Patents by Inventor Jeremy Joy Montalbo Incomio

Jeremy Joy Montalbo Incomio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9911628
    Abstract: For so called film assisted molding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: March 6, 2018
    Assignee: Ampleon Netherlands B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Publication number: 20170110343
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: December 28, 2016
    Publication date: April 20, 2017
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 9570323
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: February 14, 2017
    Assignee: Ampleon Netherlands B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Patent number: 9190350
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: November 17, 2015
    Assignee: NXP B.V.
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Publication number: 20150084174
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 26, 2015
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
  • Publication number: 20150084175
    Abstract: For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 26, 2015
    Inventors: Freek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs