Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Abstract: A display device includes: a display panel which displays an image with light; a touch sensing unit which senses a touch thereto, provided on the display panel; a control board which provides a control signal to control the display panel and the touch sensing unit, provided outside the display panel and the touch sensing unit, the control board including a first conductive layer and a second conductive layer which is on the first conductive layer; a first coupling member which electrically couples the display panel with the first conductive layer of the control board; and a second coupling member which electrically couples the touch sensing unit with the second conductive layer of the control board.

Abstract: A display apparatus includes first and second substrates, a first side sealing layer, a ground connecting part, a flexible film, a driving circuit substrate, and a backlight assembly. The first substrate includes sides extending in a first and a second direction. The second substrate is disposed opposite to the first substrate and is larger in the second direction. The second substrate includes a thin film transistor, a ground wiring and first to fourth side surfaces. The first side sealing layer is disposed on the fourth side surface. The ground connecting part is disposed on the second substrate and is electrically connected to the ground wiring and the first side sealing layer. The flexible film is connected to the second substrate. The driving circuit substrate is connected to the flexible film. The backlight assembly is disposed between the driving circuit substrate and the first substrate.

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Abstract: Provided is a method of manufacturing a display apparatus. The method includes: preparing a printed circuit board including a first printed circuit unit and a second printed circuit unit; providing, on the printed circuit board, a connection member electrically connecting the first printed circuit unit to the second printed circuit unit; coupling one end of a tape carrier package to the printed circuit board; coupling the other end of the tape carrier package to a display panel; and cutting the printed circuit board into the first printed circuit unit and the second printed circuit unit that move relative to each other.

Abstract: A display apparatus includes first and second substrates, a first side sealing layer, a ground connecting part, a flexible film, a driving circuit substrate, and a backlight assembly. The first substrate includes sides extending in a first and a second direction. The second substrate is disposed opposite to the first substrate and is larger in the second direction. The second substrate includes a thin film transistor, a ground wiring and first to fourth side surfaces. The first side sealing layer is disposed on the fourth side surface. The ground connecting part is disposed on the second substrate and is electrically connected to the ground wiring and the first side sealing layer. The flexible film is connected to the second substrate. The driving circuit substrate is connected to the flexible film. The backlight assembly is disposed between the driving circuit substrate and the first substrate.

Abstract: Provided is a method of manufacturing a display apparatus. The method includes: preparing a printed circuit board including a first printed circuit unit and a second printed circuit unit; providing, on the printed circuit board, a connection member electrically connecting the first printed circuit unit to the second printed circuit unit; coupling one end of a tape carrier package to the printed circuit board; coupling the other end of the tape carrier package to a display panel; and cutting the printed circuit board into the first printed circuit unit and the second printed circuit unit that move relative to each other.

Abstract: A display device includes: a display panel which displays an image with light; a touch sensing unit which senses a touch thereto, provided on the display panel; a control board which provides a control signal to control the display panel and the touch sensing unit, provided outside the display panel and the touch sensing unit, the control board including a first conductive layer and a second conductive layer which is on the first conductive layer; a first coupling member which electrically couples the display panel with the first conductive layer of the control board; and a second coupling member which electrically couples the touch sensing unit with the second conductive layer of the control board.

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

Abstract: A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.

Abstract: A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.

Abstract: Provided is a method of manufacturing a display apparatus. The method includes: preparing a printed circuit board including a first printed circuit unit and a second printed circuit unit; providing, on the printed circuit board, a connection member electrically connecting the first printed circuit unit to the second printed circuit unit; coupling one end of a tape carrier package to the printed circuit board; coupling the other end of the tape carrier package to a display panel; and cutting the printed circuit board into the first printed circuit unit and the second printed circuit unit that move relative to each other.

Abstract: A wireless communication apparatus and method of driving a display device included in the wireless communication apparatus are disclosed. In one aspect, the method includes sequentially changing a clock control value to a plurality of predetermined set values. The clock control value is stored in a memory and is configured to control a driving clock signal of the display device. The method further includes measuring a plurality of reception sensitivities of the wireless communication apparatus with respect to each of the set values and determining an optimal set value of the set values corresponding to a present wireless communication condition based on the measured reception sensitivities. The method also includes storing the optimal set value in the memory as the clock control value.