Abstract: A system for droplet measurement includes an inkjet head including a nozzle which discharges droplets, a substrate on which droplets discharged from the nozzle of the inkjet head are dripped, a first detector disposed below the substrate and including a first camera and a first focusing structure, and a second detector disposed below the substrate and including a second camera and a second focusing structure.

Abstract: A system for droplet measurement includes an inkjet head including a nozzle which discharges droplets, a substrate on which droplets discharged from the nozzle of the inkjet head are dripped, a first detector disposed below the substrate and including a first camera and a first focusing structure, and a second detector disposed below the substrate and including a second camera and a second focusing structure.

Abstract: An inkjet print apparatus includes a print head discharging ink onto a substrate, the print head including a first heater; a reservoir storing the ink; a first pipe supplying the ink to the reservoir; a second pipe collecting surplus ink; a mixing unit located on the first pipe and mixing the ink; a pump located on the second pipe and pressurizing and supplying the surplus ink to the reservoir; a temperature sensor located between the mixing unit and the print head and sensing a temperature of the ink; and a controller controlling a temperature of at least one of the first heater and the second heater in response to information received from the temperature sensor. The print head includes a heat insulator blocking heat emitted from the first heater between the substrate and the first heater.

Abstract: An inkjet print apparatus includes a print head discharging ink onto a substrate, the print head including a first heater; a reservoir storing the ink; a first pipe supplying the ink to the reservoir; a second pipe collecting surplus ink; a mixing unit located on the first pipe and mixing the ink; a pump located on the second pipe and pressurizing and supplying the surplus ink to the reservoir; a temperature sensor located between the mixing unit and the print head and sensing a temperature of the ink; and a controller controlling a temperature of at least one of the first heater and the second heater in response to information received from the temperature sensor. The print head includes a heat insulator blocking heat emitted from the first heater between the substrate and the first heater.

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract: A phase change memory device may include a plurality of word lines, a plurality of bit lines, a phase change memory cell, and a discharging circuit. The word lines and the bit lines may intersect each other. The phase change memory cell may be positioned at an intersection point between the word lines and the bit lines. The discharging circuit may be configured to apply a ground voltage to a non-selected word line adjacent to a selected word line or a non-selected bit line adjacent to a selected bit line.

Abstract: A resistive memory apparatus includes a memory cell array, a local switch, and a global switch. The memory cell array may include a plurality of resistive memory cells coupled to a plurality of connection lines. The local switch may select a target connection line coupled to a target memory cell and a preset number of connection lines adjacent to the target connection line according to a signal obtained by decoding an address. The global switch may apply a preset level of voltage to the selected adjacent connection lines according to the signal obtained by decoding the address.

Abstract: A monomer vaporizing device and a method of controlling the same are disclosed. The monomer vaporizing device includes: a first vaporizer and a second vaporizer that receive a purge gas and vaporize a first monomer and a second monomer, respectively; a first flow pipe and a second flow pipe that are connected to the respective vaporizers and allow the first monomer and the second monomer, vaporized by the respective vaporizers, to flow therethrough; a transition tube that is connected to the first flow pipe and the second flow pipe and supplies at least one of the first monomer and the second monomer to a deposition chamber; and a control valve apparatus that regulates monomer flow into the deposition chamber. The device facilitates smooth and uninterrupted application of monomer to the interior of a deposition chamber.

Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract: A phase change memory device may include a plurality of word lines, a plurality of bit lines, a phase change memory cell, and a discharging circuit. The word lines and the bit lines may intersect each other. The phase change memory cell may be positioned at an intersection point between the word lines and the bit lines. The discharging circuit may be configured to apply a ground voltage to a non-selected word line adjacent to a selected word line or a non-selected bit line adjacent to a selected bit line.

Abstract: A vapor deposition apparatus includes a stage on which a substrate is mounted; a heater unit that is disposed at a side of the stage and includes a first heater and a second heater, wherein the first heater and the second heater are movable so that the first heater and the second heater are spaced apart from each other or are disposed adjacent to each other; and a nozzle unit that is disposed at a side opposite to the side at which the heater unit is disposed about the stage and includes one or more nozzles.

Abstract: A resistive memory apparatus includes a memory cell array, a local switch, and a global switch. The memory cell array may include a plurality of resistive memory cells coupled to a plurality of connection lines. The local switch may select a target connection line coupled to a target memory cell and a preset number of connection lines adjacent to the target connection line according to a signal obtained by decoding an address. The global switch may apply a preset level of voltage to the selected adjacent connection lines according to the signal obtained by decoding the address.

Abstract: An apparatus and method for manufacturing a thin film encapsulation includes: a first cluster configured to form a first inorganic layer on a display substrate using a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the display substrate using a monomer deposition process; and a third cluster configured to form a second inorganic layer on the first organic layer on the display substrate using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.

Abstract: A semiconductor integrated circuit device may include a first signal line, a second signal line, a variable resistance material layer, and a third signal line. The second signal line may be positioned coplanar with the first signal line. The second signal line may be parallel to the first signal line. The variable resistance material layer may include a horizontal region arranged on the first and second signal lines, and may include a vertical region extending upwardly from an end of the horizontal region. The third signal line may be positioned on a plane different from a plane on which the first and second signal lines may be positioned. The third signal line may be arranged on an end of the vertical region of the variable resistance material layer.

Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.

Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.

Abstract: A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.

Abstract: A monomer vaporizing device and a method of controlling the same are disclosed. The monomer vaporizing device includes: a first vaporizer and a second vaporizer that receive a purge gas and vaporize a first monomer and a second monomer, respectively; a first flow pipe and a second flow pipe that are connected to the respective vaporizers and allow the first monomer and the second monomer, vaporized by the respective vaporizers, to flow therethrough; a transition tube that is connected to the first flow pipe and the second flow pipe and supplies at least one of the first monomer and the second monomer to a deposition chamber; and a control valve apparatus that regulates monomer flow into the deposition chamber. The device facilitates smooth and uninterrupted application of monomer to the interior of a deposition chamber.