Patents by Inventor Je Sung KOH

Je Sung KOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deformation sensing flexible substrate using pattern formed of conductive material
    Patent number: 9699894
    Abstract: Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: July 4, 2017
    Assignee: Seoul National University R&DB Foundation
    Inventors: Maenghyo Cho, Kyu Jin Cho, Junghyun Ryu, Je Sung Koh, Jong Gu Lee
  • DEFORMATION SENSING FLEXIBLE SUBSTRATE USING PATTERN FORMED OF CONDUCTIVE MATERIAL
    Publication number: 20170048965
    Abstract: Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.
    Type: Application
    Filed: March 11, 2015
    Publication date: February 16, 2017
    Applicant: Seoul National University R&DB Foundation
    Inventors: Maenghyo CHO, Kyu Jin CHO, Junghyun RYU, Je Sung KOH, Jong Gu LEE