Abstract: The present disclosure provides a method for preparing a high cohesive energy adsorbent for fluoride removal, which includes the following steps: S1. adding NaHF2—NiF·6H2O additive to SiCO ceramic powder, and sintering at a temperature of 310-330° C. for 18-22h to obtain a sintered substance; S2. grinding the sintered substance to obtain particles with a size of 2-3 mm, and mixing the particles with polyacrylonitrile to form a composite polymer; and S3. molding the composite polymer by a vacuum baking process at a temperature of 75-85° C., then performing ball milling and sieving to obtain the high cohesive energy adsorbent for fluoride removal. The high cohesive energy adsorbent for fluoride removal may be used in the adsorption and separation of the C2F6—CHF3—CClF3 mixture system, and the contents of CHF3 and CClF3 are lowered to less than 10ppmv.

Abstract: The present disclosure provides a method for preparing a high cohesive energy adsorbent for fluoride removal, which includes the following steps: S1. adding NaHF2—NiF·6H2O additive to SiCO ceramic powder, and sintering at a temperature of 310-330° C. for 18-22h to obtain a sintered substance; S2. grinding the sintered substance to obtain particles with a size of 2-3 mm, and mixing the particles with polyacrylonitrile to form a composite polymer; and S3. molding the composite polymer by a vacuum baking process at a temperature of 75-85° C., then performing ball milling and sieving to obtain the high cohesive energy adsorbent for fluoride removal. The high cohesive energy adsorbent for fluoride removal may be used in the adsorption and separation of the C2F6—CHF3—CClF3 mixture system, and the contents of CHF3 and CClF3 are lowered to less than 10ppmv.

Abstract: The invention provides a slim type packaging structure with high heat dissipation, which is to provide a hole on the surface of a substrate, and then a die is placed inside the hole. Besides, a plurality of wire is separately connected from the die to the substrate. Alternatively, a heat-dissipating panel with good conductivity can be placed inside the hole, and then the die is placed on the heat-dissipating panel. Thus, after the substrate is soldered on the circuit board, a direct heat-dissipating path can be formed between the die and the circuit board; therefore, the die can dissipate heat without passing through the substrate. Hence, the slim type packaging structure with high heat dissipation provided by the invention can achieve double effects of good heat dissipation and package volume slimming as well as have the advantages of low cost and simple design.

Abstract: The present invention proposes a heat spreader for a ball grid array package. In a ball grid array package, a chip is attached to a first surface of a substrate by adhesives. Bonding areas on the first surface of the substrate adjoining to where the chip is attached are connected to the chip through metal leads. Solder balls formed on the first surface of the substrate are soldered to another device such as a motherboard. A metal heat spreader having a protuberance covers on the chip. The protuberance of the heat spreader contacts the chip to enhance the heat dissipating effect of the chip.

Abstract: The present invention discloses a heat sink for enhancing heat dissipation efficiency of an electronic device. The heat sink includes a base for accommodating at least an electronic device, a dissipation plate overlaid on the base for absorbing and dissipating heat generated by the electronic device, and a fan for generating airflow. A side wall of the base is formed with at least an air duct for guiding the airflow generated by the fan through a bottom of the electronic device, thereby enhancing heat dissipation efficiency of the electronic device.

Abstract: An electronic device cooling arrangement includes a heat sink bonded to a substrate above a chip on the substrate, the heat sink having a mounting section bonded to the substrate, a face panel section suspended above the chip and defining a tapered center through hole, and a supporting frame section connected between the face panel section and the mounting section, and a tapered heat conductive block mounted in the tapered center through hole and bonded to the chip for quick dissipation of heat from the chip.