Patents by Inventor Jesse Michael Zamarron

Jesse Michael Zamarron has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for impedance balancing of long radio frequency (RF) via
    Patent number: 11564316
    Abstract: An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: January 24, 2023
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventor: Jesse Michael Zamarron
  • APPARATUS AND METHOD FOR IMPEDANCE BALANCING OF LONG RADIO FREQUENCY (RF) VIA
    Publication number: 20220053640
    Abstract: An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.
    Type: Application
    Filed: November 21, 2019
    Publication date: February 17, 2022
    Inventor: Jesse Michael Zamarron