Patents by Inventor Ji Hye Han
Ji Hye Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11943994Abstract: A display device and a method of manufacturing the same are provided. The display device, comprises a first base substrate, a first barrier layer disposed on the first base substrate, a second base substrate disposed on the first barrier layer, at least one transistor disposed on the second base substrate, and an organic light emitting diode disposed on the at least one transistor, wherein the first barrier layer includes a silicon oxide, and has an adhesion force of 200 gf/inch or more to the second base substrate.Type: GrantFiled: August 17, 2021Date of Patent: March 26, 2024Assignee: Samsung Display Co., Ltd.Inventors: Chul Min Bae, Eun Jin Kwak, Jin Suk Lee, Jung Yun Jo, Ji Hye Han, Young In Hwang
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Publication number: 20240065030Abstract: A display device includes a substrate including pixels; a buffer layer disposed on the substrate; an etch stopper layer disposed between the substrate and the buffer layer; and at least one penetrating-hole penetrating the substrate, the buffer layer, and the etch stopper layer, wherein the etch stopper layer includes amorphous carbon.Type: ApplicationFiled: November 3, 2023Publication date: February 22, 2024Applicant: Samsung Display Co., LTD.Inventors: Jung Yun JO, Ji Hye HAN
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Publication number: 20240043797Abstract: The present disclosure relates to a method for mass production of extracellular vesicles by using a noxa protein-derived peptide and mesenchymal stem cells and, more specifically, to a method for mass production of extracellular vesicles having wound healing and immunomodulatory effects, wherein mesenchymal stem cells are cultured in a medium composition containing a noxa protein-derived peptide, glucose, sucrose, and 3-(N-morpholino)propanesulfonic acid [MOPS], whereby the extracellular vesicles can be obtained at high yield with high purity.Type: ApplicationFiled: December 10, 2021Publication date: February 8, 2024Inventors: Tae-Hyoung KIM, Jung Hee PARK, Ji-Hye HAN, Seung-Hyun MYUNG, Ssang-Goo CHO, Kyung Min LIM, Yoon Joo LEE
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Patent number: 11849606Abstract: A display device includes a substrate including pixels; a buffer layer disposed on the substrate; an etch stopper layer disposed between the substrate and the buffer layer; and at least one penetrating-hole penetrating the substrate, the buffer layer, and the etch stopper layer, wherein the etch stopper layer includes amorphous carbon.Type: GrantFiled: June 16, 2021Date of Patent: December 19, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jung Yun Jo, Ji Hye Han
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Patent number: 11823844Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.Type: GrantFiled: January 10, 2022Date of Patent: November 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
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Patent number: 11817267Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.Type: GrantFiled: April 4, 2022Date of Patent: November 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo Kang, Bon Seok Koo, Jung Min Kim, Ji Hye Han, Hye Jin Park, Sang Wook Lee, Hong Je Choi
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Patent number: 11817251Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.Type: GrantFiled: October 29, 2021Date of Patent: November 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
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Patent number: 11817269Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.Type: GrantFiled: May 18, 2022Date of Patent: November 14, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
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Patent number: 11804332Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.Type: GrantFiled: February 4, 2022Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Jin Park, Bon Seok Koo, Jung Min Kim, Hong Je Choi, Byung Woo Kang, Ji Hye Han, Sang Wook Lee
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Publication number: 20230290572Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.Type: ApplicationFiled: May 17, 2023Publication date: September 14, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
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Publication number: 20230282420Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in the first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, a first external electrode including a first base electrode layer including glass and Ni and disposed on the third surface, a first intermediate electrode layer including an alloy containing Sn and Ni and disposed on the first base electrode layer, and a first conductive resin layer including a resin and a metal and disposed on the first intermediate electrode layer and extending to the first and second surfaces, a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second base electrode layer, and a second conductive resin layer disposed on the second intermediate electrode layer.Type: ApplicationFiled: January 4, 2023Publication date: September 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kangha Lee, Yoona Park, Jinsoo Park, Wookyung Sung, Eunme Park, Jung Min Kim, Ji Hye Han, Jong Ho Lee
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Patent number: 11694844Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.Type: GrantFiled: May 5, 2021Date of Patent: July 4, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
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Publication number: 20230197344Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.Type: ApplicationFiled: November 1, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye Han, Jung Min Kim, Hong Je Choi, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo
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Publication number: 20230197853Abstract: A display device includes a buffer layer disposed on a substrate and comprising a first buffer film, and a second buffer film, wherein the first buffer film and the second buffer film are sequentially stacked in a thickness direction of the display device; a semiconductor pattern disposed on the buffer layer; a gate insulating layer disposed on the semiconductor pattern; and a gate electrode disposed on the gate insulating layer, wherein the first buffer film and the second buffer film comprise a same material, and a density of the first buffer film is greater than a density of the second buffer film.Type: ApplicationFiled: February 14, 2023Publication date: June 22, 2023Applicant: Samsung Display Co., LTD.Inventors: Ji Hye HAN, Jung Yun JO, Chul Min BAE
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Publication number: 20230172908Abstract: The present inventive concept relates to a pharmaceutical composition for prevention or treatment of fibrosis or a health functional food composition for prevention or alleviation of fibrosis, each composition containing a 1H-pyrazole-3-amide-based compound or a pharmaceutically acceptable salt thereof as an active ingredient. The compound exhibits a fibrosis mitigation effect in fibrosis-induced mouse models, and thus the compositions containing the compound as an active ingredient can be favorably utilized for prevention or treatment of fibrosis.Type: ApplicationFiled: September 12, 2018Publication date: June 8, 2023Inventors: Wook KIM, Sung-Hwa YOON, Ji Hye HAN, Han Ho SHIN, Ju-Young PARK
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Publication number: 20230170146Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.Type: ApplicationFiled: May 18, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
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Publication number: 20230170147Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.Type: ApplicationFiled: February 4, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Jin PARK, Bon Seok KOO, Jung Min KIM, Hong Je CHOI, Byung Woo KANG, Ji Hye HAN, Sang Wook LEE
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Patent number: 11649544Abstract: A method for depositing a large-area graphene layer and an apparatus for continuous graphene deposition using the same are disclosed. The method can include forming a titanium (Ti) layer on a substrate by sputtering, reducing the titanium layer by spraying a reductant gas containing a hydrogen gas (H2) and a purge gas onto the titanium layer while moving in a first direction in relation to the substrate and exhausting the reductant gas and the purge gas. The method can also include forming graphene by spraying a reactant gas containing a graphene source and the purge gas onto the titanium layer while moving in a second direction opposite the first direction in relation to the substrate and exhausting the reactant gas and the purge gas.Type: GrantFiled: December 9, 2020Date of Patent: May 16, 2023Assignee: KUK-IL GRAPHENE CO., LTDInventors: Dong Ho Yoon, Chul Kyu Song, Ji Hye Han, Soon Gil Yoon, Ji Ho Eom
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Publication number: 20230135148Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.Type: ApplicationFiled: April 4, 2022Publication date: May 4, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo KANG, Bon Seok KOO, Jung Min KIM, Ji Hye HAN, Hye Jin PARK, Sang Wook LEE, Hong Je CHOI
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Publication number: 20230119122Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.Type: ApplicationFiled: February 28, 2022Publication date: April 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye HAN, Jung Min KIM, Byung Woo KANG, Hong Je CHOI, Hye Jin PARK, Sang Wook LEE, Bon Seok KOO, Jung Won LEE