Patents by Inventor Jerome B. Klatskin

Jerome B. Klatskin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4384400
    Abstract: Disclosed is an array of avalanche diodes and its method of manufacture which results in plural pairs of series connected mesa-etched avalanche (TRAPATT) diodes being selectively connected in parallel by metallized air bridges for increasing the impedance level and thereby the peak and average power level available from microwave oscillators and amplifiers configured therefrom. The various series connected diodes are placed in near proximity to respective neighboring diode pairs to reduce parasitics but at the same time the spacing is made sufficiently large to prevent thermal spreading of one diode pair to overlap that of the adjacent diode pair. The metallized air bridges in addition to providing a low inductance interconnection, provide an integrated heat capacitance which is necessary for high power operation.
    Type: Grant
    Filed: October 7, 1981
    Date of Patent: May 24, 1983
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Arye Rosen, Jerome B. Klatskin
  • Patent number: 4319265
    Abstract: Disclosed is an array of avalanche diodes and its method of manufacture wh results in plural pairs of series connected mesa-etched avalanche (TRAPATT) diodes being selectively connected in parallel by metallized air bridges for increasing the impedance level and thereby the peak and average power level available from microwave oscillators and amplifiers configured therefrom. The various series connected diodes are placed in near proximity to respective neighboring diode pairs to reduce parasitics but at the same time the spacing is made sufficiently large to prevent thermal spreading of one diode pair to overlap that of the adjacent diode pair. The metallized air bridges in addition to providing a low inductance interconnection, provide an integrated heat capacitance which is necessary for high power operation.
    Type: Grant
    Filed: December 6, 1979
    Date of Patent: March 9, 1982
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Arye Rosen, Jerome B. Klatskin