Patents by Inventor Ji-Eun Myung

Ji-Eun Myung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962001
    Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Industry Academy Cooperation Foundation of Sejong University
    Inventors: Seung Min Oh, Jun Ki Rhee, Yoon Sung Lee, Ji Eun Lee, Sung Ho Ban, Ko Eun Kim, Woo Young Jin, Sang Mok Park, Sang Hun Lee, Seung Taek Myung, Hee Jae Kim, Min Young Shin
  • Patent number: 11178730
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: November 16, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang
  • Patent number: 11026298
    Abstract: The present specification relates to an ink composition, a cured pattern prepared using an ink composition, a heating element including a cured pattern, and a method for manufacturing a heating element.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: June 1, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Jooyeon Kim, Yong Goo Son, Seung Heon Lee, Jiehyun Seong, Ji Eun Myung, Kiseok Lee
  • Patent number: 10964445
    Abstract: The present disclosure relates to a method for manufacturing a heating element, which includes the steps of: preparing a first bonding film; forming a conductive heating pattern on the first bonding film; and laminating a second bonding film and a transparent substrate on the first bonding film, where the second bonding film is disposed on a surface opposite to the surface provided with the conductive heating pattern of the first bonding film, and the conductive heating pattern is formed by using an adhesive film having an adhesive strength decrement of 30% or greater by an external stimulus based on adhesive strength before the external stimulus.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: March 30, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ji Eun Myung, Jooyeon Kim, Seung Heon Lee, Jiehyun Seong, Kiseok Lee
  • Patent number: 10796818
    Abstract: The present specification relates to a heating element and a method for manufacturing the same.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: October 6, 2020
    Assignee: LG CHEM., LTD.
    Inventors: Ji Eun Myung, Sera Kim, Jooyeon Kim, Chang Yoon Lim, Seung Heon Lee, Mun Seop Song, Kwang Joo Lee, Ji Young Hwang
  • Publication number: 20200296804
    Abstract: The present invention relates to a heating element and a method for manufacturing same, and more specifically, a method for manufacturing a heating element is provided, the method for manufacturing a heating element, according to one embodiment of the present invention, comprising the steps of: preparing an adhesive film; and forming a conductive heating pattern on the adhesive film, wherein the adhesive film has a rate of adhesive force reduction due to an external stimulus of at least 30% with respect to the adhesive force thereof prior to the application of an external stimulus.
    Type: Application
    Filed: December 23, 2016
    Publication date: September 17, 2020
    Inventor: Ji Eun MYUNG
  • Patent number: 10606175
    Abstract: The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: March 31, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yong Goo Son, Seung Heon Lee, Han Min Seo, Chang Yoon Lim, Ji Eun Myung, Kiseok Lee
  • Patent number: 10512171
    Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: December 17, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Hye Won Jeong, Bo Ra Shin, Kyungjun Kim, Ji Eun Myung, Yong Goo Son
  • Publication number: 20190098706
    Abstract: The present specification relates to an ink composition, a cured pattern prepared using an ink composition, a heating element including a cured pattern, and a method for manufacturing a heating element.
    Type: Application
    Filed: December 23, 2016
    Publication date: March 28, 2019
    Inventors: Jooyeon KIM, Yong Goo SON, Seung Heon LEE, Jiehyun SEONG, Ji Eun MYUNG, Kiseok LEE
  • Publication number: 20190080820
    Abstract: The present invention relates to a heating element and a method for manufacturing same, and more specifically, a heating element and a method for manufacturing same is provided, the heating element comprising: an adhesive film; and a conductive heating pattern provided on the adhesive film, wherein the adhesive film has a rate of adhesive force reduction due to an external stimulus of at least 30% with respect to the adhesive force thereof prior to the application of an external stimulus.
    Type: Application
    Filed: December 23, 2016
    Publication date: March 14, 2019
    Inventors: Ji Eun MYUNG, Sera KIM, Jooyeon KIM, Chang Yoon LIM, Seung Heon LEE, Mun Seop SONG, Kwang Joo LEE, Ji Young HWANG
  • Publication number: 20190074105
    Abstract: The present invention relates to a heating element and a manufacturing method therefor. More specifically, according to one embodiment of the present invention, provided is a method for manufacturing a heating element, comprising the steps of: preparing an adhesive film; forming conductive heating patterns on the adhesive film; and laminating a transparent substrate on at least one surface of the adhesive film having the conductive heating patterns.
    Type: Application
    Filed: December 23, 2016
    Publication date: March 7, 2019
    Inventors: Ji Eun MYUNG, Jooyeon KIM, Seung Heon LEE, Jiehyun SEONG, Kiseok LEE
  • Patent number: 10150321
    Abstract: The present specification provides a blanket for printing and a method for manufacturing the same.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: December 11, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Jooyeon Kim, Boem Mo Koo, Seung Heon Lee, Ji Eun Myung
  • Publication number: 20180196346
    Abstract: The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 12, 2018
    Inventors: Yong Goo SON, Seung Heon LEE, Han Min SEO, Chang Yoon LIM, Ji Eun MYUNG, Kiseok LEE
  • Patent number: 9868868
    Abstract: The present specification relates to an offset printing composition, a printing method using the same, and a pattern including the offset printing composition.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 16, 2018
    Assignee: LG CHEM, LTD.
    Inventors: Yong Goo Son, Jooyeon Kim, Seung Heon Lee, Han Min Seo, Ji Eun Myung
  • Publication number: 20180007799
    Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.
    Type: Application
    Filed: June 8, 2016
    Publication date: January 4, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Hye Won JEONG, Bo Ra SHIN, Kyungjun KIM, Ji Eun MYUNG, Yong Goo SON
  • Publication number: 20160340527
    Abstract: The present specification relates to an offset printing composition, a printing method using the same, and a pattern including the offset printing composition.
    Type: Application
    Filed: March 6, 2015
    Publication date: November 24, 2016
    Inventors: Yong Goo SON, Jooyeon KIM, Seung Heon LEE, Ha Min SEO, ji Eun MYUNG
  • Patent number: 9433111
    Abstract: A display apparatus comprises a main body including a touch screen disposed on a front surface thereof; an accessory unit rotatably disposed with respect to the main body; a connecting rod disposed in a side surface of one of the main body and the accessory unit; and a connecting channel disposed in a side surface of the other of the accessory unit and the main body, the connecting channel being formed so that the connecting rod is inserted in or separated from the connecting channel in a lengthwise direction thereof.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: August 30, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Ji-eun Myung
  • Publication number: 20160243873
    Abstract: The present specification provides a blanket for printing and a method for manufacturing the same.
    Type: Application
    Filed: November 19, 2014
    Publication date: August 25, 2016
    Inventors: Jooyeon KIM, Boem Mo KOO, Seung Heon LEE, Ji Eun MYUNG
  • Patent number: D784344
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: April 18, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Eun Myung, Sang-Won Yoon, Jun-Se Kim, Son-young Lee
  • Patent number: D844580
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: April 2, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Sang Park, Ji-Eun Myung, Jae-Woong Chung, Do-Hyung Ha