Patents by Inventor Jeong Pil PARK

Jeong Pil PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9827799
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 28, 2017
    Assignee: Gwangju Institute of Science and Technology
    Inventors: Heung Cho Ko, Su Ok Yun, Jeong Pil Park, Suk Ho Kim, Young Kyu Hwang, Yujun Hyun, Hun Soo Jang, Yun Kyung Jeong
  • Publication number: 20140345794
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Application
    Filed: December 30, 2013
    Publication date: November 27, 2014
    Applicant: GWANGJU INSTITUTE OF SICENCE AND TECHNOLOGY
    Inventors: Heung Cho KO, Su Ok YUN, Jeong Pil PARK, Suk Ho KIM, Young Kyu HWANG, Yujun HYUN, Hun Soo JANG, Yun Kyung JEONG