number: 20190189351
    Abstract: A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.
    Type: Application
    Filed: May 8, 2018
    Publication date: June 20, 2019
    Inventors: Kyeong Jun KIM, Se Hwan BONG, Mi Ok PARK, Jeong Bong PARK, Hang Kyu CHO
  • Publication number: 20190157004
    Abstract: A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction.
    Type: Application
    Filed: June 8, 2018
    Publication date: May 23, 2019
    Inventors: Jeong Bong PARK, Se Hwan BONG, Mi Ok PARK, Kyeong Jun KIM, Hang Kyu CHO