Abstract: An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.

Abstract: A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.

Abstract: A current mode logic circuit which is implemented with metal-semiconductor field effect transistors (MESFETs) has a triggering circuit which produces hysteresis in the output of the circuit. That is, the output switches abruptly after the input has almost completed a corresponding transition from one logical output to another in a manner characteristic of triggering circuits such as Schmidt triggers. A triggering voltage is generated in response to one of two complementary outputs by triggering transistors configured as a current switch. The triggering voltage delays switching of a logic switching circuit which produces the two outputs which are a logical or boolean function of the input or inputs. The MESFETs are implemented in gallium arsenide technologies and output is equal to the inverted input.

Abstract: A semiconductor buffer circuit and buffering method for driving capacitive loads that enhances the current sinking and sourcing drive characteristics at times when the input signal is changing. Two transistors are used, a source follower and a current source pull-down, with an input signal applied to the control input of the source follower transistor. The complement of the input signal is capacitively coupled to the control input of the current source pull-down transistor. As a result, changes in the input voltage increase or decrease the conductivity of the current source pull-down transistor, thereby allowing the capacitive load to be charged and discharged more efficiently.